TFLGA Search Results

techpoint

Abstract: AN 7823 Unbiased HAST 130, 85 RH, 100 Hrs
Contextual Info: FLGA-SD Fine Pitch Land Grid Array - Stacked Die • Stacking of die allows for more functionality in an array molded, cost effective, space saving package solution • Available in 1.2mm TFLGA , 1.0mm (VFLGA), and 0.8mm (WFLGA) maximum thickness • Thinner than FBGA

PTLG0100KA-A

Contextual Info: JEITA Package Code P-TFLGA100-5.5x5.5-0.5 RENESAS Code PTLG0100KA-A MASS[Typ.] 0.1g b1 S w S A w S B D Previous Code 100F0M AB b ZD A S AB e A e K J H G B E F E D C B ZE A y S x4 v 1 2 3 Index mark Laser mark S Index mark 4 5 6 7 8 9 10 Reference Symbol

Contextual Info: P-TFLGA84-0909-0.80 5 パッケージ材質 端子処理方法・材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 Sn/Pb 0.16 TYP. 2 版/99.8.19

Contextual Info: JEITA Package Code P-TFLGA081-5x5-0.50 RENESAS Code PTLG0081KA-A Previous Code 81F0E MASS[Typ.] 0.1g w S B φ b1 D φx M S φb AB φ× M S w S A ZD A AB e e A J H G B E F E D ZE C B A ×4 y S 1 2 3 4 5 6 7 8 9 Reference Symbol v Index mark Laser mark S

P-TFLGA56-0808-0

Contextual Info: P-TFLGA56-0808-0.80 5 Package material PAD Finish Package weight g Rev. No./Last Revised Epoxy resin Au Plating 0.16 TYP. 1/Mar.31,1999

STHV800

Contextual Info: STHV800 Octal ±90 V, ±2 A, 3-level RTZ, high-speed ultrasound pulser Data brief • • • • TFLGA-56LD 8x8x0.9 mm Fully integrated real clamping-to-ground function − 8 Ω synchronous active clamp − ±2 A source and sink current Fully integrated TR switch

Contextual Info: P-TFLGA56-0808-0.80 5 パッケージ材質 端子処理方法・材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 Sn/Pb 0.13 TYP. 2 版/00.10.25

Contextual Info: P-TFLGA48-0707-0.80 5 Package material Package weight g Rev. No./Last Revised Epoxy resin 0.10 TYP. 2/Jun. 20, 2001

Contextual Info: JEITA Package Code P-TFLGA113-8x8-0.65 RENESAS Code PTLG0113JA-A Previous Code TLP-113V MASS[Typ.] 0.12g D w S B E w S A x4 v y1 S A S y S e Z A D Reference Symbol Min Nom D 8.0 E 8.0 Max e L Dimension in Millimeters K J H B G F v 0.15 w 0.20 A 1.2 A1 E e

PTLG0100JA-A

Contextual Info: JEITA Package Code P-TFLGA100-7x7-0.65 RENESAS Code PTLG0100JA-A Previous Code 100F0G MASS[Typ.] 0.1g w S B φ b1 D φx M S φb w S A ZD φ× M S AB e A e A AB K J H G B E F E D C B ×4 y S v Index mark Laser mark S ZE A 1 2 3 Index mark 4 5 6 7 8 9 10

TLP-85V

Contextual Info: JEITA Package Code P-TFLGA85-7x7-0.65 RENESAS Code PTLG0085JA-A Previous Code TLP-85V MASS[Typ.] 0.1g D w S B E w S A x4 v y1 S A S y S ZD e A K Reference Symbol e J H G B F E Dimension in Millimeters Min Nom D 7.0 E 7.0 Max v 0.15 w 0.20 A 1.20 A1 D e b

Contextual Info: P-TFLGA32-0806-0.80 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.

