THERMAL CONDUCTIVITY OF SUBSTRATE Search Results

Contextual Info: Bergquist Thermal Clad Technical Data HT-04503 HIGH TEMPERATURE DIELECTRIC Benefits • Very low thermal resistance of 0.05°Cin2/W (0.32°Ccm2/W) • High thermal conductivity of 2.2 W/m-K • High temperature applications • Lead-free solder compatible

comparative tracking index ceramic

Contextual Info: Bergquist Thermal Clad Technical Data HT-07006 HIGH TEMPERATURE DIELECTRIC Benefits • Very low thermal resistance of 0.11°Cin2/W (0.71°Ccm2/W) • High thermal conductivity of 2.2 W/m-K • High temperature applications • Lead-free solder compatible

UL796

Contextual Info: Bergquist Thermal Clad Technical Data HPL-03015 HIGH POWER LIGHTING DIELECTRIC Superior Dielectric Lowers Operating Temperatures Benefits • Very low thermal resistance of 0.02°Cin2/W (0.13°Ccm2/W) • High thermal conductivity of 3.0 W/m-K • High temperature applications

Contextual Info: Bergquist Thermal Clad Technical Data MP-06503 MULTI-PURPOSE DIELECTRIC Benefits • Thermal resistance 0.09°Cin2/W (0.58°Ccm2/W) • Thermal conductivity of 1.3 W/m-K • Multi-Purpose applications • Lead-free solder compatible • Eutectic AuSn compatible

Contextual Info: CBM-360 Product Datasheet CBM-360 LEDs Features: • Extremely high optical output: Over 5,000 lumens from a single package white Table of Contents • High thermal conductivity package - junction to heat sink thermal resistance of only 0.9 6°C/W Technology Overview . . . . . .2

Contextual Info: CBM-360 Product Datasheet CBM-360 LEDs Features: • Extremely high optical output: Over 5,000 lumens from a single package white Table of Contents • High thermal conductivity package - junction to heat sink thermal resistance of only 0.9 6°C/W Technology Overview. . . . . . 2

DWG-001216

Abstract: CBT-90 NCP15XH103J03RC 6500K
Contextual Info: PRODUCT DATA SHEET PhlatLight White LED Illumination Products CBT-90 White Features • Extremely high optical output: Over 2,000 lumens from a single chip White • High thermal conductivity package - junction to heat sink thermal resistance of only 0.9 ºC/W

Contextual Info: CBT-90-UV-405 Product Datasheet CBT-120 Product PreliminaryPreliminary Datasheet CBT-90-UV-405 LEDs Features: •• >6.5 W of optical power from 400 nm to 410 nm. •• High thermal conductivity package . ›› Junction to heat sink thermal resistance of 0.9 °C/W

CBT-120

Abstract: PDS-001226 NCP15XH103J03RC LM2500 cbt-120-g-c11 NCP15XH103J03 KF300 RC11B DF-3 dwg001124
Contextual Info: PRODUCT DATA SHEET PhlatLight LED Illumination Products CBT-120 Series Features • Extremely high optical output: Over 1225 Red Lumens Over 2000 Green lumens Over 470 Blue Lumens • High thermal conductivity package - junction to heat sink thermal resistance of only 0.7 ºC/W

CF 775

Abstract: cf775 JC200 HC100 NCP15XH103J03RC CBT-40-G-C21-JC200 R5631 A 1050 09
Contextual Info: PRODUCT DATA SHEET PhlatLight LED Illumination Products CBT-40 Series Features • Extremely high optical output: Over 310 Red Lumens Over 725 Green lumens Over 150 Blue Lumens • High thermal conductivity package - junction to heat sink thermal resistance of only 1.8 ºC/W

DWG-001216

Abstract: 001216 NCP15XH103J03RC dj bj 810 215R6 CBT-90 DNG14-250FL
Contextual Info: PRODUCT DATA SHEET PRELIMINARY PhlatLight LED Illumination Products CBT-90 RGB Features • Extremely high optical output: Over 810 Red Lumens Over 1800 Green lumens Over 450 Blue Lumens • High thermal conductivity package - junction to heat sink thermal resistance of only 0.9 ºC/W

Contextual Info: M/A-COM Passive Component Division offers a wide selection of metallized 9 9 5 + % alumina AlaOa substrates and aluminum nitride ceramic which is an attractive alternative where power and thermal conductivity are a concern. Polished surfaces of less than one microinch

