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    STMICROELECTRONICS MARKING RULE Search Results

    STMICROELECTRONICS MARKING RULE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MG8097/B Rochester Electronics LLC 8097 - Math Coprocessor - Dual marked (8506301ZA) Visit Rochester Electronics LLC Buy
    5490/BCA Rochester Electronics LLC 5490 - Decade Counter - Dual marked (M38510/01307BCA) Visit Rochester Electronics LLC Buy
    5405/BCA Rochester Electronics LLC 5405 - Gate - Dual marked (M38510/00108BCA) Visit Rochester Electronics LLC Buy
    54AC20/SDA-R Rochester Electronics LLC 54AC20/SDA-R - Dual marked (M38510R75003SDA) Visit Rochester Electronics LLC Buy
    UHD503R/883 Rochester Electronics LLC UHD503R/883 - Dual marked (5962-8855101CA) Visit Rochester Electronics LLC Buy

    STMICROELECTRONICS MARKING RULE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    STMicroelectronics device marking

    Abstract: STMicroelectronics marking
    Text: QNEP0001 QUALITY NOTE Low Voltage UV EPROM and OTP EPROM Vcc Range Improvement During the 1999 the upgrade of the EPROM family from CMOS E6-U10 to CMOS E6-U30 was completed and all the E6-U30 product versions were passed to production. The CMOS E6-U30 is a 0.4µm process, with more severe pholitographic rules than the previous


    Original     		PDF QNEP0001 E6-U10 E6-U30 85ions STMicroelectronics device marking STMicroelectronics marking

    M27W401

    Abstract: PDIP32 PLCC32 QNEP0001 STMicroelectronics m27 marking STMicroelectronics device marking
    Text: QNEP0001 QUALITY NOTE  Low Voltage UV EPROM and OTP EPROM Vcc Range Improvement During the 1999 the upgrade of the EPROM family from CMOS E6-U10 to CMOS E6-U30 was completed and all the E6-U30 product versions were passed to production. The CMOS E6-U30 is a 0.4µm process, with more severe pholitographic rules than the previous


    Original     		PDF QNEP0001 E6-U10 E6-U30 M27W401 PDIP32 PLCC32 QNEP0001 STMicroelectronics m27 marking STMicroelectronics device marking

    STMicroelectronics smd marking code

    Abstract: smd marking code stmicroelectronics BGA bga 10x13 BGA 15X15 BGA 23X23 HEPTAWATT SMD Marking STMicroelectronics tqfp INFINEON package tqfp PART MARKING PLCC Part Marking STMicroelectronics Date Code Marking STMicroelectronics PACKAGE DPAK
    Text: PRODUCT/PROCESS CHANGE NOTIFICATION PCN MLD-MIC/05/943 Notification Date 02/23/2005 CONVERSION TO PB-FREE PRODUCTION MIC - MICROCONTROLLERS 1/4 PCN MLD-MIC/05/943 - Notification Date 02/23/2005 Table 1. Change Identification Product Identification Product Family/Commercial Product


    Original     		PDF MLD-MIC/05/943 MLD-MIC/05/943 STMicroelectronics smd marking code smd marking code stmicroelectronics BGA bga 10x13 BGA 15X15 BGA 23X23 HEPTAWATT SMD Marking STMicroelectronics tqfp INFINEON package tqfp PART MARKING PLCC Part Marking STMicroelectronics Date Code Marking STMicroelectronics PACKAGE DPAK

    STMicroelectronics smd marking code

    Abstract: BGA and QFP Package 14x14 STMICROELECTRONICS MSL STMicroelectronics date code tssop-14 HiQuad package STMicroelectronics pentawatt date code opto mold compound infineon msl TQFP 14X20 ST TSSOP Marking
    Text: PRODUCT/PROCESS CHANGE NOTIFICATION PCN CRP/04/744 LEAD-FREE CONVERSION PROGRAM Compliance with RoHS 1 1 RoHS = Restriction of the use of certain Hazardous Substances European directive 2002/95/EC November 18, 2004 Page 1/12 2004 STMicroelectronics - All Rights Reserved


