TOLERANCING A BGA Search Results

Contextual Info: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS 16 PIN FLIP CHIP BGA CASE 489–01 ISSUE O DATE 02/13/2001 SCALE 2:1 16 PL LASER MARK FOR PIN A1 IDENTIFICATION IN THIS AREA 0.10 0.004 T –X– A 0.10 (0.004) T Z NOTE 5 –Y– B NOTES: 1. DIMENSIONIN AND TOLERANCING PER ANSI

Contextual Info: F R E E S C A L E SEMICONDUCTOR, ALL R I G H T S RESERVED. TITLE: INC. 6 7 2 I/O TAPE BGA, 35 X 35 PKG, 1 MM PITCH MECHANICAL OUTLINE PRINT VERSION NOT TO SCALE DOCUMENT NO: 98ARE10569D REV: A CASE NUMBER: 1589-02 26 NOV 2008 STANDARD: NON-JEDEC NOTES:

sem 2005

Contextual Info: FREESCALE SEM I w ß J c T o Q M N C V '^ T ALL RIGHTS RESERVED. TITLE: - 3 5 2 I / O TAPE BGA. 3 5 X 3 5 PKG, 1.27 MM PITCH MECHANICAL OUTLINE PRINT vifeföhl I ^ “Sl^LE DOCUMENT NO: 98ASS23837W REV: C CASE NUMBER: 1157-02

MS-034

Abstract: JEDEC MS-034 JEDEC bga case outline OMPAC MS034 MS 034
Contextual Info: TOP VIEW 8 91 ' ‘n i213141516171819 rh 0 0 .3 A 1B 1C 1 0 0 .1 5 ® A SIDE VIEW BOTTOM VIEW FREESCALE SEMICONDUCTOR, INC. ALL RIGHTS RESERVED. PBG A, T IT L E : 241 1.27 I/O , MECHANICAL OUTLINE STD PROFILE, 25 MM PITCH X 25 PKG, OMPAC BGA PR IN T VERSION NOT TO SCALE

JEDEC bga case outline

Abstract: tolerancing a bga 8439
Contextual Info: FREESCALE SEMICONDUCTOR, ALL RIGHTS RESERVED. TITLE: INC. MECHANICAL OUTLINE 783 I/O, FC BGA, 29 X 29 PKG, 1 MM PI TCH, WITH CAP ZONES PRINT VERSION NOT TO SCALE DOCUMENT NO: 98ARE10662D REV: A CASE NUMBER: 1 8 6 5 - 0 2 16 OCT 2006 STANDARD: NON JEDEC

MO-192

Abstract: JEDEC bga case outline
Contextual Info: FREESCALE SEMICONDUCTOR, INC. ALL RIGHTS RESERVED. TITLE: MECHANICAL OUTLINE 5 0 0 I / O TAPE BGA, 31 X 31 PKG, 1 MM r i IUH PRINT VERSION NOT TO SCALE DOCUMENT NO: 98A R S 10509D REV: A CASE NUMBER: 1 4 7 5 -0 1 18 AUG 2 0 0 5 STANDARD: JEDEC M O -1 9 2 , VARIATION A A N -1

5B-10

Contextual Info: TOP VIEW 4 BOTTOM VIEW F R E E S C A L E SEMICONDUCTOR, ALL R I G H T S RESERVED. TITLE: INC. - °d A 0 .3 © A|B|C 0 0.151AI MECHANICAL OUTLINE 783 I/O, FC BGA, 29 X 29 PKG, 1 MM PI TCH, WITH FULL FOOTED LID PRINT VERSION NOT TO SCALE DOCUMENT NO: 98ARE10641D

MO-192

Abstract: JEDEC bga case outline aan1
Contextual Info: FREESCALE SEMICONDUCTOR, INC. ALL RIGHTS RESERVED. TITLE: MECHANICAL OUTLINE 3 2 4 I / O TA P E BGA, 31 X 31 PKG, 1 MM PITCH PRINT VERSION NOT TO SCALE DOCUMENT NO: 9 8A S A 9 9 3 4 6 D REV: A CASE NUMBER: 1 3 8 2 -0 1 0 4 AUG 2 0 0 5 STANDARD: JEDEC M O -1 9 2 , VARIATION A A N -1

tray datasheet bga

Abstract: 4925 B JEP95
Contextual Info: BGA Package 35-Lead 11.25mm x 6.25mm × 4.92mm (Reference LTC DWG# 05-08-1879 Rev Ø) A aaa Z E Y Z DETAIL A A2 X PIN 1 3 A1 A ccc Z PIN “A1” CORNER G SEE NOTES b B 4 C D b1 MOLD CAP D F E SUBSTRATE 0.27 – 0.37 // bbb Z aaa Z G H DETAIL B 5 PACKAGE TOP VIEW

