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    SOT355-1 Search Results

    SOT355-1 Datasheets (4)

    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    SOT355-1
    NXP Semiconductors Footprint for reflow soldering Original PDF 16.86KB 2
    SOT355-1
    NXP Semiconductors Plastic thin shrink small outline package; 24 leads; body width 4.4 mm Original PDF 229.23KB 1
    SOT355-1
    NXP Semiconductors Footprint for reflow soldering SOT355-1 Original PDF 10.65KB 1
    SOT355-1_118
    NXP Semiconductors TSSOP24; Reel pack; SMD, 13"Q1/T1 Standard product orientationOrderable part number ending ,118 or JOrdering code (12NC) ending 118 Original PDF 231.05KB 4