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    EME-7351

    Abstract: Sumitomo 1000 sumitomo epoxy sumitomo silver epoxy Compound JESD22-A112 EME7351 mold compound SUMITOMO 140C
    Text: Cypress Semiconductor Qualification Report QTP# 97351 VERSION 1.0 January, 1998 32 Ld TSOP Package - Sumitomo EME 7351 Mold Compound Anam, Korea Assembly Cypress Semiconductor Assembly: Anam, Korea Package: TSOP - Sumitomo EME-7351/S351 Mold Compound QTP# 97351, V. 1.0


    Original     		PDF EME-7351/S351 EME-7351 30C/60 CY7C109-ZC Sumitomo 1000 sumitomo epoxy sumitomo silver epoxy Compound JESD22-A112 EME7351 mold compound SUMITOMO 140C

    QMI 509 epoxy

    Abstract: SUMITOMO eme-6600hr 6600HR SOJ package MSL QMI 509 epoxy datasheet CY7C63001A-SC JESD22 EME6600HR mold compound EME 6600HR
    Text: Cypress Semiconductor Package Qualification Report QTP# 023401 VERSION 2.0 GI July, 2004 32-lead SOIC package using Sumitomo EME 6600HR Mold Compound, MSL1 Cypress Philippines CML-R CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Mira Ben-Tzur Principal Reliability Engineer


    Original     		PDF 32-lead 6600HR 28-44lead 635mils 01BLL-SI 610221877M CY62128BLL-SI QMI 509 epoxy SUMITOMO eme-6600hr SOJ package MSL QMI 509 epoxy datasheet CY7C63001A-SC JESD22 EME6600HR mold compound EME 6600HR

    EME 7320

    Abstract: Ablestik Ablestik 8361 7320 a144g SUMITOMO EME G A100A CY7C09579V-AC JESD22 ASE Cypress
    Text: Cypress Semiconductor Mold Compound Qualification Report QTP# 002403 VERSION 1.0 January, 2001 Sumitomo EME 7320 Mold Compound, MSL3 for DCD-Thin Quad Flat Pack, TQFP ASE Taiwan CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director


    Original     		PDF 160-lead CY7C375I-AC EME 7320 Ablestik Ablestik 8361 7320 a144g SUMITOMO EME G A100A CY7C09579V-AC JESD22 ASE Cypress

    PCN0702

    Abstract: SUMITOMO G700 SUMITOMO G600 SUMITOMO EME G700 sumitomo 6300h mold compound SUMITOMO EME G600 EME G600 material properties G600 mold compound mp8000ch4 sumitomo G700 Tg
    Text: Revision: 1.2.0 PROCESS CHANGE NOTIFICATION PCN0702 UPDATE MOLD COMPOUND CHANGE FOR PQFP, PDIP, AND RQFP PACKAGES Change Description: This is an update to PCN0702, published March, 2007. Altera is implementing mold compound material changes on the Plastic Quad Flat Pack PQFP , Plastic Dual In-Line


    Original     		PDF PCN0702 PCN0702, 6300HJ G700M PCN0702 MP8000CH4 48hrs) X10-5 UL-94 SUMITOMO G700 SUMITOMO G600 SUMITOMO EME G700 sumitomo 6300h mold compound SUMITOMO EME G600 EME G600 material properties G600 mold compound sumitomo G700 Tg

    PCN0404

    Abstract: SUMITOMO g700l sumitomo EME G700L G700L TQFP 144 PACKAGE Compound SUMITOMO mold compound TQFP 144 PACKAGE altera G700
    Text: PROCESS CHANGE NOTICE PCN0404 ADDITIONAL MOLD COMPOUND FOR TQFP 144 PACKAGE Change Description: The Sumitomo G700L mold compound is being added as additional mold compound choice for selected Altera devices in thin quad flat pack TQFP 144 lead packages assembled by


    Original     		PDF PCN0404 G700L PCN0404 SUMITOMO g700l sumitomo EME G700L TQFP 144 PACKAGE Compound SUMITOMO mold compound TQFP 144 PACKAGE altera G700

    HI-8010Q

    Abstract: HI3584PQI-10 HI3584PQT HI-3584PQT HI-3584PQTF-10 HI-3584PQI-10 HI-6110PQT 8583P 8010Q Moisture Sensitivity Level Rating
    Text: 52-Lead Quad Flat Pack QFP Package Transfer Product Change Notice PCN0805 (v1.0) September 12, 2008 Overview This notice describes the changes to the 52-Lead Quad Flat Pack (QFP) Package for the ARINC 429, MIL-STD 1553, and LCD Display Driver family of devices.