    Original     		PDF CRP/04/744 2002/95/EC) STMicroelectronics smd marking code BGA and QFP Package 14x14 STMICROELECTRONICS MSL STMicroelectronics date code tssop-14 HiQuad package STMicroelectronics pentawatt date code opto mold compound infineon msl TQFP 14X20 ST TSSOP Marking

    MARKING code mx stmicroelectronics

    Abstract: STMicroelectronics marking rule STMicroelectronics mx marking Marking STMicroelectronics QFN code mx stmicroelectronics
    Text: EMIF06-1502M12 IPAD 6 line low capacitance EMI filter and ESD protection in Micro QFN package Main product characteristics 12 1 Where EMI filtering in ESD sensitive equipment is required: 11 2 • LCD & CAMERA for Mobile phones 9 Computers and printers


    Original     		PDF EMIF06-1502M12 EMIF06-1502M12 MARKING code mx stmicroelectronics STMicroelectronics marking rule STMicroelectronics mx marking Marking STMicroelectronics QFN code mx stmicroelectronics

    MARKING code mx stmicroelectronics

    Abstract: J-STD-004 Marking STMicroelectronics QFN EMIF04-1502M8 JESD97
    Text: EMIF04-1502M8 IPAD 4 line low capacitance EMI filter and ESD protection in Micro QFN package Main product characteristics 1 8 Where EMI filtering in ESD sensitive equipment is required: 7 GND 2 GND • LCD & CAMERA for Mobile phones 5 3 ■ Computers and printers


    Original     		PDF EMIF04-1502M8 EMIF04-1502M8 MARKING code mx stmicroelectronics J-STD-004 Marking STMicroelectronics QFN JESD97

    Tape Resistivity 10E8 Ohm 10E4

    Abstract: STMicroelectronics smd marking code smd diode order marking code stmicroelectronics 10E12 10E4 10E8 AN1235 IEC286-3 J-STD-020A Lead Free reflow soldering profile BGA
    Text: AN1235 APPLICATION NOTE ASD and IPAD™ FLIP-CHIP: PACKAGE DESCRIPTION AND RECOMMENDATIONS FOR USE I - INTRODUCTION The competitive market of portable equipment, notably the mobile phone market, is driven by a challenging development of highly integrated products. To allow manufacturers of portable equipment to reduce


    Original     		PDF AN1235 Tape Resistivity 10E8 Ohm 10E4 STMicroelectronics smd marking code smd diode order marking code stmicroelectronics 10E12 10E4 10E8 AN1235 IEC286-3 J-STD-020A Lead Free reflow soldering profile BGA

    AN1547

    Abstract: IEC286-3 ATSM-D638
    Text: AN1547 APPLICATION NOTE Flip-Chip 170µm recommendations for Audio Power Amplifier by Jean-Marc BUGNARD 1 - INTRODUCTION 2 - PRODUCT DESCRIPTION The competitive market of portable equipment, notably the mobile phone market, is driven by a challenging development of highly integrated


    Original     		PDF AN1547 AN1547 IEC286-3 ATSM-D638

    J-STD-020A

    Abstract: pcb design 0,5 mm pitch 5x5 matrix STM top-side marking 10E12 10E4 10E8 AN1235 IEC286-3 Tape Resistivity 10E8 Ohm 10E4 iec 286-3 stmicroelectronics
    Text: AN1235 APPLICATION NOTE  ASD , IPAD FLIP-CHIP: PACKAGE DESCRIPTION AND RECOMMENDATIONS FOR USE I - INTRODUCTION The competitive market of portable equipment, notably the mobile phone market, is driven by a challenging development of highly integrated products. To allow manufacturers of portable equipment to reduce the


    Original     		PDF AN1235 J-STD-020A pcb design 0,5 mm pitch 5x5 matrix STM top-side marking 10E12 10E4 10E8 AN1235 IEC286-3 Tape Resistivity 10E8 Ohm 10E4 iec 286-3 stmicroelectronics

    AN1547

    Abstract: IEC286-3
    Text: AN1547 APPLICATION NOTE Flip-Chip 170µm recommendations for Audio Power Amplifier by Jean-Marc BUGNARD 1 - INTRODUCTION The competitive market of portable equipment, notably the mobile phone market, is driven by a challenging development of highly integrated


