SUMITOMO EPOXY Search Results

sumitomo epoxy

Abstract: sumitomo EME-7351LS EME7351LS EME7351UT Compound EME-7351
Contextual Info: TO: ALL PERICOM CUSTOMERS SUBJECT: Sumitomo Epoxy Mold Compound Issue – EME7351UT Pericom’s current plastic encapsulated, Surface Mount Technology SMT packaged peripheral leaded products do not utilize Sumitomo’s EME7351UT mold compound. This epoxy uses a Particled Phosphorus Flame Retardant Agent, which was found by some

EME-7351

Abstract: Sumitomo 1000 sumitomo epoxy sumitomo silver epoxy Compound JESD22-A112 EME7351 mold compound SUMITOMO 140C
Contextual Info: Cypress Semiconductor Qualification Report QTP# 97351 VERSION 1.0 January, 1998 32 Ld TSOP Package - Sumitomo EME 7351 Mold Compound Anam, Korea Assembly Cypress Semiconductor Assembly: Anam, Korea Package: TSOP - Sumitomo EME-7351/S351 Mold Compound QTP# 97351, V. 1.0

sumitomo 6600

Abstract: sumitomo epoxy 6600 4835 sumitomo EME 6600 sumitomo epoxy 8361H CY74FCT2245ATQC CY74FCT2646ATQC CY7C199-12VC JESD22
Contextual Info: Cypress Semiconductor Qualification Report QTP# 99101 VERSION 1.0 May, 1999 Sumitomo EME 6600CR Molding Compound Cypress Philippines CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Cypress Semiconductor Quality and Reliability Department Cypress Semiconductor

sumitomo epoxy

Abstract: C7025 Compound c7025 heraeus 4851025 SUMITOMO 7351 140C 8361H JESD22 CF-2071 sumitomo
Contextual Info: Cypress Semiconductor Qualification Report QTP# 99302 VERSION 1.0 November, 1999 32L Small Thin Small Outline Package Sumitomo 7351 Molding Compound Cypress Philippines CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director 408 432-7069

sumitomo epoxy

Abstract: 7C109A CY7C109 EME TI
Contextual Info: Qualification Report January 1997 QTP# 95483, Version 1.0 SUMITOMO EME-9300 Low Alpha Molding Compound PRODUCT DESCRIPTION (for qualification) Information provided in this document is intended for generic qualification and technically describes the Cypress part

sumitomo epoxy

Abstract: EME 7320 7320 8361H CY7C375-AC JESD22
Contextual Info: Cypress Semiconductor Package Qualification Report QTP# 000303 VERSION 1.1 March, 2000 Up to160 Lead Thin Quad Flat Pack Sumitomo EME 7320 Mold Compound ASE Taiwan CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director 408 432-7069

QMI 509 epoxy

Abstract: SUMITOMO eme-6600hr 6600HR SOJ package MSL QMI 509 epoxy datasheet CY7C63001A-SC JESD22 EME6600HR mold compound EME 6600HR
Contextual Info: Cypress Semiconductor Package Qualification Report QTP# 023401 VERSION 2.0 GI July, 2004 32-lead SOIC package using Sumitomo EME 6600HR Mold Compound, MSL1 Cypress Philippines CML-R CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Mira Ben-Tzur Principal Reliability Engineer

EME-7351

Abstract: 140C 8361H JESD22 sumitomo silver epoxy
Contextual Info: Cypress Semiconductor Qualification Report QTP# 97514 VERSION 1.0 July, 1998 28 Ld TSOP Package Sumitomo EME-7351 Molding Compound Cypress Philippines Assembly Cypress Semiconductor Assembly: Cypress Philippines Package: 28 Ld TSOP QTP# 97514, V. 1.0 Page 2 of 4

PCN0602

Abstract: sumitomo G700 sumitomo G700 Tg sumitomo epoxy sumitomo g700 type g700 mold compound G700 SUMITOMO Tg G700 sumitomo g700 mold compound sumitomo epoxy G700
Contextual Info: PROCESS CHANGE NOTIFICATION PCN0602 MOLD COMPOUND CHANGE FOR CYCLONE II PQFP & TQFP PACKAGES Change Description: Altera is adopting the Sumitomo G700 series mold compound as the standard mold material on its Cyclone™ II low-k dielectric Plastic Quad Flat Pack PQFP and Plastic Thin Quad

sumitomo epoxy 6300h

Abstract: sumitomo epoxy wafer LTO CY74FCT16244T EME-6300H hysol sumitomo 6300h mold compound
Contextual Info: Qualification Report March, 1995 QTP# 94432/94434 Version 1.0 16-Bit Buffers/Line Drivers/Transceiver CYPRESS SEMICONDUCTOR PAGE 3 PRODUCT DESCRIPTION for qualification Information provided in this document is intended for generic qualification and technically describes the Cypress part

74CT573

Abstract: MALAYSIA CDIP28 TSOC 6 socket 74FCT191 74FCT543 hysol sumitomo epoxy sumitomo epoxy 6300h TSOC
Contextual Info: Qualification Report January, 1995 QTP# 94048 Version 1.3 FAB3 0.65 µm FCT-T PRODUCTS CYPRESS SEMICONDUCTOR PAGE 3 PRODUCT DESCRIPTION for qualification Information provided in this document is intended for generic qualification and technically describes the Cypress part

