TI PROCESS CHANGE NOTICE Search Results

MR 6500

Abstract: TI process change notice D929
Contextual Info: DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244-3292 972 371-4000 Date: May 28, 1999 Subject: PRODUCT CHANGE NOTICE – D92901 Description: Convert DS21Q43 to the Standard 0.6 micron Process Flow

452-pin

Abstract: TMS320C6000 TMS320C6201 TMS320C6201B C6201 TMS320
Contextual Info: Migration Document TMS320C6201 Revision 2.x to TMS320C6201B (Revision 3.x) REFERENCE GUIDE: SPRA450 TMS320C6000 Digital Signal Processing Digital Signal Processing Solutions April 1998 IMPORTANT NOTICE Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any

MPDI002A

Abstract: MS-001 MS-013
Contextual Info: IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest version of relevant information to verify, before placing orders, that the information being relied on is current.

IS-54-B

Abstract: IS-54 "cyclic redundancy check" data transmission "para VSELP motorola 486DX TMS320 convolutional SPRA135
Contextual Info: IS-54 Simulation Application Report John D. Crockett Elliott D. Hoole Thomas Labno Stephen Popik Wireless Communications Systems — Semiconductor Group SPRA135 October 1994 Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any

MPDI002A

Abstract: MS-001
Contextual Info: IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest version of relevant information to verify, before placing orders, that the information being relied on is current.

spreeta

Abstract: water pumping machine control spreeta LED ABSTRACT OF AIR FLOW DETECTOR E121 air flow detector abstract solenoid pump flow sensor water air flow detector sensor
Contextual Info: Spreeta  Noise and Baseline Drift Minimization Application Brief Number 001 1999 Microcomponents Technology SLYA017A IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information

135C

Abstract: 72V36110 DATE CODE 72V3690 72V3640
Contextual Info: Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA - 95054 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: F0001-01 Product Affected: 72v2114Z DATE: January 21, 2000 Product Family: FIFO MEANS OF DISTINGUISHING CHANGED DEVICES: Product Mark 72v2101, 72v2111, 72v295, 72v2105, 72v263, 72v273,

SN74ACT2235

Abstract: SN74ACT2235-20 SN74ACT2236
Contextual Info: 1K x 9 × 2 Asynchronous FIFOs SN74ACT2235 and SN74ACT2236 First-In, First-Out Technology Kam Kittrell Advanced System Logic – Semiconductor Group SCAA010A IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any

Using the TMS320VC5416 Bootloader

Abstract: TMS320C5416 C5416 application note instruction set TMS320C5416 C5000 TMS320VC5416 TMS3205416 SPRA602D TMS320VC541
Contextual Info: Application Report SPRA602D - March 2002 TMS320VC5416 Bootloader Tai Nguyen C5000 Applications ABSTRACT This document describes the features and operation of the TMS320VC5416 Bootloader. The contents of the on-chip ROM are discussed. Important Notice Regarding Bootloader Program Contents:

Contextual Info: MECHANICAL DATA MBGA003 – JANUARY 1997 GFT S-PBGA-N352 PLASTIC BALL GRID ARRAY PACKAGE 35,00 SQ Solder Balls 30,00 SQ 22,00 SQ 1,63 TYP 1,27 TYP A 1 2,33 1,17 0,60 4073200 / A 04/95 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice.

Contextual Info: MECHANICAL DATA MPBG006A – JANUARY 1997 GFQ S-PBGA-N521 PLASTIC BALL GRID ARRAY PACKAGE 43,00 SQ 40,64 SQ 41,00 SQ 1,27 A 1 Solder Balls 3,04 0,60 Seating Plane 0,15 4073205-3/B 11/96 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice.

