TQFP 32 PACKAGE Search Results

32TQFP

Contextual Info: SK19XX Family 1:9 Signal Distribution TEST AND MEASUREMENT PRODUCTS Ordering Information Ord ering Cod e Package ID SK1900ATF 32-TQFP 5 x 5 mm SK1901ATF 32-TQFP 5 x 5 mm SK1902ATF 32-TQFP 5 x 5 mm SK1903ATF 32-TQFP 5 x 5 mm SK1904ATF 32-TQFP 5 x 5 mm SK1925ATF

TQP32

Contextual Info: SK19XX Family 1:9 Signal Distribution PRELIMINARY HIGH-PERFORMANCE PRODUCTS Ordering Information Ordering Code Package ID Temperature Range SK1900 32-TQFP 5 x 5 mm Commercial SK1901 32-TQFP 5 x 5 mm Commercial SK1902 32-TQFP 5 x 5 mm Commercial SK1903 32-TQFP

Contextual Info: SL6619 Direct Conversion FSK Data Receiver Data Sheet August 2005 Ordering Information SL6619/KG/TP1N 32 Pin TQFP SL6619/KG/TP1Q 32 Pin TQFP SL6619/KG/TP2Q 32 Pin TQFP* SL6619/KG/TP2N 32 Pin TQFP* The SL6619 is an advanced Direct Conversion FSK Data Receiver for operation up to 450 MHz. The device integrates all

LQFP

Contextual Info: Case Dimension Cross-Reference Tables Table 1. Clock Generators Device Table 3. Zero–Delay Buffers Package Case Number Page Package Case Number Page MPC930 32 TQFP 873A 638 MPC953 32 LQFP 873A 638 MPC931 32 TQFP 873A 638 MPC954 24 TSSOP 948H 640 MPC9315

Contextual Info: 19-2829; Rev 1; 7/03 Anything-to-LVDS Dual 2 x 2 Crosspoint Switches Ordering Information TEMP RANGE PIN-PACKAGE MAX9390EHJ PART -40°C to +85°C 32 TQFP MAX9390ETJ* -40°C to +85°C 32 Thin QFN MAX9391EHJ -40°C to +85°C 32 TQFP MAX9391ETJ* -40°C to +85°C

Contextual Info: PA-H8/338- T 80 Data Sheet 80 pin QFP(TQFP) socket/32 pin DIP 0.6” plug Supported Device/Footprints Adapter Parts & Part Numbers These adapters allow EPROM programming of Hitachi H8/337 and H8/338 devices in their QFP or TQFP packages on 32 pin DIP programmers.

ADV0406

Abstract: TQFP 32 PACKAGE altera TQFP 32 PACKAGE MS-026 MS-026 TQFP
Contextual Info: CUSTOMER ADVISORY ADV0406 TQFP 32 PACKAGE TOP MOLD AND EJECTOR SIZE CHANGE Change Description: Due to assembly process improvements undertaken at our assembly supplier, slight dimensional changes are being made to the 32 lead thin quad flat pack TQFP packages. The dimension changes involve an increase of the top mold

MAX3877

Abstract: MAX3877EHJ MAX3878 MAX3878EHJ
Contextual Info: 19-2062; Rev 0; 5/01 2.5Gbps, +3.3V Clock and Data Retiming ICs with Vertical Threshold Adjust Ordering Information TEMP. RANGE PIN-PACKAGE MAX3877EHJ PART -40°C to +85°C 32 TQFP-EP* MAX3877E/D* -40°C to +85°C DICE* MAX3878EHJ -40°C to +85°C 32 TQFP-EP*

Contextual Info: 19-2062; Rev 0; 5/01 2.5Gbps, +3.3V Clock and Data Retiming ICs with Vertical Threshold Adjust Ordering Information TEMP. RANGE PIN-PACKAGE MAX3877EHJ PART -40°C to +85°C 32 TQFP-EP* MAX3877E/D* -40°C to +85°C DICE* MAX3878EHJ -40°C to +85°C 32 TQFP-EP*

32-lead TQFP

Contextual Info: PACKAGE INFORMATION Micrel 32 LEAD TQFP DIE UP (T32-1) Rev. 01 Rev.: C 1 Amendment: 0 Issue Date: July, 1999

W10625

Contextual Info: 1.6 in 32 pin TQFP to 28 pin DIP 0.22 in 0.5 in 0.1 in Part Number W10625 Top Package TQFP Top Pitch 0.8mm Bottom Package DIP Bottom Pitch 7.62mm 0.3" Top Pins 32 Bottom Pins 28 Programming Adapter: Supported Devices ATtiny28 - TQFP32 1.4 in 0.3 in All information contained in this document remains the interllectual property of Winslow Adaptics

H321

Abstract: H32-1
Contextual Info: PACKAGE INFORMATION Micrel 32 LEAD EPAD-TQFP DIE UP (H32-1) Rev. 01 Rev.: A 1 Amendment: 0 Issue Date: February 2000

ATF-13136-TR1

Abstract: transistor tag 306 MARK A1 SOT-143 sot-23 6121 ATF13136-TR1 Amplifier Micro-X "marking code" D
Contextual Info: Tape and Reel Packaging for Semiconductor Devices Package Outlines 05, 08A, 36, 76, 84, 86, MSOP-3, SOIC-8, SOT-23, SOT-143, SOT-323, SOT-343, SOT-363, SSOP-16, TQFP-32, and TQFP-48 Technical Data Description Related Standard This data sheet is intended to

