TERADYNE FLEX Search Results

teradyne z1800 tester manual

Abstract: dfp 740 Teradyne Teradyne spectrum teradyne tester test system xilinx jtag cable z1800 dfp cable XC2064 XC3090
Contextual Info: Programming Xilinx XC9500 on a Teradyne Z1800 or Spectrum Preface JTAG Programmer Troubleshooting Version 2.1i June 1999 Introduction Creating SVF Files Creating Teradyne Test Files Programming XC9500 on a Teradyne Z1800 or Spectrum R The Xilinx logo shown above is a registered trademark of Xilinx, Inc.

teradyne z1800 tester manual

Abstract: XC2064 XC3090 XC4005 XC5210 XC9500 XC95108 Z1800
Contextual Info: Programming Xilinx XC9500 on a Teradyne Z1800 Preface Introduction Creating SVF Files Creating Teradyne Test Files JTAG Programmer Version 1.2 September1, 1998 Troubleshooting Printed in U.S.A. Programming XC9500 on a Teradyne Z1800 R The Xilinx logo shown above is a registered trademark of Xilinx, Inc.

teradyne z1800 tester manual

Abstract: dfp 740 Z1800 dfp cable teradyne tester test system teradyne XC2064 XC3090 XC4005 XC5210
Contextual Info: Programming Xilinx XC9500 on a Teradyne Z1800 Preface Introduction Creating SVF Files Creating Teradyne Test Files EZTag Version Troubleshooting June 16, 1997 Version 1.0 Printed in U.S.A. Programming XC9500 on a Teradyne Z1800 R The Xilinx logo shown above is a registered trademark of Xilinx, Inc.

teradyne tester test system

Contextual Info: ,TATION j-t With U k ia P in JJ Teradyne TestStation Systems High Quality In-Circuit Testing Teradyne - A Company you can Count On With 30+ years of ICT experience and over 6,000+ systems installed, Teradyne's TestStation™ is the preferred solution for discerning manufacturers who value test quality. Test­

teradyne z1890

Abstract: Z1890 teradyne products intel 80486 architecture
Contextual Info: ON-BOARD PROGRAMMING EQUIPMENT TERADYNE Z1890 • ■ ■ ■ ■ ■ Cost-effective in-circuit test targets manufacturing defects Product function test and in-circuit process test combined in one platform Open architecture and built-in upgrade path Flexibility and high throughput

teradyne z1890

Abstract: Z1890 teradyne z1800 testing of diode 28F001BX 28F002BC 28F002BX 28F010 28F020
Contextual Info: ON-BOARD PROGRAMMING EQUIPMENT TERADYNE Z1890 • ■ ■ ■ ■ ■ Cost-effective in-circuit test targets manufacturing defects Product function test and in-circuit process test combined in one platform Open architecture and built-in upgrade path Flexibility and high throughput

Z1800-Series

Abstract: teradyne INTEL 80486 DX2 80486DX2 z1800
Contextual Info: ON-BOARD PROGRAMMING EQUIPMENT TERADYNE Digital Function Processor • ■ ■ ■ ■ ■ Non-volatile memory and logic programming Program on-board flash on PCBs at the in-circuit test stage Supports Intel Flash memory, Lattice ISP, Altera 7000s, etc. Flexible, high-throughput dedicated

intel 8253

Abstract: 8253 teradyne 8253 intel Z1800-Series INTEL DX2 intel microsoft 28F001BX 28F002BC 28F002BX
Contextual Info: ON-BOARD PROGRAMMING EQUIPMENT TERADYNE Digital Function Processor • ■ ■ ■ ■ ■ Non-volatile memory and logic programming Program on-board flash on PCBs at the in-circuit test stage Supports Intel Flash memory, Lattice ISP, Altera 7000s, etc. Flexible, high-throughput dedicated

Contextual Info: XFrame Integrated Software Development Environment for XStation HS™ Automated X-Ray Inspection Systems ½ Fastest program development via built-in inspection wizards ½ Uses Teradyne's D2B™ and Alchemist™ software for performing CAD preparation activities