Contextual Info: AfaCßM Metallized Substrates For Microwave Integrated Circuits M/A-COM offers a wide selection of metallized 995 alumina AI2O3 substrates and aluminum nitride ceramic which is an attractive alternative where power and thermal conductivity are a concern. Polished

Contextual Info: Thick Film Chip Resistor High Power Chip Resistor, wide terminal type Industry/Field: Automotive electronics, Industrial equipment Expansion of products line-up Excellent solder junction and high thermal conductivity with wide terminal • Development Target:

Contextual Info: CBT-90-UV Product Datasheet CBT-120 Product Preliminary CBT-90-UV LEDs Features: • Greater than 6.5 W of optical power from 400 nm to 410 nm. • High thermal conductivity package . › Junction to heat sink thermal resistance of 0.9 °C/W • Luminus Big Chip LED technology for very high power density and uniform surface

tyre pressure sensor

Abstract: "electromagnetic pulse"
Contextual Info: Small size – Big performance. Microcircuits for Miniaturisation One of the attributes of microcircuits made on ceramic substrates is that very high performance can be achieved in the smallest of sizes. The inherent strength, thermal conductivity and multilayer capabilities can make a ceramic hybrid circuit the choice for the most demanding

Contextual Info: CBT-120-UV CBT-120 Product Product Datasheet CBT-120-UV LEDs Features: •• Over 16.0 W of optical power typical from 382 nm to 392 nm. Table of Contents Technology Overview. . . . . . 2 Binning Structure. . . . . . . . . . 3 •• High thermal conductivity package .

wacker silicone paste

Abstract: silicone paste p 12 IEC 326-3 Wacker Silicones P-12 Wacker Silicones pcb board of miniskiip 2 Wacker miniskiip board SEMIKRON BOARD wacker rubber
Contextual Info: MiniSKiiP - Technical Explanations Assembly Instructions 1 Preparation, surface specification To obtain the maximum thermal conductivity of the module, heat sink and module must fulfil the following specifications. 1.1 Heat sink ≤ 20 µm Heat sink > 10 µm

Contextual Info: CBT-90-UV Product Datasheet CBT-120 Product Preliminary CBT-90-UV LEDs Features: •• Greater than 6.5 W of optical power from 400 nm to 410 nm. •• High thermal conductivity package . ›› Junction to heat sink thermal resistance of 0.9 °C/W •• Luminus Big Chip LED technology for very high power density and uniform surface

1000H

Contextual Info: Crystal Plate Crystal Plate for Projectors • Features ● The crystal plate for projectors is large and transparent, and made of high-quality crystal. ● Excellent heat dissipation due to the high thermal conductivity of crystal. ● Processed at an angle that is not affected by double refraction

hfr 20w

Abstract: RFT250 flange RF termination 50 RFT050 RFT010
Contextual Info: High Power Flanged RF Terminators IRC Advanced Film Division RFTXXX-1 Series • Flange contruction • High frequency operation to 5GHz • High power dissipation to 250W • Long life, temperature stable thinfilm technology IRC’s RFTXXX-1 series utilizes the combined benefits of flange cooling and the high thermal conductivity of

X-band Gan Hemt

Abstract: GaN amplifier Gan on silicon substrate rf gan amplifier MMIC X-band amplifier x-Band Hemt Amplifier AlGaN/GaN HEMTs Gan on silicon transistor Gan transistor k 1535
Contextual Info: APPLICATION NOTE AN-011 GaN Essentials AN-011: Substrates for GaN RF Devices NITRONEX CORPORATION 1 JUNE 2008 APPLICATION NOTE AN-011 GaN Essentials: Substrates for GaN RF Devices 1. Table of Contents 1. Table of Contents. 2

thermal impedance for IMS

Abstract: AB20-4 International Resistive Company
Contextual Info: International Resistive Company Advanced Film Division 4222 South Staples Street Corpus Christi, Texas 78411, USA Telephone: +1 361 992-7900 Facsimile: +1(361)992-3377 Email: morrist@irctt.com Website: www.irctt.com Test Report-AnothermTM vs IMS Substrate in Power LED

thermal conductivity sensor

Abstract: CO826
Contextual Info: FOR IMMEDIATE RELEASE, CO826 November 28, 2005 For more information, contact: Tom Morris, Applications Engineering Manager IRC, Inc. 361-985-3140 tom.morris@irctt.com Beth Polizzotto, BtB Marketing 919-872-8172 bpolizzotto@btbmarketing.com LEDs and power components keep cool on new substrate material…