| SOT782-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced very thin small outline package; no leads; 8 terminals |
|
Original |
PDF
|
223.06KB |
1 |
| SOT782-1 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT782-1 |
|
Original |
PDF
|
319.53KB |
1 |
| SOT782-1_115 |
|
NXP Semiconductors
|
HVSON8; reel pack; standard product orientation; 12NC ending 115 |
|
Original |
PDF
|
304.12KB |
4 |
| SOT782-1_118 |
|
NXP Semiconductors
|
HVSON8; reel pack; SMD; 13"; standard product orientation Orderable part number ending, 118 or J Ordering code (12NC) ending 118 |
|
Original |
PDF
|
266.05KB |
4 |
