SOT75 Search Results

Contextual Info: SOT753 Tape reel SMD; reversed product orientation 12NC ending 125 Rev. 1 — 26 November 2012 Packing information 1. Packing method Printed plano box Barcode label Reel Tape Barcode label Circular sprocket holes opposite the label side of reel QA Seal Cover tape

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of HVQFN16 package SOT758-1 Hx Gx D P 0.025 0.025 C 0.105 SPx Hy SPy tot nSPx Gy SPy nSPy SLy By Ay SPx tot SLx Bx Ax solder land solder paste deposit solder land plus solder paste occupied area

Contextual Info: Package outline HVQFN16: plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 3 x 3 x 0.85 mm B D SOT758-2 A terminal 1 index area E A A1 c detail X e1 1/2 e v w b e 5 8 M M C C A B C y1 C y L 9 4 e e2 Eh 1/2 e 1 12 16 terminal 1

sot751

Contextual Info: PDF: 2003 Mar 20 Philips Semiconductors Package outline LFBGA80: plastic low profile fine-pitch ball grid array package; 80 balls; body 7 x 7 x 1.05 mm A B D SOT751-1 ball A1 index area A A2 E A1 detail X C e1 e 1/2 e ∅v M C A B b y y1 C ∅w M C M L K J

BAP70Q

Contextual Info: BAP70Q Quad PIN diode attenuator Rev. 2 — 6 March 2012 Product data sheet 1. Product profile 1.1 General description Quad PIN diode in a SOT753 package. 1.2 Features and benefits        4 PIN diodes in a SOT753 package 300 kHz to 4 GHz

sot756

Contextual Info: PDF: 2002 Mar 29 Philips Semiconductors Package outline SOT756 Plastic single-ended surface mounted package; 5 leads D A D1 A1 D2 E2 mounting base E E1 HE 1 2 3 4 e Lp 5 c w M b Q 2.5 5 mm scale DIMENSIONS mm are the original dimensions UNIT A A1 max. b

SOT753

Abstract: SOT-753
Contextual Info: Package outline Philips Semiconductors Plastic surface-mounted package; 5 leads SOT753 D E B y A X HE 5 v M A 4 Q A A1 c 1 2 3 Lp detail X bp e w M B 1 2 mm scale DIMENSIONS mm are the original dimensions UNIT A A1 bp c D E e HE Lp Q v w y mm 1.1 0.9 0.100

Contextual Info: PC board footprint NXP Semiconductors Footprint for reflow soldering SOT753 SC-74A 3.45 1.95 0.45 0.55 (5x) (5×) 0.95 3.3 2.825 solder lands solder resist 0.95 solder paste occupied area 2.4 Dimensions in mm 0.7 (5×) 0.8 (5×) sot753_fr SOT753_fr PDF

Contextual Info: Package outline TFBGA256: plastic thin fine-pitch ball grid array package; 256 balls; body 15 x 15 x 0.8 mm B D SOT754-1 A ball A1 index area A E A2 A1 detail X C e1 b 1/2 e e y y1 C ∅v M C A B ∅w M C V e U T R P N M K L F D B e2 J H 1/2 e G E C A ball A1

Contextual Info: PC board footprint NXP Semiconductors Footprint for wave soldering SOT753 SC-74A 5.3 1.5 (4x) solder lands 1.475 solder resist 5.05 0.45 occupied area 1.475 Dimensions in mm preferred transport direction during soldering 1.45 (5×) 2.85 sot753_fw SOT753_fw

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA80 package SOT751-2 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: BAP70Q Quad PIN diode attenuator Rev. 2 — 6 March 2012 Product data sheet 1. Product profile 1.1 General description Quad PIN diode in a SOT753 package. 1.2 Features and benefits        4 PIN diodes in a SOT753 package 300 kHz to 4 GHz

BAP70Q

Contextual Info: BAP70Q Quad PIN diode attenuator Rev. 1 — 6 October 2010 Product data sheet 1. Product profile 1.1 General description Quad PIN diode in a SOT753 package. 1.2 Features and benefits „ „ „ „ „ „ „ 4 PIN diodes in a SOT753 package 300 kHz to 4 GHz High linearity

sot751

Contextual Info: PDF: 2003 Sep 16 Philips Semiconductors Package outline LFBGA80: plastic low profile fine-pitch ball grid array package; 80 balls; body 7 x 7 x 0.9 mm SOT751-2 B D A ball A1 index area A A2 E A1 detail X C e1 e 1/2 e ∅v M b ∅w M M L K J H G F E D C B A

Contextual Info: BAP64Q Quad PIN diode attenuator Rev. 1 — 7 October 2010 Product data sheet 1. Product profile 1.1 General description Quad PIN diode in a SOT753 package. 1.2 Features and benefits ̈ ̈ ̈ ̈ ̈ ̈ ̈ 4 PIN diodes in a SOT753 package 300 kHz to 4 GHz High linearity

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TFBGA256 package SOT754-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: 6 N1 QF HV SOT758-1 HVQFN16; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code 12NC ending 118 Rev. 2 — 18 April 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of HVQFN16 package SOT758-3 Hx Gx D P 0.025 0.025 C 0.105 SPx Hy SPy tot nSPx Gy SPy nSPy SLy By Ay SPx tot SLx Bx Ax solder land solder paste deposit solder land plus solder paste occupied area

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA80 package SOT751-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: Package outline Plastic surface-mounted package; 5 leads SOT753 D E B y A X HE 5 v M A 4 Q A A1 c 1 2 3 Lp detail X bp e w M B 1 2 mm scale DIMENSIONS mm are the original dimensions UNIT A A1 bp c D E e HE Lp Q v w y mm 1.1 0.9 0.100 0.013 0.40 0.25 0.26

Contextual Info: Package outline HVQFN16: plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 3 x 3 x 0.85 mm SOT758-3 B D D1 A terminal 1 index area A4 E1 E A c A1 detail X e1 e 1/2 e b 5 8 v w M M C C A B C y1 C y L 4 9 e e2 Eh 1/2 e 1 12 terminal 1

Contextual Info: Package outline LFBGA80: plastic low profile fine-pitch ball grid array package; 80 balls; body 7 x 7 x 0.9 mm SOT751-2 B D A ball A1 index area A A2 E A1 detail X C e1 e 1/2 e y ∅w M C M L K J H G F E D C B A ball A1 index area y1 C ∅v M C A B b e e2

sot750

Contextual Info: PDF: 2003 Sep 23 Philips Semiconductors Package outline Leadless surface mounted package; plastic cap; 28 terminations 14x e Z D2 1 2 3 SOT750A (63×) b 4 5 6 7 8 9 Z E2 28 10 27 11 26 12 25 13 24 14 L (63×) Z E1 (18×) 23 22 21 20 19 18 17 16 15 Z D1 (14×)

HVQFN16

Abstract: MO-220 sot758 SOT758-1
Contextual Info: PDF: 2002 Oct 22 Philips Semiconductors Package outline HVQFN16: plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 3 x 3 x 0.85 mm A B D SOT758-1 terminal 1 index area A E A1 c detail X e1 C 1/2 e e 5 y y1 C v M C A B w M C