    Original     		PDF 52-Lead PCN0805 7351LS, 6600CGL, JESD46-C, QR-8013 HI-8010Q HI3584PQI-10 HI3584PQT HI-3584PQT HI-3584PQTF-10 HI-3584PQI-10 HI-6110PQT 8583P 8010Q Moisture Sensitivity Level Rating

    SUMITOMO EME G600

    Abstract: EME G600 Moisture Sensitivity Level Rating 8050P sumitomo lcd 1575P JESD46-C pc/SUMITOMO g600
    Text: 32 & 64-Lead Quad Flat Pack QFP Package Transfer Product Change Notice PCN0809 (v1.0) September 12, 2008 Overview This notice describes the changes to the 32-Lead & 64-Lead Quad Flat Pack (QFP) Package for the ARINC 429, MIL-STD 1553, Discrete to Digital and LCD Display Driver family of devices.


    Original     		PDF 64-Lead 32-Lead PCN0809 7351LS, JESD46-C, QR-8036 SUMITOMO EME G600 EME G600 Moisture Sensitivity Level Rating 8050P sumitomo lcd 1575P JESD46-C pc/SUMITOMO g600

    HI-3584APQT

    Abstract: HI-8010Q HI-3583APQT-15 sumitomo G700lx HI-3584APQI G700LX HI-3585PQTF HI-3584APQI-15 HI-8582PQIF Hi-3582APQI
    Text: 52 & 44 Lead Quad Flat Pack QFP MSL Improvement Product Change Notice PCN1006 (v1.0) October 01, 2010 Overview This notice describes the changes to the 52 & 44 Lead Quad Flat Pack (QFP) Package for the ARINC 429, MIL-STD 1553, and LCD Display Driver family of devices.


    Original     		PDF PCN1006 6600CGL G700LX 84-1LMISR4 HI-3587PQTF HI-3587PQM HI-3587PQMF HI-3588PQI HI-3588PQIF HI-3588PQT HI-3584APQT HI-8010Q HI-3583APQT-15 sumitomo G700lx HI-3584APQI G700LX HI-3585PQTF HI-3584APQI-15 HI-8582PQIF Hi-3582APQI

    CRM1076NS

    Abstract: Sumitomo CRM1076NS sumitomo CRM-1076NS crm-1076NS sumitomo crm SUMITOMO BAKELITE CRM-1076NS CRM 1076NS CRM1033D crm1076 sumitomo 1076NS
    Text: THYRISTOR SURGE PROTECTORS February 2007 Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team Thyristor Surge Protector PCN Tracking Number 44 — Alternative Die Attach Adhesive Material


    Original     		PDF MS012, CRM1076NS, MS-012, TISP7082F3D-S TISP7125F3DR-S TISP7125F3D-S TISP7150F3DR-S TISP7150F3D-S TISP7180F3DR-S TISP7180F3D-S CRM1076NS Sumitomo CRM1076NS sumitomo CRM-1076NS crm-1076NS sumitomo crm SUMITOMO BAKELITE CRM-1076NS CRM 1076NS CRM1033D crm1076 sumitomo 1076NS

    Sumitomo CRM1076NS

    Abstract: CRM1076NS crm-1076NS sumitomo crm-1076Ns sumitomo crm CRM-1033 SUMITOMO BAKELITE CRM-1076NS 1076ns CRM*1076 CRM1076
    Text: THYRISTOR SURGE PROTECTORS February 2007 Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team Thyristor Surge Protector PCN Tracking Number 44 — Alternative Die Attach Adhesive Material


    Original     		PDF MS012, CRM1076NS, MS-012, TISP7082F3D-S TISP7125F3DR-S TISP7125F3D-S TISP7150F3DR-S TISP7150F3D-S TISP7180F3DR-S TISP7180F3D-S Sumitomo CRM1076NS CRM1076NS crm-1076NS sumitomo crm-1076Ns sumitomo crm CRM-1033 SUMITOMO BAKELITE CRM-1076NS 1076ns CRM*1076 CRM1076

    eftec

    Abstract: Eftec 64t MLX90222 6300H eme 6300h
    Text:           • ■ ■ ■ ■      Chopper Stabilized Amplifier Stage New Miniature Package/Thin, High Reliability Package CMOS for Optimum Stability, Quality and Cost Low Power Consumption


