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TLP2301
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Toshiba Electronic Devices & Storage Corporation
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Photocoupler (photo-IC output), 3750 Vrms, 4pin SO6 |
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68023-219HLF
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 19 Positions, 2.54mm Pitch, RightAngle, 3.42mm (0.135in) Mating, 7.75mm (0.305in) Tail. |
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76382-321LF
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Amphenol Communications Solutions
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Dubox®2.54mm, Board to Board Connector, Shrouded Header, Single Row, Right Angle. |
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68023-211HLF
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 11 Positions, 2.54mm Pitch, RightAngle, 3.42mm (0.135in) Mating, 7.75mm (0.305in) Tail. |
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68023-216HLF
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 16 Positions, 2.54mm Pitch, RightAngle, 3.42mm (0.135in) Mating, 7.75mm (0.305in) Tail. |
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