Teradyne connector

Abstract: 470-2075-100 470-2105-100 337 BGA footprint 471-2045-100 471-1045-100 471-1025-100 470-2235-100 BGA PROFILING Teradyne
Contextual Info: TB-2082 DFM and SMT Assembly Guideline Revision “C“ Specification Revision Status Revision SCR No. Description Initial Date “-“ “A” 33277 36994 J. Marvin J. Proulx 1/16/01 10/19/01 “B” “C” 39831 42921 Initial Release Update stencil design, JEDEC tray info, add weight

teradyne tester test system

Contextual Info: ^Jest ^ ,TATIONrïWith UltraPinJIJ Teststation PXI Expansion Board Industry's Most Integrated PXI/ICT Solution Key Features: • Plugs directly into TestStation Instru­ ment Backplane ■ Supports 4 PXI In­ The TestStation™ PXI struments Expansion Board ex­

Contextual Info: D2B Strategist Test & Inspection Strategy Management Software • Accelerates new product introduction by optimizing test strategies early in the design cycle • Enables Users to reduce the cost of test by helping to define the most efficient test and inspection strategy

Contextual Info: | U ‘ |)ESIGN-to-ßmLD; D2B Design-to-Build Software Software Applications that Optimize PCBA Test and Inspection Efficiencies Key Features: • Enables manufac­ turers to drive down and control the "Cost of Test" ■ A simple software tool for all your test

Contextual Info: e s t S t a t i o n rr 7 - - - / With U/tmPinJJ^ Scan Pathfinder Boundary Scan Option Boundary Scan Test Generation and Diagnostic Software for TestStation™ and GR228X Test Systems Key Features: • Comprehensive shorts and opens testing for boards with limited test

Teradyne connector 72 pin

Contextual Info: H D M /H U M 2 mm Backplane Interconnection System ^ H ig h -d e n s ity 2 m m c o n t a c t sp a c in g : 2 0 c o n ta c ts p er lin e a r c m * S ta n d a r d a n d s h ie ld e d d a u g h te r b o a r d c o n n e c t o r o p t io n s v M o d u la r c o m p o n e n t s for

Contextual Info: Agilent Medalist i5000 Program and Fixture Conversion Solution Solution Overview Industry Challenges Product Summary Converting production lines from one ICT platform to another can be expensive and time-consuming for any PCBA assembly operation. The capital cost of the

CC-3

Contextual Info: TM CC3 Lightning Flash/ ISP Programmer High-speed channel card for flash memory and ISP device programming on Spectrum Manufacturing Test Systems ࡯ Minimize cycle time for flash and ISP programming ࡯ Combine in-circuit test and device programming, decreasing

Contextual Info: ^ H S T ^ iTAT10Nr r With U kraHnJJ TestStation Duo Concurrent In-Circuit Test Systems Provides Fastest ICT Test Throughput, Lowers High Volume Production Costs Key Features: • Twice the through­ put of traditional in­ circuit testers ■ Lower capital equip­

Contextual Info: ysr^i rEST \T A T IO N rr ~ ' -“«“ / / TestStation TSR Rackmount In-Circuit Test Systems A utom ation Solution fo r High Volume Manufacturers Key Features: • M odularized Tera- dyne ICT hardw a re com ponents ■ S tandard in te g ra ­ tion solutions

PRBS31

Abstract: CONN CRD 19 Teradyne connector waveform variable time delay with connector
Contextual Info: Hspice Differential IO Kit User’s Manual Simulation of Lattice SC Product LVDS and other differential Interfaces OVERVIEW The Lattice HSpice IO Kit contains a collection of HSpice model files that allow LVDS and other differential data link simulation across a PCB module or backplane hardware system. Examples of other differential

Teradyne connector

Abstract: 85158 press tool 7990 mounting block 890036 pc repair MANUAL 220-13400
Contextual Info: m olex Application Tooling In order to insert a typical row of connectors excluding the Daughtercard modules , it is necessary to select the individual insertion tools and then pick the appropriate tooling holder (See also examples below): 1. Determine the combination of signal modules and power

Contextual Info: ,T A T I O N r r With UkraPinJ^j^ TestStation Multi-Function Application Board Expand F u n c tio n a lity of y o u r T e s tS ta tio n S y ste m with Flexible A p p lic a tio n M o du les Key Features: • Plugs directly into TestStation Instru­ ment Backplane

Contextual Info: TestStation LX In-Circuit Test System Highest Quality In-Circuit Test ½ Configurable from 256 to 7680 test pins ½ Capable of testing large, complex, and heavily integrated PCBs ½ Safe, accurate, and reliable electrical test with SafeTest™ Protection

564-0383-553

Abstract: 494-5010-002 teradyne connectors Teradyne connector
Contextual Info: The Very High Density Metric High Speed Differential VHDM -HSD connector system is designed for differential pair architecture applications that require very high interconnect density and higher speed signal integrity than the standard VHDM system in a single ended