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    IBM025161LG5D60

    Abstract: gm72v16821 MD908 KM48S2020 TC59R1809 GM72V1682 KM4232W259Q60 KM416S1120A IBM025171LG5D-70 KM44S4020AT
    Text: Fujitsu Microelectronics Inc. Hitachi America Ltd. Hyundai Electronics America Inc. IBM Microelectronics LG Semicon America Inc. formerly Goldstar Mitsubishi Electronics America Inc. NEC Electronics Inc. Micron Technology Inc. Mosel Vitelic Inc. MoSys Inc.


    Original     		PDF MB81141621 MB81141622 MB81G8322 MB81116421 TC59R1608 2ns500MHz TC59R0808 IBM025161LG5D60 gm72v16821 MD908 KM48S2020 TC59R1809 GM72V1682 KM4232W259Q60 KM416S1120A IBM025171LG5D-70 KM44S4020AT

    H243 Transistor

    Abstract: No abstract text available
    Text: TOSHIBA TC59R0808HK PRELIMINARY 1,048,576 WORD x 8 BITS RAMBUS DYNAMIC RAM Description The T C 59R 0808H K Ram bus Dynamic RAM DRAM is a next-generation high-speed CM OS DRAM w ith a 1,048,576 x 8 bits organization and built-in slave logic. The 16,384 sense am ps o f the DRAM core are used as cache to achieve data


    OCR Scan     		PDF TC59R0808HK 0808H 500MB/S. TC59R0808HK SHP36-P-1125) RD08010496 H-286 H243 Transistor

    Untitled

    Abstract: No abstract text available
    Text: m 'iD,i754fi DD2fi73C1 C141 m- TOSHIBA TC59R0808HK PRELIMINARY 1,048,576 WORD x 8 BITS RAMBUS DYNAMIC RAM Description The TC59R0808HK Rambus Dynamic RAM DRAM is a next-generation high-speed CMOS DRAM with a 1,048,576 x 8 bits organization and built-in slave logic. The 16,384 sense amps of the DRAM core are used as cache to achieve data


    OCR Scan     		PDF TC59R0808HK TC59R0808HK 500MB/s. RD0S010496 SHP36-P-1125)