SOT52 Search Results

Contextual Info: Package outline HTSSOP20: plastic thermal enhanced thin shrink small outline package; 20 leads; body width 4.4 mm; exposed die pad SOT527-1 E D A X c y HE exposed die pad side v M A Dh Z 11 20 A2 Eh pin 1 index A 3 A A1 θ Lp L 1 10 e detail X w M bp 2.5

Contextual Info: Package outline DBS27P: plastic DIL-bent-SIL power package; 27 leads lead length 7.7 mm SOT521-1 non-concave Dh x D Eh view B: mounting base side A2 d A5 A4 β B j E1 E A L3 L 1 Q 27 e1 Z 5 v M e2 m w M bp e c 10 mm scale DIMENSIONS (mm are the original dimensions)

SOT521-1

Abstract: DBS27P
Contextual Info: PDF: 2002 Apr 24 Philips Semiconductors Package outline DBS27P: plastic DIL-bent-SIL power package; 27 leads lead length 7.7 mm SOT521-1 non-concave Dh x D Eh view B: mounting base side A2 d A5 A4 β B j E1 E A L3 L 1 Q 27 e1 Z e 5 v M e2 m w M bp c 10 mm

sot527

Abstract: 01z1
Contextual Info: PDF: 1999 Nov 12 Philips Semiconductors Package outline HTSSOP20: plastic, heatsink thin shrink small outline package; 20 leads; body width 4.4 mm E D A SOT527-1 X c y HE heathsink side v M A Dh Z 11 20 A 3 A2 Eh pin 1 index A A1 θ Lp L 1 10 detail X w M

Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline DBS9P: plastic DIL-bent-SIL power package; 9 leads lead length 12/11 mm ; exposed die pad , , non-concave x SOT523-1 q1 Eh Dh D D1 view B: mounting base side P A2 k q2 B E q L2 L3 L1 L 1 9 e1 Z e Q

DBS27P

Abstract: sot521
Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline DBS27P: plastic DIL-bent-SIL power package; 27 leads lead length 7.7 mm SOT521-1 non-concave Dh x D Eh view B: mounting base side A2 d A5 A4 β B j E1 E A L3 L 1 Q 27 e1 Z e 5 v M e2 m w M bp c 10 mm

SOT523

Abstract: SOT523-1
Contextual Info: PDF: 2000 Jul 04 Philips Semiconductors Package outline DBS9P: plastic DIL-bent-SIL power package; 9 leads lead length 12/11 mm ; exposed die pad SOT523-1 q1 non-concave x Eh Dh D D1 view B: mounting base side P A2 k q2 B E q L2 L3 L1 L 1 9 e1 Z e Q w M bp

Contextual Info: Package outline DBS9P: plastic DIL-bent-SIL power package; 9 leads lead length 12/11 mm ; exposed die pad SOT523-1 q1 non-concave x Eh Dh D D1 view B: mounting base side P A2 k q2 B E q L2 L3 L1 L 1 9 e1 Z Q w M bp e 5 scale DIMENSIONS (mm are the original dimensions)

Contextual Info: PDF: 2003 Mar 17 Philips Semiconductors Package outline RDBS13P: plastic rectangular-DIL-bent-SIL power package; 13 leads SOT528-2 non-concave Dh x D Eh view B: mounting base side A2 d B j E A L e2 1 Q c 13 e1 Z bp e L1 v M w M 5 10 mm scale DIMENSIONS mm are the original dimensions

HTSSOP20

Abstract: m.a date sheet
Contextual Info: PDF: 2000 Jul 13 Philips Semiconductors Package outline HTSSOP20: plastic, heatsink thin shrink small outline package; 20 leads; body width 4.4 mm E D A SOT527-1 X c y HE heathsink side v M A Dh Z 11 20 A 3 A2 Eh pin 1 index A A1 θ Lp L 1 10 detail X w M

ice 38156

Abstract: 52169 TARF1504E 6012 transistor 20449 163462 76129 62639 160505 67551
Contextual Info: TARF1504E NPN Planer RF TRANSISTOR SOT-523 □ DESCRIPTION unit : mm The TARF1504E is a low Noise figure and good associated gain performance at UHF, VHF and Microwave frequencies It is suitable for a high density surface mount since transistor has been SOT523 package

Contextual Info: DTA114EM/EE/EUA/ECA/ESA Taiwan Semiconductor Small Signal Product PNP Digital Transistor FEATURES - Built-in bias resistors enable the configuration of SOT523 /SOT323/SOT23 an inverter circuit without connecting external input resistor see equivalent circuit .