JEP95

Abstract: tray datasheet bga MS-028
Contextual Info: BGA Package 45-Lead 11.25mm x 9.00mm × 4.92mm (Reference LTC DWG# 05-08-1869 Rev Ø) A aaa Z E Y Z DETAIL A A2 X G SEE NOTES PIN 1 3 A1 A ccc Z PIN “A1” CORNER B 4 b D b1 MOLD CAP D C F E SUBSTRATE 0.27 – 0.37 // bbb Z aaa Z G H DETAIL B 7 PACKAGE TOP VIEW

Contextual Info: TOP VIEW 5X 0 .8 0 .4 r 0 .4 i— 15X 0 .8 1 iv '1' -96X 0 0 .4 5 0 .3 5 CM r o m rh 0 0 . 1 5 | a | b | c | 00.08® A <D SIDE VIEW A1 INDEX AREA BOTTOM VIEW FREESCALE SEMICONDUCTOR, INC. ALL RIGHTS RESERVED. TITLE: MECHANICAL OUTLINE p BGA LOW PROFILE,

4925 B

Abstract: tray datasheet bga JEP95 4925 B transistor OB35
Contextual Info: BGA Package 35-Lead 11.25mm x 6.25mm × 3.42mm (Reference LTC DWG# 05-08-1878 Rev Ø) A aaa Z E Y Z DETAIL A A2 X PIN 1 3 A1 A ccc Z PIN “A1” CORNER G SEE NOTES b B 4 C D b1 MOLD CAP D F E SUBSTRATE 0.27 – 0.37 // bbb Z aaa Z G H DETAIL B 5 PACKAGE TOP VIEW

4925 B

Abstract: MS-028 BGA package tray 40 x 40 JEP95 tray datasheet bga JEP95 MS-028
Contextual Info: BGA Package 40-Lead 11.25mm x 6.25mm × 4.92mm (Reference LTC DWG# 05-08-1867 Rev Ø) A aaa Z E Y Z DETAIL A A2 X G SEE NOTES PIN 1 3 A1 A ccc Z PIN “A1” CORNER B 4 b D b1 MOLD CAP D C F E SUBSTRATE 0.27 – 0.37 // bbb Z aaa Z G H DETAIL B 5 PACKAGE TOP VIEW

JEP95

Abstract: BGA144 tray datasheet bga JEP95 MS-028 bga tray
Contextual Info: BGA Package 144-Lead 15mm x 15mm × 4.92mm (Reference LTC DWG # 05-08-1880 Rev Ø) DETAIL A Z A M A2 aaa Z L K J H G F E D C B PIN 1 A 1 PIN “A1” CORNER 2 b A1 4 ccc Z 3 4 5 b1 MOLD CAP 6 F D SUBSTRATE 7 0.27 – 0.37 8 // bbb Z 3.95 – 4.05 9 DETAIL B

JEP95

Abstract: tray datasheet bga BGA-32
Contextual Info: BGA Package 32-Lead 15mm x 11.25mm × 4.98mm (Reference LTC DWG # 05-08-1860 Rev A) A DETAIL A Z 8 A2 aaa Z 7 6 5 4 3 2 1 PIN 1 A PIN “A1” CORNER A1 4 b B ccc Z C D E b1 MOLD CAP F D F SUBSTRATE G 0.33 – 0.43 // bbb Z 3.95 – 4.05 H DETAIL B J K

BGA PACKAGE TOP MARK

Abstract: 431 marking code marking 5238
Contextual Info: 4 31 X A1 INDEX — y SEE NOTE 1 0 \ 0.15 A A SEATING PLANE 1 2, 3 4- 5 6. 7 8. 10 12 14 16 18 20 22 rh BOTTOM FREESCALE SEMICONDUCTOR, INC. ALL RIGHTS RESERVED. VIEW 0 0 .1 5 | a | b | c | 0 0 .0 8 ® A MECHANICAL OUTLINE TITLE: 431 I / O FC BGA. 2 0 X 2 0 PKG, 0 . 8 MM PITCH,