    Original     		PDF MLX90222 -40oC MLX90222 6300H 254mm 04/Mar/99 eftec Eftec 64t 6300H eme 6300h

    SUMITOMO G700

    Abstract: SUMITOMO EME G700 a2200 G700 sumitomo 6600h 84-1 LMIs Ablebond ABLEBONd 84-1 ablestick M02066-82
    Text: September 23, 2009 CN-092309 Customer Notification M02066-82, M02066G-82, M02068-15-T, M02068G-15-T Additional Assembly and Test Site Dear Valued Customer: This notification is for the purpose of informing you of an additional assembly and test site for the M02066-82,


    Original     		PDF CN-092309 M02066-82, M02066G-82, M02068-15-T, M02068G-15-T M02068G-15-T, SUMITOMO G700 SUMITOMO EME G700 a2200 G700 sumitomo 6600h 84-1 LMIs Ablebond ABLEBONd 84-1 ablestick M02066-82

    MLX90222

    Abstract: eme 6300h Temperature controller schematic
    Text: MLX90222 Low Power Switch with Sleep Controller Features and Benefits Chopper Stabilized Amplifier Stage New Miniature Package/Thin, High Reliability Package CMOS for Optimum Stability, Quality and Cost Low Power Consumption On Chip Duty Cycle Controller Applications


    Original     		PDF MLX90222 MLX90222 -40oC 6300H 254mm 04/Apr/01 eme 6300h Temperature controller schematic

    ablebond 84-3J

    Abstract: SUMITOMO g600f CRM-1151 ablebond 8006ns sumitomo EME G600 sumitomo crm ablebond ablestik 8006ns 84-3j hi-1579psm SUMITOMO CRM-1151
    Text: MIL-STD-1553 Bus Transceivers Plastic SOIC Package Transfer Product Change Notice PCN1201 v1.0 January 20, 2012 Overview The purpose of this notification is to describe the changes to the 20 Pin Plastic Small Outline ESOIC-WB packages for the MIL-STD-1553 family of devices.


    Original     		PDF MIL-STD-1553 PCN1201 20L-SOIC ablebond 84-3J SUMITOMO g600f CRM-1151 ablebond 8006ns sumitomo EME G600 sumitomo crm ablebond ablestik 8006ns 84-3j hi-1579psm SUMITOMO CRM-1151

    Untitled

    Abstract: No abstract text available
    Text: 0/;<3555# /RZ#3RZHU#6ZLWFK#ZLWK#6OHHS#&RQWUROOHU# HDWXUHV#DQG#%HQHILWV# # \ U D LQ LO P H U 3 Chopper Stabilized Amplifier Stage New Miniature Package/Thin, High Reliability Package CMOS for Optimum Stability, Quality and Cost Low Power Consumption On Chip Duty Cycle Controller


    Original     		PDF MLX90222 -40oC 6300H MLX90222 03/Oct/00

    MLX90222

    Abstract: No abstract text available
    Text: 0/;<3555# /RZ#3RZHU#6ZLWFK#ZLWK#6OHHS#&RQWUROOHU# HDWXUHV#DQG#%HQHILWV# # \ U D LQ LO P H U 3 Chopper Stabilized Amplifier Stage New Miniature Package/Thin, High Reliability Package CMOS for Optimum Stability, Quality and Cost Low Power Consumption On Chip Duty Cycle Controller


    Original     		PDF MLX90222 MLX90222 -40oC 6300H 254mm 14/Apr/00

    UGN3075

    Abstract: HAL125 u18 hall US1881UA US1881 ss41 hall Transistor sS41 melexis replace HAL105 Cross Reference sot23
    Text: US1881 CMOS Multi-Purpose Latch Features and Benefits Chopper stabilized amplifier stage Optimized for BDC motor applications New miniature package / thin, high reliability package Operation down to 3.5V CMOS for optimum stability, quality and cost Applications


