TERADYNE CONNECTOR Search Results

Cu OSP

Contextual Info: PRODUCT SPECIFICATION PRODUCT SPECIFICATION FOR VHDM AND VHDM-HSD INTERCONNECT SYSTEMS VHDM is a registered trademark of Teradyne, Inc. VHDM-HSD is a trademark of Teradyne, Inc. REVISION: C ECR/ECN INFORMATION: TITLE: EC No: UCP2003-1527 DATE: 2003/04/21

EIA-364-TP-13

Abstract: 74658 75192 EIA-364-TP-65 Cu OSP PS-74031-999
Contextual Info: PRODUCT SPECIFICATION PRODUCT SPECIFICATION FOR VHDM AND VHDM-HSD INTERCONNECT SYSTEMS VHDM is a registered trademark of Teradyne, Inc. VHDM-HSD is a trademark of Teradyne, Inc. REVISION: C ECR/ECN INFORMATION: EC No: UCP2003-1527 DATE: 2003/04/21 DOCUMENT NUMBER:

Teradyne connector

Abstract: teradyne teradyne connectors scheme
Contextual Info: Teradyne Connection Systems: GbX Part Number Scheme Home > Total System Solutions > Connectors > Backplane Connectors > GbX > Part Number Scheme GbX Part Number Scheme Daughtercard | Backplane | Power GbX Daughtercard Connector Lead-Off Number GbX Backplane Connector Lead-Off Number

AG724

Abstract: AG723 Teradyne connector ag725 ag822 00045 teradyne AG823-XXXXX AG822 connector hybrid power system
Contextual Info: Teradyne Connection Systems: GbX Part Number Scheme Home > Total System Solutions > Connectors > Backplane Connectors > GbX > Part Number Scheme GbX Part Number Scheme Daughtercard Standard | Lead-Free Pb Daughtercard Power Standard & Lead-Free (Pb) Backplane

Teradyne connector

Abstract: AV950 Teradyne AV950-XXXXX av951 AV960-XXXXX
Contextual Info: Teradyne Connection Systems: VHDM Right-Angle Male Part Number Scheme Home > Total System Solutions > Connectors > Co-planar Connectors > VHDM Right-Angle Male > Part Number Scheme VHDM Right-Angle Male Part Number Scheme VHDM 6-Row Right-Angle Male VHDM 8-Row Right Angle Male

54754A

Abstract: backplane design GETEK FR4 HP lvds connector 40 pin to 30 pin to 7 pin Teradyne PRBS-31 Teradyne connector 83484A modified booth circuit diagram
Contextual Info: Slide 1 HP-13 DesignCon2001 Gigabit Backplane Design, Simulation and Measurement the unabridged story High Performance Design 2001 This paper is a joint project between National Semiconductor, North East Systems Associates NESA , Teradyne and Agilent Technologies on Gigabit

Teradyne connector

Contextual Info: VHDM and VHDM-HSD* *VHDM and VHDM HSD are Trademark of Teradyne, Inc VHDM AND VHDM-HSD INSTALLATION and REPAIR TOOLING Operation Manual Order No. 62201-0999 Description Operation Maintenance Doc. No: TM-622010999 Revision: H Release Date: 08-10-99

MIL-P-13949

Abstract: MIL-C-28754 Teradyne connector C-KT1007-XXXX MIL-C-28754/39-005
Contextual Info: / \ / CHIGH DENSITY PLUS BACKPLANE CONNECTOR ASSEMBLYD C3 ROW ASSEMBLY WITH PLUS ONE CONTACTSD CUSTOMER GENERAL NOTES: 2. DIMENSIONS AND TOLERANCES SUBJECT TO CHANGE WITHOUT NOTICE. 3. ADDITIONAL TEST DATA IS AVAILABLE UPON REQUEST. 4. FOR MINIMUM CONNECTOR SPACING PLEASE CONSULT FACTORY.

Teradyne connector

Abstract: 85158 press tool 7990 mounting block 890036 pc repair MANUAL 220-13400
Contextual Info: m olex Application Tooling In order to insert a typical row of connectors excluding the Daughtercard modules , it is necessary to select the individual insertion tools and then pick the appropriate tooling holder (See also examples below): 1. Determine the combination of signal modules and power

Teradyne connector

Abstract: 470-2075-100 470-2105-100 337 BGA footprint 471-2045-100 471-1045-100 471-1025-100 470-2235-100 BGA PROFILING Teradyne
Contextual Info: TB-2082 DFM and SMT Assembly Guideline Revision “C“ Specification Revision Status Revision SCR No. Description Initial Date “-“ “A” 33277 36994 J. Marvin J. Proulx 1/16/01 10/19/01 “B” “C” 39831 42921 Initial Release Update stencil design, JEDEC tray info, add weight

teradyne z1880

Abstract: teradyne z1890 z1880 JTAG Technologies 3079CT Altera pcmcia controller GR2283i GR2281i epm7128s teradyne tester test system
Contextual Info: ATE Vendor Support April 1997, ver. 1 Automated test equipment ATE is widely used for manufacturing tests and for the measurement of printed circuit board (PCB) systems. ATE can also program and verify programmable logic devices (PLDs) with insystem programmability (ISP). Using ATE to program ISP-based devices

Teradyne connector 72 pin

Contextual Info: H D M /H U M 2 mm Backplane Interconnection System ^ H ig h -d e n s ity 2 m m c o n t a c t sp a c in g : 2 0 c o n ta c ts p er lin e a r c m * S ta n d a r d a n d s h ie ld e d d a u g h te r b o a r d c o n n e c t o r o p t io n s v M o d u la r c o m p o n e n t s for