    Original     		PDF AN1547 AN1547 IEC286-3

    AN1235

    Abstract: IEC286-3 iec 286-3 stmicroelectronics
    Text: AN1235 APPLICATION NOTE  A.S.D. FLIP-CHIP CSP:PACKAGE DESCRIPTION AND RECOMMENDATIONS FOR USE INTRODUCTION The competitive market of portable equipment, notably the mobile phone market, is driven by a challenging development of highly integrated products. To allow manufacturers of portable equipment to


    Original     		PDF AN1235 AN1235 IEC286-3 iec 286-3 stmicroelectronics

    Untitled

    Abstract: No abstract text available
    Text: AN1235 APPLICATION NOTE A.S.D. FLIP-CHIP CSP:PACKAGE DESCRIPTION AND RECOMMENDATIONS FOR USE INTRODUCTION The competitive market of portable equipment, notably the mobile phone market, is driven by a challenging development of highly integrated products. To allow manufacturers of portable equipment to


    Original     		PDF AN1235

    AN1553

    Abstract: IEC286-3 sn63pb37 SMD ST MICROELECTRONICS TOPSIDE MARKING STMicroelectronics
    Text: AN1553 APPLICATION NOTE Flip-Chip 300µm recommendations for Audio Power Amplifier by Jean-Marc BUGNARD 1 - INTRODUCTION The competitive market of portable equipment, notably the mobile phone market, is driven by a challenging development of highly integrated


    Original     		PDF AN1553 AN1553 IEC286-3 sn63pb37 SMD ST MICROELECTRONICS TOPSIDE MARKING STMicroelectronics

    STMicroelectronics smd marking code

    Abstract: TOPSIDE MARKING STMicroelectronics smd marking code stmicroelectronics AN1553 IEC286-3 SMD ST MICROELECTRONICS STMicroelectronics marking code date BGA
    Text: AN1553 APPLICATION NOTE Flip-Chip 300µm recommendations for Audio Power Amplifier by Jean-Marc BUGNARD 1 - INTRODUCTION 2 - PRODUCT DESCRIPTION The competitive market of portable equipment, notably the mobile phone market, is driven by a challenging development of highly integrated


    Original     		PDF AN1553 STMicroelectronics smd marking code TOPSIDE MARKING STMicroelectronics smd marking code stmicroelectronics AN1553 IEC286-3 SMD ST MICROELECTRONICS STMicroelectronics marking code date BGA

    TSOP32 Package

    Abstract: M29F002B M29W022B PDIP32 PLCC32 QRFL0014 TSOP32 PLCC32 package m29f002
    Text: QRFL0014 QUALIFICATION REPORT M29F002B, M29W022B T6X-U35: 2 Mbit x8 Single Supply Flash Memory INTRODUCTION The M29F002B and M29W022B are 2 Mbit Single Supply (respectively 5V and 3V) Flash memory products with Boot Block partitioning and organized as 256 KByte of 8 bits each. They can be programmed


    Original     		PDF QRFL0014 M29F002B, M29W022B T6X-U35: M29F002B T6X-U35 TSOP32 Package PDIP32 PLCC32 QRFL0014 TSOP32 PLCC32 package m29f002

    EIA 763

    Abstract: AN2348 EIA standards 783 STMicroelectronics smd marking code WLCSP stencil design 10E12 10E4 10E8 AN1235 ANTISTATIC
    Text: AN2348 Application note IPAD and ASD Application Specific Devices 400 µm Flip-Chip: Package description and recommendations for use Introduction This document provides package and usage recomendation information for 400 µm pitch Flip-Chips. For information on 500 µm FlipChips, see Application note AN1235.


    Original     		PDF AN2348 AN1235. EIA 763 AN2348 EIA standards 783 STMicroelectronics smd marking code WLCSP stencil design 10E12 10E4 10E8 AN1235 ANTISTATIC

    EIA 763

    Abstract: EIA-481-C EIA standards 783 underfill WLCSP stencil design 10E12 10E4 10E8 AN1235 AN2348
    Text: AN1235 Application note IPAD and ASD Application Specific Devices 500 µm Flip-Chip: Package description and recommendations for use Introduction This document provides package and usage recomendation information for 500 µm pitch Flip-Chips. For information on 400 µm FlipChips, see Application note AN2348.