Contextual Info: P-TFLGA84-0909-0.80 5 Package material PAD Finish Package weight g Rev. No./Last Revised Epoxy resin Au Plating 0.16 TYP. 1/Aug.19,1999

JESD51-9

Abstract: TFLGA AN 7823 JESD51-2
Contextual Info: FLGA Fine Pitch Land Grid Array • Array molded, cost effective, space-saving packaging solution • Available in 1.20mm TFLGA , 1.00mm (VFLGA), and 0.80mm (WFLGA) maximum thickness • Thinner than FBGA • Exposed thermal/mechanical lands available • Laminate substrate based enabling 2 and 4

Contextual Info: JEITA Package Code P-TFLGA113-6x6-0.50 RENESAS Code PTLG0113KA-A Previous Code 113F0E MASS[Typ.] 0.3g w S B b1 S b w S A A ZD AB AB e A e D S L K J H B G E F E D ZE C B A y S x4 v Index mark Laser mark S 1 2 3 4 5 6 7 8 9 10 11 Reference Symbol D E v w A

PTLG0077KA-A

Contextual Info: JEITA Package Code P-TFLGA77-6x6-0.50 RENESAS Code PTLG0077KA-A Previous Code 77F0E MASS[Typ.] 0.3g w S B b1 D S b ZD AB e A e A AB S w S A K J H B G E F E D ZE C B A y S x4 v Index mark Laser mark S 1 2 3 4 5 6 7 8 9 10 Reference Symbol D E v w A e b b1

PTLG0064JA-A

Contextual Info: JEITA Package Code P-TFLGA64-6x6-0.65 RENESAS Code PTLG0064JA-A Previous Code 64F0G MASS[Typ.] 0.07g w S B b1 D S AB b S w S A AB e A e H G F E E D C B A y S x4 v Index mark Laser mark 1 2 3 Index mark 4 5 6 7 8 Reference Symbol D E v w A e b b1 x y Dimension in Millimeters

Contextual Info: JEITA Package Code P-TFLGA145-10x10-0.65 RENESAS Code PTLG0145JA-A Previous Code 145F0E MASS[Typ.] 0.5g w S B b1 S b D w S A AB S AB A ZD e e A N M L K J B E H G F E D ZE C B A Reference Symbol y S x4 v Index mark Laser mark S 1 2 3 4 5 6 7 8 9 10 11 12 13

Contextual Info: JEITA Packaqe Code P-TFLGA145-9x9-0.65 RENESAS Code PTLG0U5JB-A m N Previous Code - Zd H 3 O O Ô Ô O O Ô OOOOOO M ooooooi OOOOOO L o K 0 0 0 0 0 0 6 J H G o o o o o OOOOOO 0000 0000 0 0 0 0 0 D ooooooû 0000 0000 OOOOOO 0000000 OOOOOO 0 0 0 0 0 0 OOOOOO

P-TFLGA56-0808-0

Contextual Info: P-TFLGA56-0808-0.80 5 Package material Lead finish Package weight g Rev. No./Last Revised Epoxy resin Sn/Pb 0.13 TYP. 2/Oct. 25, 2000

Contextual Info: P-TFLGA48-0707-0.80 5 パッケージ材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 0.10 TYP. 2 版/01.06.20

PTLG0145KA-A

Abstract: P-TFLGA145-7x7-0
Contextual Info: JEITA Package Code P-TFLGA145-7x7-0.50 RENESAS Code PTLG0145KA-A Previous Code 145F0G MASS[Typ.] 0.1g w S B b1 D S AB b S AB w S A ZD A e e N M L K J E H G F E D C B y S x4 v Index mark Laser mark ZE A 1 2 3 4 5 6 7 8 9 10 11 12 13 Reference Symbol D E v

RX63N

Abstract: RX62N RX621 F5621 RX631 R5F56218 r5f52108 R5F56218ADFP R5f521 6108V
Contextual Info: R5 F 5 621 8 A D FP Renesas MCU ROM Type RX Family F: Flash S：ROM less Package, pin count and pin pitch *2 Function Code *1 Memory Code Product Group FL LFQFP 48 0.50 mm FK LQFP 64 0.80 mm FM LFQFP 64 0.50 mm FN LFQFP 80 0.50 mm FF LQFP 80 0.65 mm LD TFLGA

Contextual Info: P-TFLGA48-0707-0.80 5 パッケージ材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 0.12 TYP. 1 版/98.11.14