SOT76 Search Results

Contextual Info: SOT762-1 Standard product orientation 12NC ending 115 Rev. 03 — 28 July 2011 Packing information 1. Packing method Fig. 1 Package version 12NC ending Reel dimensions d x w mm SPQ/PQ (pcs) Reels per box Outer box dimensions l x w x h (mm) SOT762-1 115 180 x 12

Contextual Info: Package outline HLQFP176: plastic thermal enhanced low profile quad flat package; 176 leads; body 24 x 24 x 1.4 mm; exposed die pad SOT766-1 c y exposed die pad X Dh A 132 133 89 88 ZE e Eh E HE A A2 A1 A 3 θ wM Lp L bp detail X pin 1 index 176 45 1 44

Contextual Info: Package outline DHVQFN16: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; SOT763-1 16 terminals; body 2.5 x 3.5 x 0.85 mm A B D A E A1 c detail X terminal 1 index area terminal 1 index area C e1 e 2 7 y y1 C v M C A B

2N2090

Abstract: 2N2095A 2N2022 2N2040 Emihus 2N2020 2n2063 2n2038 2N2082 2N2003
Contextual Info: POWER SILICON NPN Item Number Part Number I C 5 10 15 20 >= 30 Solitron PPC Product PPC Product Solitron Solitron PPC Product Sid St Dvcs Sid St Dvcs Sid St Dvcs Sid St Dvcs g~:~:g~ ~:~~: ~~: KSP1151 KSP1171 SOT7A07 SOT7A07 SOT7A07 SOT7607 SOT7607 SOn607

DBS27P

Abstract: DBS27 sot767
Contextual Info: PDF: 2002 May 06 Philips Semiconductors Package outline DBS27P: plastic DIL-bent-SIL special bent power package; 27 leads (lead length 7.7 mm) SOT767-1 non-concave Dh x D Eh view B: mounting base side A2 d A5 A4 β B j E1 E A L3 L 1 Q 27 e1 Z e 5 v M e2

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TFBGA72 package SOT761-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: 16 FN VQ DH SOT763-1 DHVQFN24; Reel pack; SMD, 7" Q1/T1 Standard product orientation Orderable part number ending ,115 or X Ordering code 12NC ending 115 Rev. 1 — 4 April 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape

Contextual Info: Package outline VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm D E SOT765-1 A X c y HE v M A Z 5 8 Q A A2 A1 pin 1 index A3 θ Lp 1 4 e L detail X w M bp 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT

HEF4052B-Q100

Abstract: 74AHC1G09-Q100 NPIC6C596-Q100 NPIC6C595-Q100
Contextual Info: Automotive Innovative package options Suffix BQ PW D PW BQ PW GW GM SOT763-1 SOT403-1 SOT108-1 SOT402-1 SOT764-1 SOT360-1 SOT363 SOT886 16-pin 16-pin 14-pin 14-pin 20-pin 20-pin 6-pin 6-pin Width mm 2.50 6.40 6.00 6.40 2.50 6.40 2.10 1.00 Length (mm) 3.50

dhvqfn14

Abstract: MO-241 sot762 SOT762-1
Contextual Info: PDF: 2003 Jan 28 Philips Semiconductors Package outline DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; SOT762-1 14 terminals; body 2.5 x 3 x 0.85 mm A B D A A1 E c detail X terminal 1 index area terminal 1

DHVQFN-20

Abstract: SOT764-1 MO-241 DHVQFN20 sot764
Contextual Info: PDF: 2003 Jan 28 Philips Semiconductors Package outline DHVQFN20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; SOT764-1 20 terminals; body 2.5 x 4.5 x 0.85 mm A B D A A1 E c detail X terminal 1 index area terminal 1

Contextual Info: Package outline DHVQFN20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; SOT764-1 20 terminals; body 2.5 x 4.5 x 0.85 mm A B D A E A1 c detail X terminal 1 index area terminal 1 index area C e1 e 2 9 y y1 C v M C A B

SOT762-1

Abstract: sot762
Contextual Info: SOT762-1 Standard product orientation 12NC ending 115 Rev. 01 — 13 February 2009 Packing information 1. Packing method Fig. 1 Package version 12NC ending Reel dimensions d x w mm SPQ/PQ (pcs) Reels per box Outer box dimensions l x w x h (mm) SOT762-1 115