    Original     		PDF AN1235 AN2348. EIA 763 EIA-481-C EIA standards 783 underfill WLCSP stencil design 10E12 10E4 10E8 AN1235 AN2348

    Zeonex E48R

    Abstract: makrolon 2405 bayer makrolon 2405 noryl n110 Zeonex e48r BS308 phone 14 pin vga camera pinout bayer makrolon 2405 ir micron VGA
    Text: VS6552 VGA Color CMOS Image Sensor Module FEATURES • Small physical size ■ Ultra low power standby mode ■ SmOP Small Optical Package technology featuring integrated lens ■ Class leading low light performance ■ VGA resolution sensor ■ Compatible with STV0974 companion mobile


    Original     		PDF VS6552 STV0974 STV0974 10-bit VS6552 Zeonex E48R makrolon 2405 bayer makrolon 2405 noryl n110 Zeonex e48r BS308 phone 14 pin vga camera pinout bayer makrolon 2405 ir micron VGA

    EMIF06-1005M12

    Abstract: JESD97 MARKING code mx stmicroelectronics
    Text: EMIF06-1005M12 IPAD 6 line low capacitance EMI filter and ESD protection in Micro QFN package Main product characteristics 12 1 Where EMI filtering in ESD sensitive equipment is required: 11 2 • LCD and CAMERA for Mobile phones 9 Computers and printers


    Original     		PDF EMIF06-1005M12 EMIF06-1005M12 JESD97 MARKING code mx stmicroelectronics

    MARKING code mx stmicroelectronics

    Abstract: EMIF04-1005M8 EMIF04-1502M8 JESD97
    Text: EMIF04-1005M8 IPAD 4 line low capacitance EMI filter and ESD protection in Micro QFN package Main product characteristics 8 Where EMI filtering in ESD sensitive equipment is required: 7 1 G ND 2 GND • LCD & CAMERA for Mobile phones 6 3 ■ Computers and printers


    Original     		PDF EMIF04-1005M8 EMIF04-1502M8 MARKING code mx stmicroelectronics EMIF04-1005M8 JESD97

    Untitled

    Abstract: No abstract text available
    Text: EMIF02-SPK01M6 2-line IPAD , EMI filter and ESD protection for speaker Features Pin 1 • EMI symmetrical I/O low-pass filter ■ High efficiency in EMI filtering ■ Very low PCB space consumption: 1.0 mm x 1.45 mm ■ Pitch 0.5 mm ■ Very thin package: 0.6 mm max


    Original     		PDF EMIF02-SPK01M6

    EMIF02-1003M6

    Abstract: JESD97 MX ST
    Text: EMIF02-1003M6 2 line IPAD , EMI filter and ESD protection in Micro QFN package Features • ■ ■ ■ ■ ■ ■ ■ ■ ■ Dual line EMI symmetrical I/O low-pass filter High efficiency in EMI filtering Very low PCB space consumption: 1.0 mm x 1.45 mm


    Original     		PDF EMIF02-1003M6 EMIF02-1003M6 JESD97 MX ST

    09ek

    Abstract: MARKING code mx stmicroelectronics EMIF04-1005M8 JESD97
    Text: EMIF04-1005M8 4-line IPAD low capacitance EMI filter and ESD protection in micro QFN package Features • EMI symmetrical I/O low-pass filter 8 ■ High efficiency in EMI filtering: -34 dB at frequencies from 900 MHz to 1.8 GHz 7 ■ Very low PCB space consumption:


    Original     		PDF EMIF04-1005M8 09ek MARKING code mx stmicroelectronics EMIF04-1005M8 JESD97

    EMIF04-1502M8

    Abstract: No abstract text available
    Text: EMIF04-1502M8 4-line IPAD low capacitance EMI filter and ESD protection in micro QFN package Features • EMI asymmetrical I/O low-pass filter 8 ■ High efficiency in EMI filtering 7 ■ Very low PCB space consumption: 1.7 mm x 1.5 mm 6 3 5 4 ■ Very thin package: 0.6 mm max


    Original     		PDF EMIF04-1502M8 EMIF04-1502M8