SOT411 PACKAGE Search Results

SOT411 PACKAGE Result Highlights (5)

Part	ECAD Model	Manufacturer	Description	Download	Buy
TPH9R00CQH		Toshiba Electronic Devices & Storage Corporation	MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N)
TPH2R408QM		Toshiba Electronic Devices & Storage Corporation	MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance
XPH2R106NC		Toshiba Electronic Devices & Storage Corporation	N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF)
XPH3R206NC		Toshiba Electronic Devices & Storage Corporation	N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF)
TPH4R008QM		Toshiba Electronic Devices & Storage Corporation	MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N)

SOT411 PACKAGE Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
SOT411 Abstract: DBS23P Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline DBS23P: plastic DIL-bent-SIL power package; 23 leads lead length 12 mm SOT411-2 non-concave Dh x D Eh view B: mounting base side A2 d A5 A4 β B j E1 E A L3 L 1 c Q v M 23 e1 Z e e2 m w M bp 5 10 mm	Original	PDF	DBS23P: OT411-2 SOT411 DBS23P
DBS23P Abstract: SOT411 Text: PDF: 2002 Apr 24 Philips Semiconductors Package outline DBS23P: plastic DIL-bent-SIL power package; 23 leads lead length 12 mm SOT411-2 non-concave Dh x D Eh view B: mounting base side A2 d A5 A4 β B j E1 E A L3 L 1 c Q v M 23 e1 Z e e2 m w M bp 5 10 mm	Original	PDF	DBS23P: OT411-2 DBS23P SOT411
DBS23P Abstract: SOT411 Text: PDF: 2002 Apr 24 Philips Semiconductors Package outline DBS23P: plastic DIL-bent-SIL power package; 23 leads straight lead length 3.2 mm SOT411-1 non-concave Dh x D Eh view B: mounting base side A2 d A5 A4 β E2 B j E E1 L2 L3 L1 L 1 e1 Z e 5 v M e2 m w M	Original	PDF	DBS23P: OT411-1 DBS23P SOT411
DBS23P Abstract: SOT411 Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline DBS23P: plastic DIL-bent-SIL power package; 23 leads straight lead length 3.2 mm SOT411-1 non-concave Dh x D Eh view B: mounting base side A2 d A5 A4 β E2 B j E E1 L2 L3 L1 L 1 e1 Z e 5 v M e2 m w M	Original	PDF	DBS23P: OT411-1 DBS23P SOT411
Untitled Abstract: No abstract text available Text: INTEGRATED CIRCUITS DATA SHEET TDA8567Q 4 x 25 W BTL quad car radio power amplifier Product specification Supersedes data of 1997 Feb 12 File under Integrated Circuits, IC01 1998 Sep 23 Philips Semiconductors Product specification 4 × 25 W BTL quad car radio power	Original	PDF	TDA8567Q TDA8567Q/N2 OT411 TDA8567Q/N3 TDA8567QU
Untitled Abstract: No abstract text available Text: INTEGRATED CIRCUITS DATA SHEET TDA8567Q 4 x 25 W BTL quad car radio power amplifier Product specification Supersedes data of 1997 Feb 12 File under Integrated Circuits, IC01 1998 Sep 23 Philips Semiconductors Product specification 4 × 25 W BTL quad car radio power	Original	PDF	TDA8567Q TDA8567Q/N2 OT411 TDA8567Q/N3 TDA8567QU
SAA7136E Abstract: saa7136 SAA7135 TO-220F JEDEC SAA7134 hso16 philips SAA7134 SAA7131E Philips SAA7130 SAA7133 Text: PCI Digital A/V Decoders PCI DIGITAL AUDIO/VIDEO DECODERS Typenumber SAA7130H SAA7134H SAA7133H SAA7135H SAA7131E SAA7136E SAA7136HS PCI PCI PCI PCI PCI PCI PCI Description Digital Audio/Video Decoders Digital Audio/Video Decoders Digital Audio/Video Decoders	Original	PDF	SAA7130H SAA7134H SAA7133H SAA7135H SAA7131E SAA7136E SAA7136HS OT425 LQFP128) SAA7136E saa7136 SAA7135 TO-220F JEDEC SAA7134 hso16 philips SAA7134 SAA7131E Philips SAA7130 SAA7133
SOT411 Abstract: SnAg25Sb10 zirconium acetate AgCu28 Transistors smd mark code CuZn15 QFP100 Quad Flat Pack dimensions 271 Ceramic Disc Capacitors SOT538 smd led 5050 Text: Environmental Information ENVIRONMENTAL SAFETY Offering maximum benefit – minimum impact New technologies result in shared benefits for you our customers, balancing maximum technological benefits with minimum environmental impact. This starts with clever chip designs, which	Original	PDF
JEDEC TRAY DIMENSIONS Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package Text: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors	Original	PDF	manuf86 TQFP80 OT357 TQFP64 OT543 TFBGA64 JEDEC TRAY DIMENSIONS HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package