    Original     		PDF US1881 MLX1881 -20oC -40oC UGN3075 HAL125 u18 hall US1881UA US1881 ss41 hall Transistor sS41 melexis replace HAL105 Cross Reference sot23

    US1881

    Abstract: UGN-3075
    Text: US1881 CMOS Multi-Purpose Latch Features and Benefits## n n n n n Chopper stabilized amplifier stage Optimized for BDC motor applications New miniature package / thin, high reliability package Operation down to 3.5V CMOS for optimum stability, quality and cost


    Original     		PDF US1881 US1881 MLX1881 -20oC -40oC UGN-3075

    ic 9022

    Abstract: MLX90223ESO
    Text: MLX90223 Two Wire Switch# Features and Benefits # \ U D LQ LO P H U 3 Two wire operation CMOS for optimum stability, quality and cost New miniature package / thin, high reliability package Operation down to 3.5V Applications Automotive reed switch replacement


    Original     		PDF MLX90223 MLX90223ESO MLX90223EUA 6300H. OT-23 MLX90223 03/Oct/00 ic 9022

    Eftec

    Abstract: Eftec ra 310 SUMITOMO EME G
    Text: MLX90223 Two Wire Switch# Features and Benefits • ■ ■ ■ # \ U D LQ LO P H U 3 Two wire operation CMOS for optimum stability, quality and cost New miniature package / thin, high reliability package Operation down to 3.5V Applications ■ ■ ■ Automotive reed switch replacement


    Original     		PDF MLX90223 MLX90223ESO MLX90223EUA 6300H. OT-23 MLX90223 16/Decv/99 Eftec Eftec ra 310 SUMITOMO EME G

    u28 sensor hall

    Abstract: u28 hall UGN3132 UGN3132/33
    Text: US2881/2882 CMOS High Sensitivity Latch Features and Benefits n n n n n n n Chopper stabilized amplifier stage Optimized for BDC motor applications New miniature package / thin, high reliability package Operation down to 3.5V CMOS for optimum stability, quality, and cost


    Original     		PDF US2881/2882 US2881 US2882 u28 sensor hall u28 hall UGN3132 UGN3132/33

    u28 sensor hall

    Abstract: u28 hall UGN3132 hall u28 u28 127 hall US2881UA 22323 US2881SO u28 hall SENSOR sot transistor pinout
    Text: US2881/2882 CMOS High Sensitivity Latch Features and Benefits • ■ ■ ■ ■ ■ ■ Chopper stabilized amplifier stage Optimized for BDC motor applications New miniature package / thin, high reliability package Operation down to 3.5V CMOS for optimum stability, quality, and cost


    Original     		PDF US2881/2882 US2881 US2882 u28 sensor hall u28 hall UGN3132 hall u28 u28 127 hall US2881UA 22323 US2881SO u28 hall SENSOR sot transistor pinout

    marking 23ab

    Abstract: eftec 6300H marking Z1 sot mlx 220 eme sot23
    Text: 0/;<3556# 7ZR#:LUH#6ZLWFK# HDWXUHV#DQG#%HQHILWV# • ■ ■ ■ # \ U D LQ LO P H U 3 Two Wire operation CMOS for Optimum Stability, Quality and Cost New Miniature Package/Thin, High Reliability Package# Operation Down to 3.5V # $SSOLFDWLRQV# ■ ■ ■


    Original     		PDF MLX90223 -40oC MLX90223ESO 6300H 254mm MLX90223 08/Nov/99 marking 23ab eftec 6300H marking Z1 sot mlx 220 eme sot23

    ss41 hall effect sensor

    Abstract: UGN3075 U38 HALL SOT23 hall ss41 hall hall effect sensor ugn3175 Bipolar Hall Hall Sensor 4-lead Transistor hall ss41 3 PIN hall effect sensor
    Text: US3881 CMOS Low Voltage Hall Effect Latch Features and Benefits n n n n n Chopper stabilized amplifier stage Optimized for BDC motor applications New miniature package / thin, high reliability package Operation down to 2.2V CMOS for optimum stability, quality, and cost


    Original     		PDF US3881 MLX3881 6300H. OT-23 US3881 ss41 hall effect sensor UGN3075 U38 HALL SOT23 hall ss41 hall hall effect sensor ugn3175 Bipolar Hall Hall Sensor 4-lead Transistor hall ss41 3 PIN hall effect sensor