THERMAL RESISTANCE STANDARDS Search Results

a1270* transistor

Abstract: computer controlled infrared M113 C-15 IEEE488 diode ed 2437 AT-8141
Contextual Info: High-Frequency Transistor Primer Part III-A Thermal Resistance A Guide to Understanding, Measuring, and Applying Power FET Thermal Resistance Coefficients Table of Contents I. Introduction . 2

Contextual Info: THERMAL CONVERTERS TVC Series - High Frequency Thermal Voltage Converters HOW TO ORDER TVC1 R-100 G X M Packaging TCR ppm/°C X = ±25 Resistance Tolerance G = ±2% Resistance 50Ω = 500 100Ω = 101 1,000Ω = 102 2,000Ω = 202 FEATURES Complete thermal converter module using the MJTC thermal

TA8221AHQ

Abstract: car power amp circuit diagrams TA8221ALQ
Contextual Info: TA8221AHQ / ALQ TOSHIBA Bipolar Linear Integrated Circuit Silicon Monolithic TA8221AHQ,TA8221ALQ 30W BTL x 2Ch Audio Power Amplifier The thermal resistance θj−T of TA8221AHQ, TA8221ALQ package designed for low thermal resistance, has a high efficiency

Contextual Info: INTEGRATED TO SH IB A CIRCUIT TECHNICAL TO SHIBA BIPOLAR LINEAR INTEGRATED CIRCUIT DATA TA8233AH SILICON MONOLITHIC 30W BTLX2CH AUDIO POWER AMPLIFIER The thermal resistance 6 \ - l of TA8233AH package designed for low thermal resistance, has high efficiency

reco relay

Contextual Info: INTEGRATED TO SH IB A CIRCUIT TECHNICAL TO SHIBA BIPOLAR LINEAR INTEGRATED CIRCUIT DATA TA8233AH SILICON MONOLITHIC 30W BTLX2CH AUDIO POWER AMPLIFIER The thermal resistance 6 \ - l of TA8233AH package designed for low thermal resistance, has high efficiency

Contextual Info: TOSHIBA TA8210AH/AL TOSHIBA BIPOLAR LINEAR INTEGRATED CIRCUIT SILICON MONOLITHIC TA8210AH, TA8210AL 20W BTLX2CH AUDIO POWER AMPLIFIER The thermal resistance dj-T of TA8210AH, TA8210AL package designed for low thermal resistance, has a high efficiency of heat radiation.

TA8233AH

Abstract: r0hs 470H
Contextual Info: INTEGRATED TOSHIBA CIRCUIT TECHNICAL TO SHIBA BIPOLAR LINEAR INTEGRATED CIRCUIT DATA TA8233AH SILICON MONOLITHIC 30W BTLX2CH AUDIO POWER AMPLIFIER The thermal resistance Q\-l of TA8233AH package designed for low thermal resistance, has high efficiency of heat radiation.

TA8215H

Contextual Info: TOSHIBA TA8215H/L TOSHIBA BIPOLAR LINEAR INTEGRATED CIRCUIT SILICON MONOLITHIC TA8215H, TA8215L 18W BTLX2CH AUDIO POWER AMPLIFIER The thermal resistance 9\-J of TA8215H and TA8215L package designed for low thermal resistance, has a high efficiency of heat radiation.

TA8205AH

Abstract: TA8205AHQ car high power amp circuit diagrams car power amp circuit diagrams TA8205ALQ TA8205
Contextual Info: TA8205AHQ/ALQ TOSHIBA Bipolar Linear Integrated Circuit Silicon Monolithic TA8205AHQ,TA8205ALQ 18W BTL x 2CH Audio Power Amplifier The thermal resistance θj−T of TA8205AHQ, TA8205ALQ package designed for low thermal resistance, has a high efficiency of heat radiation.

TA8221AH

Abstract: TA8221 TA8221AL
Contextual Info: INTEGRATED TO SH IB A CIRCUIT TECHNICAL TOSHIBA BIPOLAR LINEAR INTEGRATED CIRCUIT TA8221AH, TA8221AL DATA SILICON MONOLITHIC 30W BTLX2CH AUDIO POWER AMPLIFIER The thermal resistance 0j-T of TA8221AH, TA8221AL package designed for low thermal resistance, has a high

ta8210ahq CIRCUIT DIAGRAM

Abstract: TA8210AHQ car high power amp circuit diagrams TA8210 TA8210ALQ TA8210AH TA8210AHQ stereo amplifier with heat sink toshiba ta8210ahq
Contextual Info: TA8210AHQ/ALQ TOSHIBA Bipolar Linear Integrated Circuit Silicon Monolithic TA8210AHQ,TA8210ALQ 20W BTL x 2ch Audio Power Amplifier The thermal resistance θj−T of TA8210AHQ, TA8210ALQ package designed for low thermal resistance, has a high efficiency of heat radiation.

Contextual Info: INTEGRATED TO SH IB A CIRCUIT TECHNICAL TO SHIBA BIPOLAR LINEAR INTEGRATED CIRCUIT DATA TA8221AH, TA8221AL SILICON MONOLITHIC 30W BTLX2CH AUDIO POWER AMPLIFIER The thermal resistance 6\-l of TA8221AH, TA8221AL package designed for low thermal resistance, has a high

TA8221

Abstract: TA8221AH
Contextual Info: INTEGRATED TO SH IB A CIRCUIT TECHNICAL TO SHIBA BIPOLAR LINEAR INTEGRATED CIRCUIT DATA TA8221AH, TA8221AL SILICON MONOLITHIC 30W BTLX2CH AUDIO POWER AMPLIFIER The thermal resistance 6\-l of TA8221AH, TA8221AL package designed for low thermal resistance, has a high

Contextual Info: AN11076 Thermal behavior of small-signal discretes on multilayer PCBs Rev. 1 — 11 July 2011 Application note Document information Info Content Keywords Low VCEsat, BISS, thermal resistance Rth , thermal impedance (Zth), total power dissipation (Ptot) Abstract

TA8220

Contextual Info: TOSHIBA TA8220H TOSHIBA BIPOLAR LINEAR INTEGRATED CIRCUIT SILICON MONOLITHIC TA8220H 30W BTLX2CH AUDIO PO W ER AMPLIFIER The thermal resistance 6\-l of TA8220H package designed for low thermal resistance, has high efficiency of heat radiation. The temperature rise of chip can be reduced, and the

Contextual Info: Reliability Tests Report Product Name: TC7W53FU Package Name: SM8 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s

Contextual Info: Reliability Tests Report Product Name: TC74HC4040AF Package Name: SOP16 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s

Contextual Info: Reliability Tests Report Product Name: TC75W58FU Package Name: SM8 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s

Contextual Info: Reliability Tests Report Product Name: 2SC5819 Package Name: PW-Mini 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s

Contextual Info: Reliability Tests Report Product Name: TC7SZ34FU Package Name: USV 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s

Contextual Info: Reliability Tests Report Product Name: TCR2BF25 Package Name: SMV 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s

Contextual Info: Reliability Tests Report Product Name: TC7SG126FU Package Name: USV 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s

Contextual Info: Reliability Tests Report Product Name: TC74LCX04F Package Name: SOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s

Contextual Info: Reliability Tests Report Product Name: TC74VHC86F Package Name: SOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Flow) Heat resistance (Iron) Temperature cycling Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s