ATF-13136-TR1

Abstract: ATF13136 atf-13136 HPMX-5001 SSOP-16 TQFP-48 On semiconductor date Code sot-143 micro-x marking code E1 transistor tag 306
Contextual Info: Tape and Reel Packaging for Semiconductor Devices Package Outlines 05, 08A, 36, 76, 84, 86, MSOP-3, SOIC-8, SOT-23, SOT-143, SOT-323, SOT-363, SSOP-16, TQFP-32, and TQFP-48 Technical Data Description Related Standard This data sheet is intended to cover standards on tape and reel

Contextual Info: GS84018/32/36AGT/B*-180/166/150/100 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs TQFP, BGA Commercial Temp Industrial Temp Features n ig D es fo r N ew Flow Through/Pipeline Reads The function of the Data Output register can be controlled by the user via the FT mode pin/bump pin 14 in the TQFP and

LA-3A70B-1

Contextual Info: TRAY CONTAINER UNIT : mm 335±1.0 23.5±0.5 288±0.5 A A' 137.5±0.5 180±1.0 21.25±0.5 27.5±0.1 32±0.1 16.4 NEC LA–3A70B–1 HEAT PROOF 16.4 <SECTION A - A'> 16.4 5.8 6.8 8.8 13.0 Applied Package 100 pin Plastic TQFP Fine Pitch (1.0 mm thick) 120 pin Plastic TQFP (Fine Pitch)(1.0 mm thick)

Contextual Info: MAX5631/MAX5632/ MAX5633 16-Bit DACs with 32-Channel Sample-and-Hold Outputs General Description Ordering Information PART TEMP RANGE* MAX5631UCB+D 0°C to +85°C 64 TQFP MAX5631UTK+ 0°C to +85°C 68 TQFN-EP* 0°C to +85°C 64 TQFP MAX5632UTK+ 0°C to +85°C

LA-3A70B-1

Abstract: TQFP
Contextual Info: UNIT : mm 335±1.0 23.5±0.5 288±0.5 A A' 137.5±0.5 180±1.0 21.25±0.5 27.5±0.1 32±0.1 16.4 NEC LA–3A70B–1 HEAT PROOF 16.4 <SECTION A - A'> 16.4 5.8 6.8 8.8 13.0 Applied Package 100 pin Plastic TQFP Fine Pitch (1.0 mm thick) 120 pin Plastic TQFP (Fine Pitch)(1.0 mm thick)

HPMX-5001

Abstract: HPMX-3002 HPMX-3003 HPMX-5002 SSOP-28 TQFP-48 PA 3002
Contextual Info: Multi-Function RFICs Part Number Description Package Vcc V Ic (mA) Page No. HPMX-3002 HPMX-3003 HPMX-5001 HPMX-5002 SO-8 SSOP-28 TQFP-32 TQFP-48 6 3 3 3 160 5 / - / 450 39, 60 21 6-76 7-82 7-90 7-105 900 MHz integrated driver amplifier 1.5 - 2.5 GHz LNA / switch / PA

tqfp 7x7

Abstract: W502 thermal conductivity
Contextual Info: Thermal Data  TQFP 7x7 32 leads 32 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.15 mm 3.9 W/cm°C die attach silver glue 10-40 µm 0.01 W/cm°C molding compound epoxy resin 1.4 mm 0.0063W/cm°C Frame options :

Contextual Info: 19-2078; Rev 1; 2/02 1:10 Differential LVPECL/LVECL/HSTL Clock and Data Drivers Both devices are offered in space-saving, 32-pin 5mm ✕ 5mm TQFP, 5mm x 5mm QFN, and industry-standard 32-pin 7mm x 7mm LQFP packages. Applications Precision Clock Distribution

MAX9420

Abstract: MAX9420EHJ MAX9421 MAX9421EHJ MAX9422 MAX9422EHJ MAX9423 MAX9423EHJ QFN50
Contextual Info: 19-2285; Rev 0; 1/02 Quad Differential LVECL-to-LVPECL Translators The MAX9420–MAX9423 are specified for operation from -40°C to +85°C, and are offered in space-saving 32-pin 5mm ✕ 5mm TQFP and 32-lead 5mm ✕ 5mm QFN packages. Applications Features

mo135

Abstract: MO-135
Contextual Info: Revised January 1999 Package VBE032 32-Lead Thin Quad Flat Package TQFP , JEDEC MO-135, 7mm Square Package Number VBE032 1999 Fairchild Semiconductor Corporation vbe032.prf www.fairchildsemi.com Package VBE032 January 1999

Contextual Info: MAX5631/MAX5632/ MAX5633 16-Bit DACs with 32-Channel Sample-and-Hold Outputs General Description PART TEMP RANGE* MAX5631UCB+D 0°C to +85°C 64 TQFP MAX5631UTK+ 0°C to +85°C 68 TQFN-EP* 0°C to +85°C 64 TQFP MAX5632UTK+ 0°C to +85°C 68 TQFN-EP* MAX5633UCB+D