TANAKA WIRE Search Results

tanaka gold wire

Abstract: tanaka wire tanaka bonding wire tanaka GPG wire tanaka wire 15 mils tanaka EN-4088Z SN74LS244 SN74LS244DW
Contextual Info: TEXAS INSTRUMENTS Qualification Notification of the Change from 0.95 mil Conventional Gold Bonding Wire to 0.80 mil Tanaka GPG Gold Alloy Bonding Wire for SLL Product June 23, 1997 Abstract Texas Instruments Standard Linear and Logic Products SLL has qualified the 0.80 mil Tanaka GPG

20N3

Abstract: tanaka wire
Contextual Info: DWG. NO. DO NOT SCALE DRAWING SD-55340-0 Z 3 EC NO. DRWN: CH'K: APPR: REVISED EC NQID200I-II02 DRWN; M TANAKA '01/02/15 CH 'K: MSASAO '01/ 02/15 APPR: H IK E S U G 1 '01/ 02/15 REVISED • - JD90523 EC NO, DRWN: M TANAKA '98/ 10/13 CH'K: MSASAO '98/10/13 APPRs

flying robot with camera

Abstract: Flying robot with wireless camera piezo gyro MEMS gyro sensor flying robot Piezoelectric mems accelerometer mobile control robot mems mems sensor for car robot with camera and sensor
Contextual Info: An industrial and applied review of new MEMS devices features Masako Tanaka Epson Toyocom Corporation, Ina Plant, Development Department, Development & Design Management Division 8548, Minowa-machi, Kamiina-gun, Nagano 399-4696 Japan Tel +81-266-79-2216 Fax +81-265-79-0046

Connector

Contextual Info: Dear Customers Date: 22 February, 2013 Certification of Non- inclusion Company name: OMRON SANYO Co.,Ltd. Department: Quality and Environmental Management Section Title: Manager Name: Yasushi Tanaka Signature: We hereby certify that to the best of Omron’s knowledge, our products and components below

Contextual Info: New Core Alignment Fusion Splicer Yoshiaki Tanaka,1 Yoshinori Iwashita,1 Hiroaki Kamitani,1 and Ataru Takahashi1 The number of telecom infrastructure construction has still been on the increase in developing countries. Fusion splicing is a high-reliability method for high-quality optical fiber connection.

tanaka wire

Abstract: MAC-3070 shinetsu tanaka au wire EME-6730UC Ablestik KMC-184 g991 EME-6730 tanaka wire 10 mils
Contextual Info: Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA - 95054 PRODUCT/PROCESS CHANGE NOTICE PCN DATE: November 18, 1999 MEANS OF DISTINGUISHING CHANGED DEVICES: PCN #: G9911-05 Product Affected: All Platic packages Product Mark Back Mark Manufacturing Location Affected: ALL

ph44

Abstract: Tanaka GL2 tanaka wire Ablebond 8340 tanaka au wire tanaka epoxy Compound c7025 Ablebond tanaka C7025
Contextual Info: Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA - 95054 PRODUCT/PROCESS CHANGE NOTICE PCN DATE: November 18, 1999 MEANS OF DISTINGUISHING CHANGED DEVICES: PCN #: G9911-04 Product Affected: All Plastic packages Product Mark Back Mark

Contextual Info: 7678E0PS onimvhq PITC H ( ’ON (2 ^1" ID CM xi NOTE 1. THE QUANTITY OF 7,000 PIECES AND PART NUMBER M31S07K4FB ARE MARKED IN THE PACKING LABEL INDICATED AT THE REEL BOARD. D O F —0 —2 1 2 0 ( 9 8 . 0 2 ) 2. THE WIRE TO BE USED IS A STRANDED WIRE OF 0.22mm SQUARE

SJ035503

Abstract: 200B JN1-22-22S-PK0100
Contextual Info: %-n a JK & DON DATE REV. * NO. K & & 2 10.A p r . 2001 479G4 ADDED NOT E 1 . 3 4.J u n . 200 3 52239 ADDED ITEM 059590 REVISED APPLICABLE CONTACTS. E.MATSUMOTO M.NITTA 1. 8 5» M APPD. S.NANAO M.MAJ IME E.MATSUMOTO S.NANAO 1 . 6 L T A M AX ±0 . 5 1 1 . 6 5

