T6500 Search Results

SS65100-022F

Contextual Info: DATE REV ECN APP'D. BY 2 -1 7 -O B A1 - - 3 -2 0 -0 6 A2 7547 TRM .1 DO [2.54] 6 .050 [1.27] (7) E 1 1 1 1 1 1 1 Litt— ñ m H H .050 [1.Z7] 0 .035 [0,69] ± .0 0 3 [D.OB] (S ) I ( .065 [1.65] ) TYP. | ^ | $ 0 0 6 [¿1 5 ]] I Ì> M - f - 4 5.065 [1.65] ±.003 [0.00] (2)

Contextual Info: DATE REV ECN APP'D. BY 1/23/06 A1 7454- JM -.125 [3.18]+.010 [0.25] [— .020 [0.51] B NOTES: w t 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: X c s COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA

T650

Contextual Info: ß=l DATE REV ECN APP'D. BY 1/23/06 AO 7454- JM ^=1 .112 [2.B4]±.010 [0 2 5 ] - ,5 Z 5 [13.34]— -j □ B i — .122 [3.1D] 2 - . 6 4 7 [16.43] MIN— NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN

macbook pro 13

Abstract: mb166 ASUS eee PC 900 dell d630 toshiba 8893 macbook AMD turion 64 X2 ASUS X50Z compaq 510 ACER Aspire JDW50
Contextual Info: Acer Acer Acer Acer Aspire 5230 JAWD0 Aspire 5410T (MS2272) Aspire 5410TZ (MS2272) Aspire 5520 series (ICW50) 13.71 7.27 7.27 10.16 1.34 1.38 1.38 1.44 Acer Acer Acer Acer Acer Acer Acer Acer Acer Acer Acer Acer Acer Acer Acer Aspire 5635 (ZR6) Aspire 5710 series (JDW50)

Contextual Info: .535 [13.59] MAX. — DATE REV ECN APP'D. BY 1/23/06 A2 7454- JM - r B .251 [6.30] NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA SEE CHART FOR PART NUMBER

Contextual Info: DATE REV ECN APP'D . B Y 1/23/06 B2 7454 JM B — 1 .B70 [17.02] M A X— - -.125 [3.18]±.010 [0.25] s tr NOTES: 1. CONNECTOR MATERIALS: HOUSING: JE] BL THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN CONTACT PLATING: SELECTIVE GOLD IN CONTACT AREA

Contextual Info: DATE REV ECN APP'D. BY 1/23/06 B2 7454- JM B -— ,670 [17.02] M A X— - — .187 [4.75j±.m 0 [0.25] 1 « 1 c Til =b s o 1. CONNECTOR MATERIALS: HOUSING: I ° 1 — -A NOTES: THERMOPLASTIC UL94 V - 0 CONTACTS/SHIELD: i COPPER ALLOY SHIELD PLATING: NICKEL OR TIN

transistor marking 016b

Abstract: chn 501 telefunken ha 880 telefunken ta 750 amplifier
Contextual Info: TFDU6100/TFDS6500/T6500 Not for new designs Vishay Telefunken ▼ 5 V Fast Infrared Transceiver Module Family s ; FIR, 4 Mbit/s Description The TFDU6100, TFDS6500, and T6500 are a family of low-power infrared transceiver modules compliant to the IrDA 1.2 standard for fast infrared

SS-6566-NF-50

Contextual Info: -— .650 [16.51] MAX. .535 [13.59] MAX. — - in c t t i d i +.D2D [D.51] 125 [i1 B ] —.DIO [0.25] STEWART ' PATENTED ' 125 [3.1 B] 2 .100 [2.54] (10) DATE REV ECN APP’D. BY 4/11/03 A2 5913 RGC .05D [1.26] (5) .075 [1.92] *.035 [0.B9jt.003 [0.0B] ( 6 ) 1-0-10006 [0.15]|

T4 4c diode

Abstract: MT6510 MT6500
Contextual Info: MARKTECH INTERNATIONAL 571^55 1ÔE D DGGQ527 1 PHOTO IC COUPLER T-<+i -S3 T6500, MT6510 Unit in mm inches APPLICATIONS • • • • • DIGITAL LOGIC ISOLATION LINE RECEIVER FEEDBACK CONTROL POWER SUPPLY CONTROL SWITCHING POWER SUPPLY TRANSISTOR INVERTOR

PAL 012a

Abstract: 88E8001 HP C6602 ALC660 Asus C30023 MCP51 R30I R6015 C31002
Contextual Info: 5 A 4 3 2 A6Tc 1 REVISION: 2.1 128-BIT AMD S1 Channel A/B x16 D Unbuffer DDR2 SO-DIMM HyperTransport 200/400/800 MHz 638 PIN PACKAGE LVDS nVIDIA Gigabit Ethernet RTL8111B PCI-E x1 C51MV nVIDIA CRT PCI-E x16 G72MV BGA 468 C SDTV X8 /X4 HyperTransport 200/400/800

Contextual Info: DATE REV ECN APP'D. BY 1/23/06 A2 7454- JM .125 [3JS]=t.D10 [0 .2 5 ]— 1*.455 [11.56] MAX .020 [ 0 . 5 1 ] 7Z777> B STEIIARF P M E »TED NOTES: 1. CONNECTOR MATERIALS: HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: .050 [1.27] T YP— — TOL N O N -A C CU M

Contextual Info: DATE REV ECN APP'D. BY 1/23/06 A1 7454- JM B fa - . 6 7 0 [17.02] MAX— — 1 + + + + I i NOTES: ] ü JED 1. CONNECTOR MATERIALS: Œ L c — ,125 [3.10jt.O1O [0.25] EL HOUSING: THERMOPLASTIC UL94 V -0 CONTACTS/SHIELD: COPPER ALLOY SHIELD PLATING: NICKEL OR TIN

Marvell 88E1116

Abstract: D6603 ASUS ST6214 L7037 U7106 C51MV MCP51 19V DC 90w C7291 SI4925B
Contextual Info: 5 4 3 2 1 F3T Block Diagram CPU VCORE CPU S1g1 PAGE 61 D DDR2 16M*16 DDR2 16M*16 DDR2 16M*16 DDR2 16M*16 DDR2-667 Dual Channel DDR2 D SO-DIMM X 2 PAGE 5,6 PAGE 2,3,4 128bit Power On Sequence H.T 800 MHz PAGE 39 USB LVDS & INV PAGE 14 C51MV PCIE *16 G73M CRT & TV OUT

Contextual Info: 05 [1.27] & DATE REV ECN 10-7-D 2 B1 5599 TRM 2/17/04 B2 6342 TRM APP’D. BY PIN #1- S «L -10D [2.54] rfe rh tfc tfc *P T X X X SHIELD) ».062 t.003 [1.57 ±0.0B] (2 ) - I Yt\ (POSTS) * ^ 1(2)iiê] K c) ,125 [3.16 j i _L 1 r) V > ioT 1 as — .085 2.159]