SOT87 Search Results

Contextual Info: PC board footprint Philips Semiconductors Footprint for reflow soldering of RDBS27P package 2 SOT878-1 1 27 1 2.54 26 hole diameter min. 0.92 2 ∅ 0.08 M Dimensions in mm SOT878-1_fr PDF sot878-1_fr Koninklijke Philips Electronics N.V. 2006. All rights reserved.

Contextual Info: Package outline TSON4R: plastic thin small outline package; no leads; 4 terminals; resin based; body 1.6 x 2 × 1.1 mm SOT870-1 D B A A E A1 terminal 1 index area detail X C e1 b 1 terminal 1 index area 2 v w M v w M M M C A B C y y1 C C A B C L e2 4 3 X

MO-205

Abstract: LFBGA100 sot872
Contextual Info: Package outline Philips Semiconductors LFBGA100: plastic low profile fine-pitch ball grid array package; 100 balls; body 9 x 9 x 1.05 mm D SOT872-1 B A ball A1 index area A2 A E A1 detail X e1 C 1/2 e ∅v ∅w b e M M y y1 C C A B C K J e H G F e2 E D 1/2 e

Contextual Info: 333 SOT873-1 QF N3 HVSON8; reel pack; standard product orientation; 12NC ending 115 Rev. 1 — 21 September 2011 Packing information 1. Packing method Printed plano box Barcode label Reel Tape QA Seal Preprinted ESD warning PQ-label permanent Circular sprocket holes opposite the

sot870

Contextual Info: Package outline Philips Semiconductors TSON4: plastic thin small outline package; no leads; 4 terminals; body 1.6 x 2 × 1.1 mm D SOT870-1 B A A E A1 terminal 1 index area detail X C e1 b 1 terminal 1 index area 2 v w M v w M M M C A B C y1 C y C A B C L

philips e3

Abstract: sot877
Contextual Info: Package outline Philips Semiconductors HLQFN18: plastic thermal enhanced low profile quad flat package; no leads; 18 terminals; body 10 x 8 x 1.4 mm SOT877-1 A D y terminal 1 index area E D2 2x D3 (2×) ZE1 (10×) b (15×) 7 8 9 6 10 5 11 4 12 3 13 2 14

LBGA196

Abstract: LBGA-196 MO-192 sot879
Contextual Info: Package outline Philips Semiconductors LBGA196: plastic low profile ball grid array package; 196 balls; body 15 x 15 x 1 mm A B D SOT879-1 ball A1 index area A A2 A1 E detail X C e1 e 1/2 e y y1 C ∅v M C A B b ∅w M C P N e M L K J H e2 G 1/2 e F E D C

Contextual Info: Package outline HVQFN52: plastic thermal enhanced very thin quad flat package; no leads; 52 terminals; body 6 x 6 x 0.85 mm D SOT871-1 A B terminal 1 index area E A A1 c detail X C e1 e 13 v w b 1/2 e 14 25 26 M M y y1 C C A B C L 27 12 LC e e2 Eh 1/2 e eg

BGA756

Abstract: MS-034 sot875
Contextual Info: Package outline Philips Semiconductors BGA756: plastic ball grid array package, 756 balls, body 35 x 35 x 1.75 mm D D1 SOT875-1 B A ball A1 index area A E1 E A2 A1 detail X C e1 e AP AM AK AH AF AD AB Y V T P M K H F D B ∅v ∅w b 1/2 e M M y AN AL e AJ

Contextual Info: Package outline DFN3333-8: plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 3.3 x 3.3 x 1.0 mm SOT873-1 X B D A E terminal 1 index area A A1 c detail X terminal 1 index area e1 C v w b e 1 4 M M y y1 C C A B C L1 Eh L2

IC-7316-001

Abstract: TFBGA316 sot876 MO-195
Contextual Info: Package outline Philips Semiconductors TFBGA316: plastic thin fine-pitch ball grid array package; 316 balls; body 11 x 11 x 0.8 mm SOT876-1 B D A ball A1 index area A E A2 A1 detail X C e1 e ∅v ∅w b 1/2 e M M y y1 C C A B C Y W e V U T R P N M L e2 K J

HVQFN52

Abstract: DF-39 sot871 HVQFN-52 DF 39 DF 085 l2712
Contextual Info: Package outline Philips Semiconductors HVQFN52: plastic thermal enhanced very thin quad flat package; no leads; 52 terminals; body 6 x 6 x 0.85 mm A B D SOT871-1 terminal 1 index area E A A1 c detail X C e1 e 13 v w b 1/2 e 14 25 M M y1 C C A B C y 26 L 27