SOT764-1

Abstract: NXP 12NC ending
Contextual Info: SOT764-1 Standard product orientation 12NC ending 115 Rev. 01 — 23 April 2009 Packing information 1. Packing method Fig. 1 Package version 12NC ending Reel dimensions d x w mm SPQ/PQ (pcs) Reels per box Outer box dimensions l x w x h (mm) SOT764-1 115

Contextual Info: PC board footprint NXP Semiconductors Footprint information for reflow soldering of DHVQFN14 package SOT762-1 Hx Gx D P C 0.105 SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout

HQFP128

Abstract: ZD 103 sot760
Contextual Info: PDF: 2002 Jun 14 Philips Semiconductors Package outline HQFP128: plastic thermal enhanced quad flat package; 128 leads lead length 1.6 mm ; body 28 x 28 x 3.4 mm; heatsink SOT760-1 c y X Dh A 96 65 ZE 64 97 e E HE Eh A A2 A1 (A3) θ wM Lp bp L detail X pin 1 index

DHVQFN16

Abstract: SOT763-1 SOT-763 MO-241 Diode Y1 sot763
Contextual Info: PDF: 2003 Jan 28 Philips Semiconductors Package outline DHVQFN16: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; SOT763-1 16 terminals; body 2.5 x 3.5 x 0.85 mm A B D A A1 E c detail X terminal 1 index area terminal 1

B0278

Abstract: b0245 b0663 044H4 1405 Motorola
Contextual Info: POWER SILICON NPN Item Number Part Number I C 5 10 15 20 >= 30 Solitron PPC Product PPC Product Solitron Solitron PPC Product Sid St Dvcs Sid St Dvcs Sid St Dvcs Sid St Dvcs g~:~:g~ ~:~~: ~~: KSP1151 KSP1171 SOT7A07 SOT7A07 SOT7A07 SOT7607 SOT7607 SOn607

SOT765-1

Contextual Info: SOT765-1 Reversed product orientation 12NC ending 125 Rev. 02 — 24 April 2009 Packing information 1. Packing method Fig. 1 Package version 12NC ending Reel dimensions d x w mm SPQ/PQ (pcs) Reels per box Outer box dimensions l x w x h (mm) SOT765-1 125

HLQFP176

Abstract: MS-026 sot766
Contextual Info: PDF: 2002 Jun 13 Philips Semiconductors Package outline HLQFP176: plastic thermal enhanced low profile quad flat package; 176 leads; body 24 x 24 x 1.4 mm; exposed die pad SOT766-1 c y exposed die pad X Dh A 132 133 89 88 ZE e Eh E HE A A2 A1 A 3 θ wM Lp

VSSOP8

Abstract: JEDEC MO-187 MO-187 VSSOP-8 SOT765-1 sot765
Contextual Info: PDF: 2002 Jun 07 Philips Semiconductors Package outline VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm D E SOT765-1 A X c y HE v M A Z 5 8 Q A A2 A1 pin 1 index A3 θ Lp 1 4 e L detail X w M bp 2.5 5 mm scale DIMENSIONS (mm are the original dimensions)

VSSOP8

Contextual Info: P8 SO VS SOT765-1 VSSOP8; Reel pack, reverse; SMD, 7" Q3/T4 Standard product orientation Orderable part number ending ,125 or H Ordering code 12NC ending 125 Rev. 5 — 3 May 2013 Packing information 1. Packing method Printed plano box Barcode label Reel

SOT763-1

Abstract: nxp Tape and Reel Information SOT-763
Contextual Info: SOT763-1 Standard product orientation 12NC ending 115 Rev. 01 — 22 April 2009 Packing information 1. Packing method Fig. 1 Package version 12NC ending Reel dimensions d x w mm SPQ/PQ (pcs) Reels per box Outer box dimensions l x w x h (mm) SOT763-1 115

Contextual Info: Package outline DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; SOT762-1 14 terminals; body 2.5 x 3 x 0.85 mm A B D A E A1 c detail X terminal 1 index area terminal 1 index area C e1 e 2 6 y y1 C v M C A B