TQFP44 PACKAGE Search Results

Contextual Info: ST7MDT25-T44/DVP TQFP44 10x10 Connection Kit for ST7MDT25-DVP3 DATA BRIEF The TQFP44 (10x10) Connection Kit (ST7 MDT25-T44/DVP) provides the hardware you need to connect your ST7MDT25-DVP3 emulator to your application when debugging applications for ST7 microcontrollers in the TQFP44 (10x10)

Contextual Info: DB-TQFP44-89V52X2 USB-Dongle and Derivative Boards The DB-TQFP44-89V52X2 is the Derivative Board for the P89V52X2 microcontroller in a 44 pin TQFP package. The DB-TQFP44-89V52X2 requires the use of the USB-Dongle for power and a programming interface. The USB-Dongle and DB-TQFP44-89V52X2 allow quick and easy ICP

atmega16

Abstract: atmega32 TQFP44 ATmega8535
Contextual Info: 2 in 44 pin TQFP to 40 pin DIP 0.7 in Part Number W10627 Top Package TQFP Top Pitch 0.80mm Bottom Package DIP Bottom Pitch 15.24mm 0.600" Top Pins 44 Bottom Pins 40 Programming Adapter: Supported Devices ATmega16 - TQFP44 ATmega32 - TQFP44 ATmega8535 - TQFP44

TQFP44 footprint

Abstract: 89V52 11.0592 CRYSTAL used in microcontroller 11.0592 mhz crystal oscillator 2 pin crystal oscillator 11.0592 mhz TQFP44 P89V52X2 LPC2000 LPC2103 use of crystal 11.0592 MHz
Contextual Info: DB-TQFP44-89V52X2 USB-Dongle and Derivative Boards The DB-TQFP44-89V52X2 is the Derivative Board for the P89V52X2 microcontroller in a 44 pin TQFP package. The DB-TQFP44-89V52X2 requires the use of the USB-Dongle for power and a programming interface. The USB-Dongle and DB-TQFP44-89V52X2 allow quick and easy ICP

DB544

Abstract: TQFP44
Contextual Info: ST7MDT20-T44/DVP TQFP44 10x10 Connection Kit for ST7MDT20-DVP3 DATA BRIEF The TQFP44 (10x10) Connection Kit (ST7 MDT20-T44/DVP) provides the hardware you need to connect your ST7MDT20-DVP3 emulator to your application when debugging applications for ST7 microcontrollers in the TQFP44 (10x10)

TQFP44

Contextual Info: ST7MDT25-T44/DVP TQFP44 10x10 Connection Kit for ST7MDT25-DVP3 DATA BRIEF The TQFP44 (10x10) Connection Kit (ST7 MDT25-T44/DVP) provides the hardware you need to connect your ST7MDT25-DVP3 emulator to your application when debugging applications for ST7 microcontrollers in the TQFP44 (10x10)

Atmel STK600 schematic

Abstract: ATSTK600
Contextual Info: Products: 0 Home / Starter kits Subtotal: $0 Shopping List Search / Atmel STK600 -TQFP44 Starter kits Home Store Search Starter kits Select Device Select Category Enter Keywords: Debuggers Starter kits Programmers Atmel STK600 -TQFP44 ATSTK600 -SC06 Touch kits

TQFP44

Abstract: TQFP-44
Contextual Info: Philips Semiconductors Package outlines TQFP44: plastic thin quad flat package; 44 leads; body 10 x 10 x 1.0 mm 1997 Aug 04 634 SOT376-1

MC14528 equivalent

Abstract: STV2000 TQFP44
Contextual Info: STV2000 I2C SINGLE FREQUENCY DEFLECTION PROCESSOR AND 70 MHz RGB PREAMPLIFIER PRELIMINARY DATA The STV2000 is an I2C-controlled monolithic integrated circuit assembled in a TQFP44 plastic package. It combines both a deflection block horizontal and vertical, single frequency with very

Contextual Info: TQFP44-P-1010-0.80-K Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.28 TYP. 5/Oct. 28, 1996

ST7538QTR

Abstract: ST7538Q XTAL 16Mhz 76660 ST7537 TQFP44 D03IN1412A 85449
Contextual Info: ST7538Q FSK power line transceiver General features • Half duplex frequency shift keying FSK transceiver ■ Integrated power line driver with programmable voltage and current control ■ Programmable interface: – Synchronous – Asynchronous TQFP44 Slug Down

ST7538Q

Contextual Info: ST7538Q FSK power line transceiver General features • Half duplex frequency shift keying FSK transceiver ■ Integrated power line driver with programmable voltage and current control ■ Programmable interface: – Synchronous – Asynchronous TQFP44 Slug Down

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TQFP44 package SOT376-1 Hx Gx P2 Hy 0.125 P1 Gy By Ay C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout solder land

TQFP44

Contextual Info: TQFP44-P-1010-0.80-K Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.