AC-7088

Abstract: tanaka AL wire ELF-4C6 42-10a C850-6 4210a tanaka wire T-1001 C-850-6 hl-011mg
Contextual Info: EVERLIGHT ELECTRONICS CO.,LTD. Device Number : DDF-4C6-071 REV: 1.0 Page: 1/6 0.39" Quadruple Digit Displays ELF-4C6-1GWB PART NO. : ECN : █ Features : █ Applications: ● Industrial standard size. ● Audio equipment ● Low power consumption. ● Instrument panels

T3007

Abstract: T3007-20 EVERLIGHT LED PART NUMBER LIST tanaka epoxy tanaka tanaka wire bond for LED RH95 epifine
Contextual Info: EVERLIGHT ELECTRONICS CO.,LTD. DATA SHEET SHARP PART NO. : PART NO. ： DATE ： DEPARTMENT： RH-PX0105SEZZ 333EC/F45-54 2001/6/19 CHR&D1 . REVISION ： 2 RECEIVED • MASS PRODUCTION □ PRELIMINARY □ CUSTOMER DESIGN DEVICE NUMBER : PAGE : 5 CUSTOMER 2

Contextual Info: 999S 'ON E 0PS ONlM vaa -è-#M E! WH I T E MARKI NG AS INDICATED 'ap&'/i; J N 1 D S 0 4 F A ^POLARIZING K E Y POS I TI ON ( N 0 T E 4 ) NO MARK : N OR MA L P O S I T I O N X M AX MB : T POSITION 11 : J - l H ' SCREW 5 2 (£4) ( MODIFICATION NUMBER( N O T E B )

tanaka TS3332LD epoxy

Abstract: tanaka TS3332LD tanaka epoxy dm6030hk CMM-2-BD-000X CMM-2-BD tanaka gold wire tanaka gold wire data sheet TS3332LD DM6030HK-Pt
Contextual Info: 2.0-10.0 GHz GaAs MMIC Amplifier CMM-2-BD August 2007 - Rev 06-Aug-07 CMM-2-BD 2.0 to 10.0 GHz GaAs MMIC Amplifier Mimix CMM-2-BD GaAs MMIC Amplifier 10 Mimix Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com

tanaka TS3332LD

Abstract: XP1032-BD-EV1 tanaka TS3332LD epoxy DM6030HK XP1032-BD
Contextual Info: 32.0-36.0 GHz GaAs MMIC Power Amplifier P1032-BD May 2008 - Rev 12-May-08 Features Chip Device Functional Diagram 2W Power Amplifier Dual Sided Bias Architecture 20 dB Small Signal Gain +32.5 dBm P1dB Compression Point +33.5 dBm Saturated Output Power 100% On-Wafer DC, RF and Output Power Testing

XP1054-BD

Abstract: XP1054-BD-000V XP1054-BD-EV1 DM6030HK tanaka TS3332LD
Contextual Info: 33.0-36.0 GHz GaAs MMIC Power Amplifier P1054-BD May 2008 - Rev 12-May-08 Features Chip Device Functional Diagram 3W Power Amplifier Dual Sided Bias Architecture 20 dB Small Signal Gain +33.5 dBm P1dB Compression Point +34.5 dBm Saturated Output Power 100% On-Wafer DC, RF and Output Power Testing

