TO 3 HEAT SINK Search Results

401F

Abstract: 403F 413F 421F 401k 413K 413-F
Contextual Info: Extruded Heat Sinks EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS 401 AND 403 SERIES Double-Surface Heat Sinks for TO-3 Case Styles TO-3; Stud-Mount Standard P/N Width in. mm Overall Dimensions in. (mm) Height in. (mm) Semiconductor Mounting Hole Pattem 401A ̆

2-64A2A

Abstract: 2-94D1A T03PN
Contextual Info: T0-3P N TQ-220SM 15 9MAX * 3 2± 0 . } 1. Gate 2. Collector (Heat Sink) 3. Emitter 1. Gate 2. Collector (Heat Sink) 3. Emitter TO-3P(LH) T0-220(IS) 1. Gate 2. Collector 3. Emitter 1. Gate 2. Collector (Heat Sink) 3. Emitter 19 T0-3P(L) 2-109A4A 3±0 5 24± 0 5

heat sink

Contextual Info: > HEAT SINK TEMPERATURE RISE ABOVE AMBIENT - °C § 3 HEAT SINK TEMPERATURE 3 3 AIR VELOCITY THERMAL RESISTANCE FROM HEAT SINK TO AMBIENT - “C/WAH l\9 SINK TO AMBIENT - °C/WATT PO ro ro t o CO ro co ro ro I M i c r o p r o c e s s o r H eat S in k s N N> Nr o) C~>

Contextual Info: 50 w atts at 25° C case temperature heat sink mounted TO-220 style pow er package Single screw mounting to heat sink Improved heat dissipation through direct substrate mounting RoHS compliant -3 - 10 10 0.63 0.65" 16.00 16.52mm 0.115 0.135" (2.92 3.44mm)

6399B

Abstract: 6400B-G 6381B 6400B-P2G 6396B-P2G 6399BG 6396BG 6396b 6400BG 6399B-P2G
Contextual Info: TO-220 & TO-218 & TO-247 & Multiwatt Heat Sinks Grease & Epoxy page112 High power extruded heat sink with large radial fins Mounting Surface Temp Rise Above Ambient—°C 5 80 4 60 3 40 2 20 1 High power extruded heat sink with large radial fins and solderable shoulder pins allows vertical

Contextual Info: presented in Figures 4 and 5 [3]. Figure 4 shows the temperature difference between evaporator and condenser at different power levels when the heat pipes are vertical. Compared to small diameter heat pipes, large diameter heat pipes transport more heat with

8340TRT00000

Contextual Info: Board Level Heat Sinks P/N: 834000T00000 & 8340TRT00000 • No Hardware Device Attachment • Direct SMT Contact to PCB • Solderable Legs • RoHS Compliant 200 400 600 80 4 60 3 40 2 20 1 1 2 3 Heat Dissipated - Watts • Specialized Body Configurations

raspberry pi 3

Contextual Info: Raspberry PI Heat Sink Kit The Farnell Raspberry PI heat sink kit will ensure your Raspberry PI remains cool with no need for Fans. They will also help extend the life of your Raspberry PI and thereby reduce hardware failures. The heat sink kit comprises of 3 high quality Pressfin heat sinks which are designed to fit

TO-268

Contextual Info: • Increased thermal performance up to 30% over bright copper heat sinks from improved radiation of the black finish • Increased surface areas by 3 times therefore thermal performance up to 300% over the aluminum stamped heat sinks on markets • Unique aluminum extrusion

Contextual Info: | | | Search Products Documentation Resources My Account Home > Products > By Type > Heat Sinks & Thermal Solutions 6 - 1542003 Customer Support > Product Feature Selector > Product Details - 3 Product Details Quick Links Heat Sink Assemblies Converted to EU RoHS/ELV Compliant

semiconductor packages

Contextual Info: | | | Search Products Documentation Resources My Account Home > Products > By Type > Heat Sinks & Thermal Solutions 7 - 1542004 Customer Support > Product Feature Selector > Product Details - 3 Product Details Quick Links Heat Sink Assemblies Converted to EU RoHS/ELV Compliant

7141DG

Abstract: 504102B00000G 50410-2 507302B00000
Contextual Info: TO-220 Heat Sinks Copper narrow channel style heat sink with integrated clip 80 8 60 6 40 4 Case Temp Rise Above Ambient—°C 2 1 2 3 Heat Dissipated—Watts 4 16.51 0.650 3.05 (0.120) 5.72 (0.225) 5 Dia of PCB Plated Thru Hole for Tabs ORDERING INFORMATION

austerlitz

Abstract: transistor k42 Layouts
Contextual Info: austerlitz electronic Kühlkörper für Plastik- und TO 3 - Transistoren Heat sinks for plastic and TO 3 transistors. Dissipateurs pour des transistors plastiques et les types TO 3 Höhe mm : 13/20/26/32 (Toleranz-1) Material: AL 1,5 Oberfläche: schwarz eloxiert