OF TL084 OPAMP

Abstract: audio Amp. mosfet 1000 watt 3000 Watt BTL Audio Amplifier AUDIO AMPLIFIER 140 WATT MOSFET 24v 5 amp smps TDA2320A replacement DC MOTOR DRIVE WITH LM324 NE555 IGBT DRIVER TSM1001 lm336 sot23
Contextual Info: Standard linear portfolio From innovative devices to application specific products Package Flip chip DFN8 Mini SO8 SO8 S014/16 SO20 SO24 batwing SOT23-3/5 TO92 TQFP44/48 TSSOP8 TSSOP14/16 TSSOP28 Tape width mm Qty/reel (min.order qty) Lead-free available

diode b6 k 450

Abstract: 193 ec5 MPEG2 sdi STA015T LFBGA64 STA015 STA015B TQFP44 G7234 STA013
Contextual Info: STA015 STA015B STA015T MPEG 2.5 LAYER III AUDIO DECODER WITH ADPCM CAPABILITY • SINGLE CHIP MPEG2 LAYER 3 DECODER SUPPORTING: – All features specified for Layer III in ISO/IEC 11172-3 MPEG 1 Audio TQFP44 SO28 – All features specified for Layer III in ISO/IEC

193 ec5

Abstract: MFS 100 dla001 STA015
Contextual Info: STA015 STA015B STA015T MPEG 2.5 LAYER III AUDIO DECODER WITH ADPCM CAPABILITY • SINGLE CHIP MPEG2 LAYER 3 DECODER SUPPORTING: – All features specified for Layer III in ISO/IEC 11172-3 MPEG 1 Audio TQFP44 SO28 – All features specified for Layer III in ISO/IEC

LFBGA64

Abstract: STA015 STA015B STA015T TQFP44
Contextual Info: STA015 STA015B STA015T MPEG 2.5 LAYER III AUDIO DECODER WITH ADPCM CAPABILITY • SINGLE CHIP MPEG2 LAYER 3 DECODER SUPPORTING: – All features specified for Layer III in ISO/IEC 11172-3 MPEG 1 Audio TQFP44 SO28 – All features specified for Layer III in ISO/IEC

g723 ADPCM algorithm

Abstract: 14.7456mhz diode b6 k 450 DVI dual link receiver 14 pin ic recorder voice 193 ec5 ASF3 ic 1240 equivalent ics mpeg-2 iso iec 13818 standard TO 48 A IC MP3 PROCESSOR
Contextual Info: STA015 MPEG 2.5 LAYER III AUDIO DECODER WITH ADPCM CAPABILITY „ SINGLE CHIP MPEG2 LAYER 3 DECODER SUPPORTING: – All features specified for Layer III in ISO/IEC 11172-3 MPEG 1 Audio TQFP44 SO28 – All features specified for Layer III in ISO/IEC 13818-3.2 (MPEG 2 Audio)

MS-026

Abstract: TQFP44 tqfp44 package outline
Contextual Info: PDF: 2003 Nov 13 Philips Semiconductors Package outline TQFP44: plastic thin quad flat package; 44 leads; body 10 x 10 x 1 mm SOP010 c y X 33 23 ZE 34 22 e E HE A A2 A1 θ bp Lp pin 1 index L detail X 44 12 1 11 e ZD bp D HD 2.5 5 mm scale DIMENSIONS mm are the original dimensions

sot376

Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline TQFP44: plastic thin quad flat package; 44 leads; body 10 x 10 x 1.0 mm SOT376-1 c y X A 33 23 34 22 ZE e E HE A A2 wM A 3 A1 θ bp pin 1 index Lp L detail X 12 44 11 1 ZD e v M A wM bp D B HD v M B

Contextual Info: Package outline TQFP44: plastic thin quad flat package; 44 leads; body 10 x 10 x 1.0 mm SOT376-1 c y X A 33 23 34 22 ZE e E HE A A2 w M A 3 A1 θ bp pin 1 index Lp L detail X 12 44 11 1 ZD e v M A w M bp D B HD v M B 2.5 5 mm scale DIMENSIONS (mm are the original dimensions)

MS-026

Abstract: TQFP44
Contextual Info: PDF: 2002 Mar 14 Philips Semiconductors Package outline TQFP44: plastic thin quad flat package; 44 leads; body 10 x 10 x 1.0 mm SOT376-1 c y X A 33 23 34 22 ZE e E HE A A2 w M A 3 A1 θ bp pin 1 index Lp L detail X 12 44 11 1 ZD e v M A w M bp D B HD v M B

MS-026

Abstract: TQFP44
Contextual Info: PDF: 2000 Jan 20 Philips Semiconductors Package outline TQFP44: plastic thin quad flat package; 44 leads; body 10 x 10 x 1.0 mm SOT376-1 c y X A 33 23 34 22 ZE e E HE A A2 w M A 3 A1 θ bp pin 1 index Lp L detail X 12 44 11 1 ZD e v M A w M bp D B HD v M B