SSOP56 PACKAGE Search Results

SSOP56

Abstract: ssop-56 zif socket DIL48 28F160F3
Contextual Info: DIL48/SSOP56 ZIF Flash-3 ord.no. 70-0120 special converter, assigned for Flash EPROMs in SSOP56 package (with Intel 28F160F3's pinout) operation (mechanical) life of ZIF socket - 10.000 actuations made in Slovakia Ord. no 70-0120 Socket ZIF SSOP56, ClamShell type

SSOP56

Abstract: adapter ssop56 adaptor ssop56 RE931-07 SSOP5 ssop-56
Contextual Info: SSOP56 Adapter shrink small outline package RE931-07 - EPOXY fibre glass FR4 1.5 mm double-sided 35 µm CU (pth) - solder and component side with chem. NI/AU surface and solder stop mask - pitch: 0.635 (300 mil) - pins: 56 - hole dia 1.00 mm - size 37.5 x 29.5 mm

SSOP56

Contextual Info: PDF: 2003 Mar 24 Philips Semiconductors Package outline SSOP56: plastic shrink small outline package; 56 leads; body width 7.5 mm SOT371-1 D E A X c y HE v M A Z 29 56 Q A2 A1 A A 3 θ pin 1 index Lp L 28 1 bp e detail X w M 5 10 mm scale DIMENSIONS (mm are the original dimensions)

sot371

Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline SSOP56: plastic shrink small outline package; 56 leads; body width 7.5 mm SOT371-1 D E A X c y HE v M A Z 29 56 Q A2 A1 A A 3 θ pin 1 index Lp L 28 1 bp e detail X w M 5 10 mm scale DIMENSIONS (mm are the original dimensions)

SSOP56

Abstract: jedec mo-118
Contextual Info: PDF: 2000 Jan 05 Philips Semiconductors Package outline SSOP56: plastic shrink small outline package; 56 leads; body width 7.5 mm SOT371-1 D E A X c y HE v M A Z 29 56 Q A2 A1 A A 3 θ pin 1 index Lp L 28 1 bp e detail X w M 5 10 mm scale DIMENSIONS (mm are the original dimensions)

TN80C196KC20

Abstract: TE28F800B3TA120 N80C51FA1 TN80C196KB16 N80C31BH1 TE28F008B3T115 N80C196KC20 DT28F320S5-90 TE28F160F3T120 N80C3224
Contextual Info: Product Change Notification Please respond to your distributor if you have any issues with the timeline or content of this change. No response from customers will be deemed as acceptance of the change and the change will be implemented pursuant to the key milestones set forth in this attached PCN.

H9606

Abstract: p9606 S 1854 L9545 1005 Ic Data 7217 74FCT161T L9606 data sheet IC 7217 Hyundai Semiconductor
Contextual Info: INTEGRATED DEVICE TECHNOLOGY, INC. QUALITY & RELIABILITY MONITORS JULY 1996 IDT QUALITY SERVICE QSP PERFORMANCE 2975 Stender Way, Santa Clara, CA 95054 TEL: 800 345-7015 FAX: (408) 492-8674 IDT QUALITY & RELIABILITY MONITOR REPORT July 1996 TABLE OF CONTENTS

Z952

Abstract: 1005 Ic Data MQUAD S 1854 JEDEC-STD-22 N9532 datasheet and application 7217 74FCT162244T 74FCT162543 A102
Contextual Info: INTEGRATED DEVICE TECHNOLOGY, INC. QUALITY & RELIABILITY MONITORS JULY 1996 IDT QUALITY SERVICE QSP PERFORMANCE 2975 Stender Way, Santa Clara, CA 95054 TEL: 800 345-7015 FAX: (408) 492-8674 IDT QUALITY & RELIABILITY MONITOR REPORT July 1996 TABLE OF CONTENTS