KT1008

Abstract: C72500
Contextual Info: DWG NO. CUSTOMER USE DRAWING REV c P SCR NO. 2095 p 3Z ò o B F 3 5 3 Z 430Z <S| BSZS H &14-1 hr t m q o SH C-A1008-XXXXX DESCRIPTION REVISED AND REDRAWN WAS .14 M A X O N SH3 R>i_ PlM A AE^a.4VAiueMgLg.l^ q % S t i f f «»I v a g e c a n t f v4as ‘Z & M i

Teradyne connector 100 pin

Abstract: Teradyne connector AMP D-2100 backplane design teradyne 3006P-D MIL-C-28754 CO643
Contextual Info: DWG NO. CUSTOMER USE DRAWING / \ REV SCR NO. DESCRIPTION B 2100 C 2705 CORRECTED POL 3532, bWG N O W A S K T 1 0 0 8 - X X X X JV KEYING CODE SH 3 JV REVISED AND REDRAWN CAD 1 D BY REV D SH C-KT1008-XXXX APPROVED DATE 7/6/87 «S/if/? <é: & !zf h 3-.V. 7 - 7 - Ô 8

C51000

Abstract: teradyne connectors Teradyne connector f2156 C-A1007-XXXXX
Contextual Info: DWG NO. S E D R A W I N G RE V Pi S C R NO. c 2094 D 2 8 4 8 SH C-A1007-XXXXX DESCRIPTION REVISED AND REDRAWN I S H 4 P/N'S 4 3 8 - 5 0 0 5 - - A O O T H R U ~ H 0 0 W A S 4 3 8 " 5 0 0 3 - A O 0 T H R U - H 0 0 E 3532, DWG P 4-301 D i H .14 M I N W A . S

564-0383-553

Abstract: 494-5010-002 teradyne connectors Teradyne connector
Contextual Info: The Very High Density Metric High Speed Differential VHDM -HSD connector system is designed for differential pair architecture applications that require very high interconnect density and higher speed signal integrity than the standard VHDM system in a single ended

scr C35

Abstract: SCR C38 SCR c50
Contextual Info: DWG NO. 3H <C-/K\0£>*r -X X X 'X X REV ~r~ SCR NO. 2Ö91 2376 / y"\ W 1 H 2564 J 2845 K L M 3532 4298 5494 N 5743 REV N DESCRIPTION BY DATE REVISED AND REDRAWN CHG POWER CONTACT FINISHj SEE SH 7 CORRECT DIM LOC SH 4 ADDED 85 GM MIN TD SIG CONT NORM F SH 7j

GR2286

Abstract: Altera pcmcia controller intertech EPM7384 GR2281i EPM7256 teradyne z1880 Jam Technologies JTAG Technologies Teradyne spectrum
Contextual Info: In-Circuit Test Vendor Support February 1998, ver. 2 In-circuit testers are widely used for manufacturing tests and for the measurement of printed circuit board PCB systems. In-circuit testers can also program and verify programmable logic devices (PLDs) that support

Contextual Info: ysr^i rEST \T A T IO N rr ~ ' -“«“ / / TestStation TSR Rackmount In-Circuit Test Systems A utom ation Solution fo r High Volume Manufacturers Key Features: • M odularized Tera- dyne ICT hardw a re com ponents ■ S tandard in te g ra ­ tion solutions

128C3

Contextual Info: SH DWG NO. O - A k % 7 S - X X X X X REV SCR NO. D 2092 E 2562 F 2846 G H J 3532 4299 5522 K 5744 DESCRIPTION REVISED AND REDRAWN CORRECT DIM L0C SH 4j ADDED 85 GM MIN TO SIG CONT NORM F SH 7j SEE SCR SH 4 P/N'S 438-50O4-A00 THRU HOD WAS 438-5002-ADD THRU HOO

HP 3070 Tester

Abstract: Teradyne z1880 Z188 altera EPM7032B GR2286 teradyne z1890 teradyne tester test system 3079ct pm3705
Contextual Info: In-Circuit Test Vendor Support August 1999, ver. 2.01 In-circuit testers are widely used for manufacturing tests and for the measurement of printed circuit board PCB systems. In-circuit testers can also program and verify programmable logic devices (PLDs) that support

PRBS31

Abstract: CONN CRD 19 Teradyne connector waveform variable time delay with connector
Contextual Info: Hspice Differential IO Kit User’s Manual Simulation of Lattice SC Product LVDS and other differential Interfaces OVERVIEW The Lattice HSpice IO Kit contains a collection of HSpice model files that allow LVDS and other differential data link simulation across a PCB module or backplane hardware system. Examples of other differential

Contextual Info: HIGH DENSITY PLUS Modular Daughterboard-to-Backplane INTERCONNECTION SYSTEM FEATURES A N D BENEFITS • M o d u la r c o n n e c to rs — s ig n a l, p o w e r , p o la r iz in g a n d g u id a n c e ■ ■ U p t o six ro w s o f c o n ta c ts o n 0 .1 0 0 " g rid

K2563

Abstract: C6033 Teradyne connector 100 pin
Contextual Info: DWG NO. CUSTOMER USE DRAWING REV SH C-KT1004-XXXX RE» SCR NO. DESCRIPTION BY K DATE 2096 RE VI SE D AND RE DR AW N JV 5/22/87 H 2563 K 2701 3532 R E M O V E PLATED HOLES FROM TABLE SH 5; CORRECT SIG C O NT SELTABLE JV SH 6', SEE SCR _ CO RR EC TE D POL KEYING CODE SH 3 JV