Contextual Info: 13.5-16.0 GHz GaAs MMIC Power Amplifier P1057-BD May 2008 - Rev 28-May-08 Features Chip Device Functional Diagram 10W Power Amplifier Dual Sided Bias Architecture 17 dB Small Signal Gain +39.0 dBm P1dB Compression Point +41.0 dBm Pulsed Saturated Output Power

tanaka gold wire

Abstract: tanaka wire XP1057-BD DM6030HK tanaka TS3332LD tanaka TS3332LD epoxy
Contextual Info: 13.5-16.0 GHz GaAs MMIC Power Amplifier P1057-BD May 2008 - Rev 12-May-08 Features Chip Device Functional Diagram 10W Power Amplifier Dual Sided Bias Architecture 18 dB Small Signal Gain +39.0 dBm P1dB Compression Point +41.0 dBm Pulsed Saturated Output Power

tanaka gold wire

Abstract: tanaka au wire DM6030HK tanaka TS3332LD
Contextual Info: 14.5-17.0 GHz GaAs MMIC Power Amplifier P1070-BD October 2008 - Rev 16-Oct-08 Features Chip Device Functional Diagram 10W Power Amplifier Dual Sided Bias Architecture 17 dB Small Signal Gain +39.0 dBm P1dB Compression Point +41.0 dBm Pulsed Saturated Output Power

tanaka TS3332LD

Abstract: TS3332LD
Contextual Info: 13.5-16.0 GHz GaAs MMIC Power Amplifier P1057-BD October 2008 - Rev 16-Oct-08 Features Chip Device Functional Diagram 10W Power Amplifier Dual Sided Bias Architecture 17 dB Small Signal Gain +39.0 dBm P1dB Compression Point +41.0 dBm Pulsed Saturated Output Power

tanaka TS3332LD

Abstract: tanaka TS3332LD epoxy DM6030HK-Pt tanaka gold wire tanaka aluminum wire DM6030HK TS3332LD
Contextual Info: 14.5-17.0 GHz GaAs MMIC Power Amplifier P1070-BD September 2008 - Rev 28-Sep-08 Features Chip Device Functional Diagram 10W Power Amplifier Dual Sided Bias Architecture 17 dB Small Signal Gain +39.0 dBm P1dB Compression Point +41.0 dBm Pulsed Saturated Output Power

XP1055-BD

Abstract: tanaka TS3332LD epoxy
Contextual Info: 34.0-36.0 GHz GaAs MMIC Power Amplifier P1055-BD May 2008 - Rev 12-May-08 Features Chip Device Functional Diagram 2W Power Amplifier Dual Sided Bias Architecture 20 dB Small Signal Gain +32.5 dBm P1dB Compression Point +33.5 dBm Saturated Output Power 100% On-Wafer DC, RF and Output Power Testing

tanaka TS3332LD

Abstract: tanaka TS3332LD epoxy XP1059 XP1059-BD-000V DM6030HK-Pt tanaka gold wire TS3332LD XP1059-BD-EV1 tanaka gold wire current tanaka wire
Contextual Info: 13.5-15.0 GHz GaAs MMIC Power Amplifier P1059-BD May 2008 - Rev 12-May-08 Features Chip Device Functional Diagram 5W Power Amplifier Dual Sided Bias Architecture 28.0 dB Small Signal Gain +36.0 dBm P1dB Compression Point +37.0 dBm Saturated Output Power +38.0 dBm Pulsed Saturated Output Power

tanaka wire

Abstract: dm6030hk tanaka epoxy
Contextual Info: 14.0-16.0 GHz GaAs MMIC Power Amplifier P1058-BD May 2008 - Rev 12-May-08 Features Chip Device Functional Diagram 5W Power Amplifier Dual Sided Bias Architecture 27.0 dB Small Signal Gain +36.0 dBm P1dB Compression Point +37.0 dBm Saturated Output Power +38.0 dBm Pulsed Saturated Output Power

XP1071-BD-000V

Abstract: tanaka gold wire ts333 tanaka au wire XP1071 XP1071-BD-EV1 tanaka TS3332LD tanaka TS3332LD epoxy
Contextual Info: 14.5-17.0 GHz GaAs MMIC Power Amplifier P1071-BD September 2008 - Rev 28-Sep-08 Features Chip Device Functional Diagram 5W Power Amplifier Dual Sided Bias Architecture 27.0 dB Small Signal Gain +36.0 dBm P1dB Compression Point +37.0 dBm Saturated Output Power