H9549

Abstract: 74FCT273 74FCT374 A101 A102 A104 A106 A110 SSOP-56 H9607
Contextual Info: INTEGRATED DEVICE TECHNOLOGY, INC. QUALITY & RELIABILITY MONITORS January 1997 IDT QUALITY SERVICE QSP PERFORMANCE 2975 Stender Way, Santa Clara, CA 95054 TEL: 800 345-7015 FAX: (408) 492-8674 IDT QUALITY & RELIABILITY MONITOR REPORT January 1997 TABLE OF CONTENTS

v9452

Abstract: p9506 N9514 74FCT163373 v945 54fct821 k952 Y9511 L9530 wh9513
Contextual Info: INTEGRATED DEVICE TECHNOLOGY, INC. QUALITY & RELIABILITY MONITORS January 1996 IDT QUALITY SERVICE QSP PERFORMANCE 3001 Stender Way, Santa Clara, CA 95054 TEL: 408 727-6116 FAX: (408) 492-8362 IDT QUALITY & RELIABILITY MONITOR REPORT January 1996 TABLE OF CONTENTS

soj16 package

Abstract: adaptor ssop56 dip48 W9518 W9512 W9514 SOJ-20 W9524 soj16 soj18 package TSOP14 package
Contextual Info: WINSLOW ADAPTICs - SOIC or SOJ Solder Pads to DIP Adapters SOIC or SOJ Solder Pads to DIP ADAPTICs how to order shipping costs terms & conditions These ADAPTICs have an array of SOP solder pads on the top and male pins on the underside to mate with a DIP socket or solder into a

H9549

Abstract: X9642 h954 A101 A102 A104 A106 A110 SBGA-272 h9610
Contextual Info: INTEGRATED DEVICE TECHNOLOGY, INC. QUALITY & RELIABILITY MONITORS January 1997 IDT QUALITY SERVICE QSP PERFORMANCE 2975 Stender Way, Santa Clara, CA 95054 TEL: 800 345-7015 FAX: (408) 492-8674 IDT QUALITY & RELIABILITY MONITOR REPORT January 1997 TABLE OF CONTENTS

data sheet IC 7217

Abstract: 7217 IC malaysia IC MQUAD report on PLCC S 1854 transistor 9529 931 9535 9529 datasheet and application 7217
Contextual Info: INTEGRATED DEVICE TECHNOLOGY, INC. QUALITY & RELIABILITY MONITORS JULY 1996 IDT QUALITY SERVICE QSP PERFORMANCE 2975 Stender Way, Santa Clara, CA 95054 TEL: 800 345-7015 FAX: (408) 492-8674 IDT QUALITY & RELIABILITY MONITOR REPORT July 1996 TABLE OF CONTENTS

H9549

Abstract: h9627 h9540 K9549 H9607 idt 74fct244 die h9610 A101 A102 A106
Contextual Info: INTEGRATED DEVICE TECHNOLOGY, INC. QUALITY & RELIABILITY MONITORS July 1997 IDT QUALITY SERVICE QSP PERFORMANCE 2975 Stender Way, Santa Clara, CA 95054 TEL: 800 345-7015 FAX: (408) 492-8674 IDT QUALITY & RELIABILITY MONITOR REPORT July 1997 TABLE OF CONTENTS

power supply ic 9435

Abstract: 9435 72 datasheet and application 7217 malaysia IC report on PLCC v9452 100A484 a106 diode MQUAD PDIP-48
Contextual Info: INTEGRATED DEVICE TECHNOLOGY, INC. QUALITY & RELIABILITY MONITORS January 1996 IDT QUALITY SERVICE QSP PERFORMANCE 3001 Stender Way, Santa Clara, CA 95054 TEL: 408 727-6116 FAX: (408) 492-8362 IDT QUALITY & RELIABILITY MONITOR REPORT January 1996 TABLE OF CONTENTS