1020239

Abstract: DES285
Contextual Info: £> 5 1 Ì ^ * ^ ^ ^ S £ I f S? 1 | ä ? 1 1 1 ro o. co «B. CD i i ¡ 1^.1 HEAT SINK TEMPERATURE RISE ABOVE A M BIENT-°C 3 4 *. ._ _ ei to o ° 3 ^CD e* no o - co 03 THERMAL RESISTANCE FROM HEAT SINK TO AMBIENT - °C/WATT 2. o o Tolerances are ±28 Oil} unless otherwise specified

Contextual Info: 501603B00100G - Board level heatsinks Page 1 of 2 Tel toll-free : +1-855-32-AAVID Search Heat sinks 501603B00100G By Device TO-3 Board Level Related Information Building a Part Number Download Catalog Low cost diamond shaped basket heat sink with solderable mounts

435B

Abstract: diagram 3 phase heater diagram 3 phase heater control CSA22 G3PB-215B-2-VD G3PB-215B-3-VD G3PB-225B-2-VD G3PB-225B-3-VD G3PB-235B-2-VD G3PB-235B-3-VD
Contextual Info: Solid State Contactors Three-phase G3PB-2/-3 Refer to Safety Precautions for All Solid State Relays. Compact, Low-cost Solid State Contactors of an Innovative Construction Ideal for Three-phase Heaters • Slim Units with three-phase output. • Optimum heat sinks attach to models without built-in heat sinks.

Contextual Info: TRANSISTOR/TO SOCKETS TO SERIES TO-3 Power Transistor Sockets SPECIFY TO-3 PART NUMBER FROM THE CHART BELOW Quality sockets simplify transistor mounting, uses chassis as a heat sink. Integral mounting saddle is tapped for 6-32 NC screws. Body will not crack/chip during handling

Contextual Info: Board Level Heat Sinks P/N: 825902B05300 TO-220 PRODUCT SPECIFICATIONS CUSTOMIZED HEATSINKS • Specialized Tabs, Plating • Specialized Body Configurations • Contact Applications Engineering 200 400 600 800 1000 5 80 4 60 3 40 2 20 1 2 4 6 Heat Dissipated - Watts

G3PB-225B-3-VD

Abstract: G3PB-415B-2 G3PB-415B-3-VD
Contextual Info: Solid State Contactors Three-phase G3PB-2/-3 CSM_G3PB-2_-3_DS_E_2_1 Compact, Low-cost Solid State Contactors of an Innovative Construction Ideal for Three-phase Heaters • Slim Units with three-phase output. • Optimum heat sinks attach to models without built-in heat sinks.

PF523

Abstract: PF523G
Contextual Info: Standard Board Level Heat Sinks Page 1 of 2 Home | Contact Us | About Aavid -Useful Links- Part Number: PF523G Search by part # PF523G Check distributor part inventory Diamond shaped heat sink. For use with TO-3 packages. Order this part through an Authorized Distributor

Contextual Info: Board Level Heat Sinks P/N: 832202B00000 TO-220 PRODUCT SPECIFICATIONS CUSTOMIZED HEATSINKS • Specialized Plating • Specialized Body Configurations • Contact Applications Engineering 200 400 600 800 1000 100 20 80 16 60 12 40 8 20 4 1 2 3 Heat Dissipated - Watts

Contextual Info: TD62308AP IL08 LOW INPUT ACTIVE 1.5 A DRIVER —TOP VIEW— COM 16 04 15 I4 14 1 VCC1 2 01 3 I1 +4.5 to +5.5 V HEAT SINK & GND 13 12 4 5 HEAT SINK & GND I3 11 03 10 COM 9 6 I2 7 02 8 VCC2 (+4.5 to +5.5 V)

OMS32F60ML

Abstract: OMS38L60ML OMS60N10ML OMS75N06ML
Contextual Info: OMS38L60ML Preliminary Data Sheet OMS75N06ML OMS60N10ML OMS32F60ML 3-PHASE BRIDGE, MULTI-CHIP MODULES IN AN INDUSTRIAL ISOLATED PACKAGE 60 To 600 Volt, 25 To 75 Amp Modules, 3-Phase Bridge Configuration FEATURES • • • • • Isolated Heat Sink Low Inductance Design

qe rts diode

Abstract: 60N10
Contextual Info: Preliminary Data Sheet OMS75N06ML OMS38L60ML OMS6ONIOML OMS32F6QML 3-PHASE BRIDGE, MULTI-CHIP MODULES IN AN INDUSTRIAL ISOLATED PACKAGE 60 To 600 Volt. 25 To 75 Amp Modules. 3-Phase Bridge Configuration FEATURES • • • • • Isolated Heat Sink Low Inductance Design