CY7C190

Abstract: cy7c189 sumitomo silver epoxy 7C189 EME-6300H UL-94V0 lc 245a CY27S07 dynamic ram cmos 16pin 7C190
Contextual Info: Qualification Report January 1992 QTP 90313 64 Bit Static RAM Family MARKETING PART NBR DEVICE DESCRIPTION CY7C189 Inverted R/W CY7C190 R/W Version 1.1 PRODUCT DESCRIPTION for qualification Information provided in this document is intended for generic qualification and technically describes the Cypress part

sumitomo epoxy

Abstract: CY74FCT16543T EME-6300H O5611 MANUFACTURER AND SUPPLIER LOCATION INFORMATION
Contextual Info: Qualification Report July, 1995 QTP# 94431 Version 1.0 56-Pins SSOP package CYPRESS SEMICONDUCTOR PAGE 3 PRODUCT DESCRIPTION for qualification Information provided in this document is intended for generic qualification and technically describes the Cypress part

CY7C128A 16k sram

Abstract: CY7C128A SRAM CY7C128A CY7C167A CY7C168A CY7C169A CY7C170A CY7C171A CY7C172A EME-6300H
Contextual Info: Qualification Report June, 1994, QTP# 91423/93201 Version 1.1 16K Chop Redesign MARKETING PART NUMBER DEVICE DESCRIPTION CY7C128A 2K x 8 Static R/W RAM CY7C167A 16K x 1 Static R/W RAM CY7C168A 4K x 4 Static RAM CY7C169A 4K x 4 Static RAM CY7C170A 4K x 4 Static RAM

CY7C287

Abstract: CY7C28x CY7C277
Contextual Info: Qualification Report December, 1993, QTP 92441 Version 1.1 CY7C27x/CY7C28x FAB2 QUAL MARKETING PART NUMBER DEVICE DESCRIPTION CY7C271/274 32K x 8 PROM Power Switch and Reprogrammable CY7C277/279 Reprogrammable 32K x 8 Registered PROM CY7C285 CY7C286/287 64K x 8 Reprogrammable Fast Column Access PROM

Yamaha nozzle

Contextual Info: Precision Navigation and Pointing Gyroscope CRM200 Technical Datasheet www.pinpoint-gyro.com 1 General Description Actual size Features • Small 6.3 x 5.5 x 2.7mm • Proven and robust silicon MEMS vibrating ring gyro • Low bias instability (24º/hr) over short integration

CY7C191

Abstract: CY7C192 CY7C194 CY7C195 CY7C196 CY7C197 CY7C198 CY7C199 EME-6300 eme-6300h
Contextual Info: Qualification Report QTP# 94444 Version 1.0 February, 1995 256K SRAM, RAM 2.5 TECHNOLOGY MARKETING PART NUMBER DEVICE DESCRIPTION CY7C191 64K x 4 Separate IO with transparent write CY7C192 64K x 4 Separate IO without transparent write CY7C194 64K x 4 Common IO with no OE

sumitomo epoxy 6300h

Abstract: sumitomo epoxy eme6300h sumitomo 6300h mold compound prime p27 EME-6300H mos die Sumitomo 1000
Contextual Info: Qualification Report May, 1993, QTP 92114 Version 1.0 2K X 16 PROM FAB2 QUALIFICATION MARKETING PART NUMBER DEVICE DESCRIPTION 7C258 2K x 16 Reprogrammable State Machine PROM 7C259 2K x 16 Reprogrammable State Machine PROM CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA:

DMU10-22-0100

Contextual Info: DMU10 Technical Datasheet Six Degrees of Freedom Precision MEMS Inertial Measurement Unit www.siliconsensing.com DMU10-01 DMU10-02 OEM Module Features 1 General Description • High performance six degrees of freedom 6-DOF MEMS IMU • 7 sensor inputs - Angular rate (x3)

cmos SRAM 35ns 8k X 8 dip

Abstract: 7C166 CY7C161 CY7C162 CY7C164 CY7C166 CY7C185 CY7C186 CY7C187 7C164
Contextual Info: Qualification Report January 1992 QTP 91094 64K SRAM FAMILY MARKETIN G DEVICE PART NBR DESCRIPTION CY7C161 16K x 4 SIO CY7C162 16K x 4 (SIO) CY7C164 16K x 4 CY7C166 (OE) CY7C185 8K x 8 CY7C186 8K x 8 (.6 DIP) CY7C187 64K x 1 Version 1.2 PRODUCT DESCRIPTION (for qualification)

EME-6300H

Abstract: sumitomo epoxy 6300h D284 J28S yc 504
Contextual Info: Reliability Report April 1994, QTP# 94183, Rev. 1.0 4K x 4 ECL STATIC RAM MARKETING PART NUMBERS CY10E484/CY10E484L CY100E484/CY100E484L CY101E484/CY101E484L CYPRESS SEMICONDUCTOR PAGE 2 PRODUCT DESCRIPTION for qualification Information provided in this document is intended for generic qualification and technically describes the Cypress part

Contextual Info: Precision Navigation and Pointing Gyroscope CRM102.1 Technical Datasheet www.siliconsensing.com 1 General Description Actual size Features • Small 5.7 x 4.8 x 1.2mm • Proven and robust silicon MEMS vibrating ring gyro • In-plane and orthogonal sensing options

Specification

Abstract: Angular Rate
Contextual Info: Precision Navigation and Pointing Gyroscope CRM202.1 Technical Datasheet www.siliconsensing.com 1 General Description Actual size Features • Small 6.3 x 2.7 x 5.5mm • Proven and robust silicon MEMS vibrating ring gyro • In-plane and orthogonal sensing options

7C185

Abstract: sumitomo epoxy 64K SRAM Cypress 7C166 7C164
Contextual Info: Qualification Report Nov 1993, QTP 92281 64K SRAM 256K "CHOP" Fab 3 (Bloomington, Mn) QUALIFICATION MARKETING PART NUMBER CY7C161/A* CY7C162/A* CY7C164/A* CY7C166/A* CY7C185/A* CY7C186/A* CY7C187/A* DEVICE DESCRIPTION 16K x 4 Static R/W RAM, Separate I/O