RDBS27P

Abstract: SOT-878 sot878
Contextual Info: Package outline Philips Semiconductors RDBS27P: plastic rectangular-DIL-bent-SIL reverse bent power package; 27 leads (row spacing 2.54 mm) SOT878-1 non-concave Dh x D Eh view B: mounting base side d A2 B j E A L 1 27 c e1 Z e2 Q e w bp v L1 M 10 M 20 mm

lfpak

Abstract: LFPAK package SOT669* PSMN017-60YS PSMN012-60YS as 220 1r7 PSMN015-60PS PSMN5R0-80PS PSMN013-30LL PSMN014-60LS PSMN017-30LL
Contextual Info: NXP power switching MOSFETs in compact QFN3333 package Smaller. Faster. Cooler. 30 V Trench 6 MOSFETs in 3.3 x 3.3 mm QFN package A new range of 30 V Trench 6 MOSFETs in QFN3333 SOT873 package NXP now offers a range of high-performance, 30 V, logic-level MOSFETs in QFN3333 package.

Contextual Info: AN11304 MOSFET load switch PCB with thermal measurement Rev. 1 — 25 January 2013 Application note Document information Info Content Keywords Load switch, MOSFETs, DFN2020MD-6 SOT1220 , DFN2020-6 (SOT1118); DFN3333-8 (SOT873-1), thermal resistance Abstract

Contextual Info: Package outline RDBS27P: plastic rectangular-DIL-bent-SIL reverse bent power package; 27 leads (row spacing 2.54 mm) SOT878-2 non-concave Dh x D Eh view B: mounting base side d A2 B j E A 1 L 27 c e1 Z e2 Q e w bp v L1 M 10 M 20 mm scale Dimensions (mm are the original dimensions)

Contextual Info: Package outline LBGA196: plastic low profile ball grid array package; 196 balls; body 15 x 15 x 1 mm A B D SOT879-1 ball A1 index area A A2 A1 E detail X C e1 e 1/2 e y y1 C ∅v M C A B b ∅w M C P N e M L K J H e2 G 1/2 e F E D C B A ball A1 index area

tea1719

Abstract: PH1930 nds 3 video guard smart card OPTOCOUPLER SMPS for HDD ph1930al PH2530AL ip4223 SMD 8A TRANSISTOR 702 transistor smd code PH6030AL
Contextual Info: Application Guide Notebook Computing Introduction Your partner for notebook computing Designing notebooks isn’t getting any easier. The footprint continues to shrink, and consumers continue to demand more features, faster speeds, on our decades-long leadership in high-performance mixed-signal solutions,

TDA8594SD

Abstract: AEC-Q100 BC859 Q100 TDA3664 TDA8594J philips speakers tweeter 00-TOTAL TDA8595
Contextual Info: TDA8594 I2C-bus controlled 4 x 50 W power amplifier Rev. 02 — 11 December 2007 Product data sheet 1. General description The TDA8594 is a complementary quad Bridge Tied Load BTL audio power amplifier made in BCDMOS technology. It contains four independent amplifiers in BTL

prtr5v0u6s

Abstract: csp1040 TSSOP20 FOOTPRINT ip4065cx11 smd transistor GY sot89 IP4065CX11/LF BV 9y transistor smd IP4058CX8/LF IP4280CZ10 smd transistor GY
Contextual Info: Dark Green − NXP‘s transfer to halogen-free products Why Dark Green? We as NXP are deeply committed to developing eco-friendly products and integrating environmental safety aspects in all manufacturing processes. For our packaging technology this meant a shift to lead-free and halogen-free “Dark Green”, years

PSMN013-30LL

Contextual Info: PSMN013-30LL N-channel QFN3333 30 V 13 mΩ logic level MOSFET Rev. 04 — 7 July 2010 Product data sheet 1. Product profile 1.1 General description Logic level N-channel MOSFET in QFN3333 package qualified to 150 °C. This product is designed and qualified for use in a wide range of industrial, communications and power

NX3008NBKMB

Abstract: IP4303CX4 PCMF2DFN1
Contextual Info: Safeguard sensitive ICs - Increase battery life - Save space With NXP key products as recommended in this brochure Interface / Function Description Product type Package NFC antenna protection 18 / 24 V Birectional low capacitance ESD protection diode PESD18VF1BL

TDF8544TH

Contextual Info: NXP quad Class-AB amplifiers TDF854x for automotive and transportation Seamless sound experience for stop/start cars Designed for use in stop/start cars, these advanced Class-AB amplifiers support listening to audio streams while the car’s internal power supply is down for engine start. They

philips speakers tweeter

Abstract: TDA8595SD tda85 BC859 HSOP36 TDA3664 TDA8595 TDA8595J TDA8595TH
Contextual Info: TDA8595 I2C-bus controlled 4 x 45 W power amplifier Rev. 01 — 20 April 2006 Product data sheet 1. General description The TDA8595 is a complementary quad Bridge Tied Load BTL audio power amplifier made in BCDMOS technology. It contains four independent amplifiers in BTL