A2A1G

Abstract: JEP95 BGA-50
Contextual Info: BGA Package 50-Lead 11.25mm x 9.00mm × 3.42mm (Reference LTC DWG# 05-08-1883 Rev Ø) A aaa Z E Y X Z DETAIL A A2 A1 G SEE NOTES PIN 1 3 ccc Z A PIN “A1” CORNER B 4 b b1 MOLD CAP D D F SUBSTRATE E H1 F e Z H2 // bbb Z C G DETAIL B H aaa Z Øb (50 PLACES)

JEP95

Contextual Info: BGA Package 140-Lead 11.25mm x 9.00mm × 2.72mm aaa Z (Reference LTC DWG # 05-08-1849 Rev A) A Y E E1 Z aaa Z DETAIL A e A2 b PIN 1 A B PIN “A1” CORNER C A1 4 b ccc Z D E F b1 MOLD CAP D G D1 H SUBSTRATE J 0.27 – 0.37 // bbb Z 1.95 – 2.05 K L DETAIL B

JEP95

Contextual Info: BGA Package 133-Lead 15mm x 15mm × 3.42mm (Reference LTC DWG # 05-08-1877 Rev Ø) DETAIL A Z A 12 A2 aaa Z 11 10 9 8 7 6 5 4 3 2 PIN 1 1 A PIN “A1” CORNER B b A1 4 ccc Z C D E b1 MOLD CAP F F D SUBSTRATE G 0.27 – 0.37 H // bbb Z 2.45 – 2.55 J DETAIL B

JEP95

Abstract: MS-028
Contextual Info: BGA Package 44-Lead 15mm x 15mm × 5.02mm (Reference LTC DWG # 05-08-1881 Rev Ø) A DETAIL A Z 11 A2 aaa Z 10 9 8 7 6 5 4 3 2 1 PIN 1 A PIN “A1” CORNER A1 4 b B ccc Z C D E b1 MOLD CAP F D F SUBSTRATE G 0.37 – 0.47 // bbb Z 3.95 – 4.05 H DETAIL B

JEP95

Abstract: JEP95 MS-028 BGA 8 x 8 tray
Contextual Info: BGA Package 221-Lead 15mm x 11.25mm × 2.82mm (Reference LTC DWG# 05-08-1886 Rev Ø) Z A aaa Z E Y A2 X DETAIL A SEE NOTES 13 12 11 10 9 8 7 6 5 4 3 2 1 PIN 1 3 A A1 PIN “A1” CORNER B ccc Z C 4 D b E b1 MOLD CAP F SUBSTRATE // bbb Z H J F Z H2 D G H1

JEP95

Contextual Info: BGA Package 71-Lead 15mm x 9.00mm × 3.42mm (Reference LTC DWG# 05-08-1885 Rev Ø) A aaa Z E Y Z DETAIL A A2 X SEE NOTES 7 6 5 4 3 2 1 PIN 1 3 A A1 PIN “A1” CORNER B ccc Z 4 C D b b1 MOLD CAP E SUBSTRATE D G Z // bbb Z F F H1 H2 H DETAIL B J e Øb (71 PLACES)

Contextual Info: Plastic Packages for Integrated Circuits Plastic Ball Grid Array Packages BGA o V100.11x11 A1 CORNER 100 BALL PLASTIC BALL GRID ARRAY PACKAGE A INCHES D A1 CORNER I.D. E B TOP VIEW 0.15 M C 0.006 0.08 0.003 M C A B A1 CORNER D1 10 9 8 7 6 5 4 3 2 1 S A1

Contextual Info: Plastic Packages for Integrated Circuits Plastic Ball Grid Array Packages BGA o A A1 CORNER V196.12x12 D 196 BALL PLASTIC BALL GRID ARRAY PACKAGE INCHES A1 CORNER I.D. E B TOP VIEW 0.15 M C A B 0.006 0.08 M C 0.003 b A1 CORNER D1 14 13 12 11 10 9 8 7 6 5 4 3 2 1