SOT23-5 WAVE SOLDERING Search Results

reflow profile 00802

Abstract: sod323 reflow sod323 wave soldering
Contextual Info: SIEM EN S Notes on Processing Table 1 Solderability Test to Siemens Standard Test criterion Solder bath temperature °C Dwell time in bath s Components for wave and reflow soldering Wetting 215 ± 3 3 ±0.3 Dewetting and leaching 260 ± 5 30 ±1 Components for reflow soldering only

sot59

Contextual Info: Philips Sem iconductors Small-signal Transistors General M O U NTIN G AND SOLDERING Screen printing M ounting m ethods This is the best high-volum e production m ethod of solder paste application. An em ulsion-coated, fine mesh screen with apertures etched in the emulsion to coincide with the

TVS15VESGP

Contextual Info: CHENMKO ENTERPRISE CO.,LTD TVS15VESGP STANDARD CAPACITANCE TVS VOLTAGE 15 V 200 WATTS PEAK PULSE POWER FEATURES *Undirectional * Low leakage current *Protects one power or I/O port * High temperature soldering guaranteed : 260oC/10 seconds at terminals *ESD per HBM : 10 KV

Zener S 118

Abstract: MMBZ5243BPT MMBZ5222BPT ZENER DIODES SOT-23 182 MMBZ5241BPT MMBZ5246BPT zener diode 182 Zener Diode SOT-23 MMBZ5256BPT MMBZ5228BPT
Contextual Info: MMBZ5221BPT CHENMKO ENTERPRISE CO.,LTD THRU SURFACE MOUNT ZENER SILICON PLANAR POWER ZENER DIODES VOLTAGE RANGE 2.4V TO 91V MMBZ5270BPT FEATURE Small surface mounting type. SOT-23 High temperature soldering type. ESD rating of class 3(>16 kV) per human body model.

MMBZ5243BPT

Abstract: MMBZ5241BPT MMBZ5248BPT MMBZ5256BPT ZENER DIODES SOT-23 182 MMBZ5250BPT MMBZ5247BPT MMBZ5224BPT MMBZ5226BPT MMBZ5242BPT
Contextual Info: MMBZ5221BPT CHENMKO ENTERPRISE CO.,LTD THRU SURFACE MOUNT ZENER SILICON PLANAR POWER ZENER DIODES VOLTAGE RANGE 2.4V TO 91V MMBZ5270BPT FEATURE Small surface mounting type. SOT-23 High temperature soldering type. ESD rating of class 3(>16 kV) per human body model.

MMBZ5221BGP

Abstract: MMBZ5222BGP MMBZ5223BGP MMBZ5224BGP MMBZ5225BGP MMBZ5226BGP MMBZ5227BGP MMBZ5228BGP MMBZ5229BGP MMBZ5230BGP
Contextual Info: MMBZ5221BGP CHENMKO ENTERPRISE CO.,LTD THRU SURFACE MOUNT ZENER SILICON PLANAR POWER ZENER DIODES VOLTAGE RANGE 2.4V TO 91V MMBZ5270BGP FEATURE Small surface mounting type. SOT-23 High temperature soldering type. ESD rating of class 3(>16 kV) per human body model.

MMBZ5221JGP

Abstract: MMBZ5222JGP MMBZ5223JGP MMBZ5224JGP MMBZ5225JGP MMBZ5226JGP MMBZ5227JGP MMBZ5228JGP MMBZ5229JGP MMBZ5230JGP
Contextual Info: MMBZ5221JGP CHENMKO ENTERPRISE CO.,LTD THRU SURFACE MOUNT ZENER SILICON PLANAR POWER ZENER DIODES VOLTAGE RANGE 2.4V TO 91V MMBZ5270JGP FEATURE Small surface mounting type. SOT-23 High temperature soldering type. ESD rating of class 3(>16 kV) per human body model.

bc 339

Contextual Info: Philips Semiconductors RF Wideband Transistors General section MOUNTING AND SOLDERING Screen printing Mounting methods This Is the best high-voiume production method of solder paste application. An emulsion-coated, fine mesh screen with apertures etched in the emulsion to coincide with the