Contextual Info: MECHANICAL DATA MMCM005 – OCTOBER 1994 HDI S-CQCC-N408 CERAMIC MULTICHIP MODULE 1,270 0,432 0,254 408 1 50,800 102 1,270 4040297 / B 04/95 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. POST OFFICE BOX 655303

Contextual Info: MECHANICAL DATA MPBG003 – NOVEMBER 1995 GFS S-PBGA-N313 PLASTIC BALL GRID ARRAY PACKAGE 35,00 SQ 30,00 SQ 2,54 22,00 SQ 2,26 TYP A 1 2,33 1,17 Solder Balls 0,60 4073204/A 11/95 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice.

Contextual Info: MECHANICAL DATA MPBG015 – JANUARY 1996 GGH S-PBGA-N352 PLASTIC BALL GRID ARRAY PACKAGE 35,00 SQ 31,75 SQ 1,27 A 26 1 Solder Balls 1,50 0,25 Seating Plane 0,60 0,15 4073215/A 02/96 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice.

Contextual Info: MECHANICAL DATA MPBG005A – JANUARY 1997 GFQ S-PBGA-N520 PLASTIC BALL GRID ARRAY PACKAGE 43,00 SQ 40,64 SQ 1,27 A 1 Solder Balls 3,35 0,60 Seating Plane 0,15 4073205-2/B 11/96 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice.

Contextual Info: MECHANICAL DATA MPBG007 – NOVEMBER 1995 GFP S-PBGA-N256 PLASTIC BALL GRID ARRAY PACKAGE 30,00 SQ 27,94 SQ 1,27 TYP A 1 2,520 Solder Balls 0,600 4073206/A 11/95 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice.

Contextual Info: MECHANICAL DATA MPBG001 – NOVEMBER 1995 GFU S-PBGA-N560 PLASTIC BALL GRID ARRAY PACKAGE 42,50 SQ 39,37 SQ 1,27 A 1 1,17 32 Solder Balls 2,33 Seating Plane 0,60 0,15 4073203 / A 11/95 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice.

Contextual Info: MECHANICAL DATA MPBG004 – NOVEMBER 1995 GGC S-PBGA-N388 PLASTIC BALL GRID ARRAY PACKAGE 0,79 Dia Solder Balls 0,73 35,00 SQ 20,30 SQ 1,63 TYP 1,27 TYP A 1 0,80 1,83 0,38 0,65 4073212/A 11/95 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice.

Contextual Info: MECHANICAL DATA MPBG002 – NOVEMBER 1995 GFV S-PBGA-N352 PLASTIC BALL GRID ARRAY PACKAGE 35,00 SQ 31,75 SQ 1,27 A 26 1 0,78 Solder Balls 1,38 Seating Plane 0,60 0,15 4073202 / A 11/95 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice.

Contextual Info: MECHANICAL DATA MQFP026 – OCTOBER 1994 PAB S-PQFP-F136 PLASTIC QUAD FLATPACK (CARRIER RING) 0,65 0,50 0,40 41,63 41,37 45,70 46,13 45,87 2,10 1,90 1,90 1,70 4,90 4,70 4040275 / B 03/95 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice.

Contextual Info: MECHANICAL DATA MPBG016 – FEBRUARY 1996 GGE S-PBGA-N352 PLASTIC BALL GRID ARRAY PACKAGE 35,00 SQ 20,30 SQ 1,27 A 1 0,60 0,79 Dia Solder Balls 0,73 1,80 Seating Plane 0,80 0,60 0,15 4073220/A 02/96 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice.

S-PQCC-N100

Abstract: spqccn
Contextual Info: MECHANICAL DATA MPQC002 – JANUARY 1997 FJF S-PQCC-N100 0,50 75 PLASTIC LEADLESS CHIP CARRIER 0,45 0,35 1,00 TYP 55 76 54 16,60 SQ 16,40 14,50 MAX SQ 100 26 1 25 1,60 MAX 0,80 MAX 4073401/A 12/96 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice.

FlatLink

Abstract: 2TD12
Contextual Info: Time Budgeting of the FlatLink Interface Kevin Gingerich, Technical Staff SLLA013 June 1997 Printed on Recycle IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest version of relevant information

Contextual Info: IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest version of relevant information to verify, before placing orders, that the information being relied on is current.