DBS7P

Contextual Info: PDF: 2003 Mar 17 Philips Semiconductors Package outline DBS7P: plastic DIL-bent-SIL power package; 7 leads lead length 12/11 mm ; exposed die pad SOT524-1 q1 non-concave x Eh Dh D D1 view B: mounting base side P A2 k q2 B E q L2 L3 L1 L 1 7 Z e1 e Q w M bp

Contextual Info: PDF: 2003 Mar 17 Philips Semiconductors Package outline DBS9P: plastic DIL-bent-SIL power package; 9 leads lead length 12/11 mm ; exposed die pad SOT523-1 q1 non-concave x Eh Dh D D1 view B: mounting base side P A2 k q2 B E q L2 L3 L1 L 1 9 e1 Z e Q w M bp

Contextual Info: PDF: 2000 Jul 04 Philips Semiconductors Package outline DBS7P: plastic DIL-bent-SIL power package; 7 leads lead length 12/11 mm ; exposed die pad SOT524-1 q1 non-concave x Eh Dh D D1 view B: mounting base side P A2 k q2 B E q L2 L3 L1 L 1 7 Z e1 e Q w M bp

sot528

Contextual Info: PDF: 2000 Oct 19 Philips Semiconductors Package outline RDBS13P: plastic rectangular-DIL-bent-SIL power package; 13 leads SOT528-2 non-concave Dh x D Eh view B: mounting base side d A2 B j E A L e2 1 Q c 13 e1 Z bp e L1 v M w M 5 10 mm scale DIMENSIONS mm are the original dimensions

Contextual Info: Package outline RDBS13P: plastic rectangular-DIL-bent-SIL power package; 13 leads SOT528-1 non-concave Dh x D Eh view B: mounting base side A2 d B j E A L e2 Q c 13 1 e1 Z e v M w M bp 5 L1 10 mm scale DIMENSIONS mm are the original dimensions UNIT A A2

Contextual Info: Package outline RDBS13P: plastic rectangular-DIL-bent-SIL power package; 13 leads SOT528-2 non-concave Dh x D Eh view B: mounting base side A2 d B j E A L e2 1 Q c 13 e1 Z bp e L1 v M w M 5 10 mm scale DIMENSIONS mm are the original dimensions UNIT A A2

A 69157

Abstract: 276-145 transistor 585-42 ice 0565 151-237 74292 ic 74210 16-878-1 TARF1503E 74288
Contextual Info: TARF1503E NPN Planer RF TRANSISTOR SOT-523 □ DESCRIPTION unit : mm The TARF1503E is a low Noise figure and good associated gain performance at UHF,VHF and Microwave frequencies It is suitable for a high density surface mount since transistor has been SOT523 package

transistor c143

Abstract: C143 Transistor ze 003 ic ZUA SOT23 ze 003 zua SOT-23 ZE SOT-23 marking CODE ZUA SOT23
Contextual Info: DTC143 ZM/ZE/ZUA/ZCA/ZSA Taiwan Semiconductor Small Signal Product PNP Small Signal Transistor FEATURES - Built-in bias resistors enable the configuration of an inverter circuit without connecting external input resistor SOT523/SOT323/SOT23 see equivalent circuit

sot524

Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline DBS7P: plastic DIL-bent-SIL power package; 7 leads lead length 12/11 mm ; exposed die pad , , non-concave x SOT524-1 q1 Eh Dh D D1 view B: mounting base side P A2 k q2 B E q L2 L3 L1 L 1 7 Z e1 e Q

HTSSOP20

Contextual Info: SOT527-1 HTSSOP20; reel pack; standard product orientation 12NC ending 518 Rev. 1 — 23 October 2012 Packing information 1. Packing method %DUFRGH ODEHO %DJ 6' SULQW 0RLVWXUH FDXWLRQ SULQW 7DSH %DUFRGH ODEHO 'U\DJHQW 5HODWLYH KXPLGLW\ LQGLFDWRU (6' HPERVVHG

Contextual Info: SOT527-1 HTSSOP20; reel pack; standard product orientation 12NC ending 118 Rev. 1 — 6 November 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape Barcode label Circular sprocket holes opposite the label side of reel QA Seal

Contextual Info: Package outline DBS7P: plastic DIL-bent-SIL power package; 7 leads lead length 12/11 mm ; exposed die pad SOT524-1 q1 non-concave x Eh Dh D D1 view B: mounting base side P A2 k q2 B E q L2 L3 L1 L 1 7 Z e1 Q w M bp e 5 scale DIMENSIONS (mm are the original dimensions)