CHPZ9V1GP

Abstract: CHPZ10VGP CHPZ11VGP CHPZ12VGP CHPZ13VGP CHPZ14VGP CHPZ15VGP CHPZ16VGP CHPZ17VGP CHPZ18VGP
Contextual Info: CHPZ3V6GP CHENMKO ENTERPRISE CO.,LTD THRU SURFACE MOUNT ZENER SILICON PLANAR POWER ZENER DIODES VOLTAGE RANGE 3.6V TO 33V CHPZ33VGP FEATURE High temperature soldering type. ESD rating of class 3 >16 kV per human body model. Silicon planar zener diodes. Silcon-oxide passivated junction.

zener 12V 400 mW

Abstract: CHPZ6V2 dual zener ZENER 15.2 Zener Diode SOT-23 1.2V zener diodes CHPZ14VPT dual zener common anode CHPZ19VPT
Contextual Info: CHPZ3V6PT CHENMKO ENTERPRISE CO.,LTD THRU SURFACE MOUNT ZENER SILICON PLANAR POWER ZENER DIODES VOLTAGE RANGE 3.6V TO 33V CHPZ33VPT FEATURE High temperature soldering type. ESD rating of class 3 >16 kV per human body model. Silicon planar zener diodes. Silcon-oxide passivated junction.

CHBZ9V1BGP

Abstract: CHBZ10BGP CHBZ11BGP CHBZ12BGP CHBZ13BGP CHBZ14BGP CHBZ15BGP CHBZ16BGP CHBZ17BGP CHBZ18BGP
Contextual Info: CHBZ2V4BGP CHENMKO ENTERPRISE CO.,LTD THRU SURFACE MOUNT ZENER DUAL SILICON PLANAR POWER ZENER DIODES VOLTAGE RANGE 2.4V TO 51V CHBZ51BGP FEATURE High temperature soldering type. ESD rating of class 3 >16 kV per human body model. Silicon planar zener diodes.

Contextual Info: Philips Semiconductors General Small-signal Field-effect Transistors MOUNTING AND SOLDERING Screen printing Mounting methods This is the best high-volume production method of solder paste application. An emulsion-coated, fine mesh screen with apertures etched in the emulsion to coincide with the

SOD110 footprint

Abstract: MSA430 SOD523 footprint MSA428 sot23 footprint SC-76 flux. PHILIPS AN-450 surface mounting methods
Contextual Info: Philips Semiconductors Mounting and Soldering General MOUNTING AND SOLDERING Screen printing Mounting methods This is the best high-volume production method of solder paste application. An emulsion-coated, fine mesh screen with apertures etched in the emulsion to coincide with the

MMBZ5221SGP

Abstract: MMBZ5222SGP MMBZ5223SGP MMBZ5224SGP MMBZ5225SGP MMBZ5226SGP MMBZ5227SGP MMBZ5228SGP MMBZ5229SGP MMBZ5230SGP
Contextual Info: MMBZ5221SGP CHENMKO ENTERPRISE CO.,LTD THRU SURFACE MOUNT ZENER SILICON PLANAR POWER ZENER DIODES VOLTAGE RANGE 2.4V TO 91V MMBZ5270SGP FEATURE Small surface mounting type. SOT-23 High temperature soldering type. ESD rating of class 3(>16 kV) per human body model.

qfp 32 land pattern

Abstract: SSOP16 SSOP24
Contextual Info: Philips Semiconductors PowerMOS transistors Mounting and soldering MOUNTING AND SOLDERING Page INTRODUCTION LEADED DEVICES Handling Soldering GENERAL DATA AND INSTRUCTIONS FOR THE SOT186A; SOT263; TO 220AB General rules Mounting methods Heatsink requirements

ssop24 footprint

Abstract: PowerMos transistors TO220 package SSOP16 SSOP24 SSOP24 300 1 footprint sot89 stencil
Contextual Info: DISCRETE SEMICONDUCTORS Mounting and soldering PowerMOS transistors 1998 Dec 02 Philips Semiconductors PowerMOS transistors Mounting and soldering MOUNTING AND SOLDERING Page INTRODUCTION LEADED DEVICES Handling Soldering GENERAL DATA AND INSTRUCTIONS FOR THE