EN4900GC

Abstract: JESD22-A103 CEL9220HF JESD22-A113 CRM1076 Compound CEL9220HF cel-9220HF cel9220 JESD-22-A113 JESD22-A102
Contextual Info: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1007-02 Product Affected: Date Effective: Contact: Title: Phone #: Fax #: E-mail: DATE: 2-Aug-2010 MEANS OF DISTINGUISHING CHANGED DEVICES:

bt165

Abstract: diode SMD MARKING CODE dl
Contextual Info: INTEGRATED CIRCUITS 74ABT16500C 74ABTH16500C 18-bit universal bus transceiver 3-State Product specification Supersedes data of 1997 Jun 12 IC23 Data Handbook Philips Semiconductors 1998 Feb 27 Philips Semiconductors Product specification 18-bit universal bus transceiver (3-State)

land pattern ssop28

Abstract: SO18W IPC-SM-782 SSOP-20 land pattern so18w SSOP20 LAND PATTERN
Contextual Info: SOLDER PAD RECOMMENDATIONS FOR SURFACE-MOUNT DEVICES By Wm. P. Klein, P.E. Factors to consider when determining the dimensions of the solder pads include part dimension tolerances, PCB production tolerances, and accuracy-of-placement tolerances. Figure 2 shows how placement accuracy can affect solder

diode SMD MARKING CODE dl

Abstract: 1a6 SMD diode BT166
Contextual Info: INTEGRATED CIRCUITS 74ABT16646 74ABTH16646 16-bit bus transceiver/register 3-State Product specification Supersedes data of 1995 Aug 17 IC23 Data Handbook Philips Semiconductors 1998 Feb 27 Philips Semiconductors Product specification 74ABT16646 74ABTH16646

land pattern ssop28

Abstract: land pattern for SSOP16 SBFA015A SSOP20 LAND PATTERN land pattern so18w SO18 TI smd sot 23/5 IPC-SM-782 so24w land pattern for SSOP56
Contextual Info: Application Report SBFA015A - January 1998 - Revised May 2003 SOLDER PAD RECOMMENDATIONS FOR SURFACE-MOUNT DEVICES By Wm. P. Klein, P.E. Cost and performance requirements continue to push the packaging of electronic systems into smaller and smaller spaces. At one time, the standard center-to-center pin spacing was 100 mils 0.1" on through-hole parts (DIPs).

12B2 Diode

Abstract: JESD22-A114E HBM 10A1 10B1 CBT16212 CBT16212DGG CBT16212DL JESD22-A114E JESD78 SSOP56
Contextual Info: CBT16212 24-bit bus exchange switch with 12-bit output enables Rev. 02 — 3 November 2008 Product data sheet 1. General description The CBT16212 provides 24 bits of high-speed TTL-compatible bus switching or exchanging. The low ON resistance of the switch allows connections to be made with

Contextual Info: CBT16212 24-bit bus exchange switch with 12-bit output enables Rev. 02 — 3 November 2008 Product data sheet 1. General description The CBT16212 provides 24 bits of high-speed TTL-compatible bus switching or exchanging. The low ON resistance of the switch allows connections to be made with

land pattern ssop28

Abstract: SO18W SSOP20 LAND PATTERN so24w SO20w package 11-365 land pattern for SSOP smd sot 23/5 IPC-SM-782 SSOP-20
Contextual Info: SOLDER PAD RECOMMENDATIONS FOR SURFACE-MOUNT DEVICES By Wm. P. Klein, P.E. Factors to consider when determining the dimensions of the solder pads include part dimension tolerances, PCB production tolerances, and accuracy-of-placement tolerances. Figure 2 shows how placement accuracy can affect solder

Contextual Info: INTEGRATED CIRCUITS 74ABT16899 74ABTH16899 18-bit latched transceiver with 16-bit parity generator/checker 3-State Product specification Supersedes data of 1997 Mar 28 IC23 Data Handbook Philips Semiconductors 1998 Feb 25 Philips Semiconductors Product specification