SOD80 footprint

Abstract: SOD87 footprint Soldering guidelines and SMD footprint design SMD footprint design SOD106 land pattern land pattern sot346 SOD110 footprint SOD87 footprint pcb MLC745 smd footprint
Contextual Info: DISCRETE SEMICONDUCTORS DATA SHEET Chapter 4 Soldering guidelines and SMD footprint design Discrete Semiconductor Packages File under Discrete Semiconductors, SC18 July 1997 Philips Semiconductors Discrete Semiconductor Packages Soldering guidelines and SMD

SOD80 footprint

Abstract: SOD87 footprint land pattern sot346 SOD110 footprint SOD106 land pattern sod110 land do-41 footprint MSA435 DO-35 land pattern how epoxy can contribute to meniscus
Contextual Info: SECTION 17 MOUNTING AND SOLDERING contents page INTRODUCTION 17 - 2 AXIAL AND RADIAL LEADED DEVICES 17 - 2 Handling 17 - 2 Soldering 17 - 2 Mounting 17 - 3 SURFACE-MOUNT DEVICES 17 - 3 Reflow soldering process 17 - 3 Double-wave soldering process 17 - 7 Hand soldering of microminiature components

sod323 wave soldering

Abstract: sod323 reflow reflow profile 00802 sot363 wave soldering HLG05516 HLG05517 HLG05520 HLG05521 HLG05818 HLG05820
Contextual Info: Notes on Processing Component Placement HLG0 5414 The ability to place semiconductors depends very much on the type involved. Up to a pitch size of 1.27 mm, mechanical centering by tools of an automatic component placement machine suffices, e.g. jaws and centering units. Multiple-pin ICs have to be placed

Contextual Info: Recommended Soldering Profiles Wave Soldering 1. 2. For Through Hole Packages, only the leads of the device are immersed in the wave solder. For specified Surface Mount Packages, the entire device is immersed in the wave solder. See Table 1. Wave Solder Ramp Up ˚C/sec

Sony Semiconductor Replacement Handbook 1991

Abstract: 2sc5088 horizontal transistors tcxo philips 4322 20000w audio amplifier circuit diagram replacement for 2sc5088 horizontal transistors motorola power fet rf databook 2SK170BL Funkamateur transistor 1060 schematic diagram tv sony
Contextual Info: Philips RF Manual product & design manual for RF small signal discretes 3 edition July 2003 rd / discretes/documentation/rf_manual Document number: 4322 252 06384 Date of release: July 2003 3rd edition

Contextual Info: Recommended Soldering Profiles Wave Soldering 1. 2. For Through Hole Packages, only the leads of the device are immersed in the wave solder. For specified Surface Mount Packages, the entire device is immersed in the wave solder. See Table 1. Wave Solder Ramp Up ˚C/sec

Contextual Info: Recommended Soldering Profiles Wave Soldering 1. For Through Hole Packages, only the leads of the device are immersed in the wave solder. 2. For specified Surface Mount Packages, the entire device is immersed in the wave solder. See Table 1. Wave Solder Ramp Up ˚C/sec

SOD87 footprint

Abstract: Soldering guidelines and SMD footprint design sot3391h SOT-34 MSA460 MSA439 SOT343R footprint
Contextual Info: SC18_1999_.book : SC18_CHAPTER_4_1999 1 Wed May 12 11:40:55 1999 CHAPTER 4 SOLDERING GUIDELINES AND SMD FOOTPRINT DESIGN page Introduction 4-2 Axial and radial leaded devices 4-2 Surface-mount devices 4-3 Recommended footprints 4 - 14 SC18_1999_.book : SC18_CHAPTER_4_1999