TRAY QFP32 Search Results

Tray

Abstract: TRAY DIMENSIONS QFP-48A qfp tray standard QFp Package tray carbon black
Contextual Info: MITSUMI Packing Packing Tray Packing 1. Tray dimensions for QFP Models used QFP-32A QFP-48A Maximum number stored 50/tray 50/tray Units : mm No holes in 16 places 116.0 18.0 20.0 4 =80.0 9.8 9. 8 18.0 20.0 9 =180.0 4.1 216.0 1.3 5.4 Material: PS with carbon black (hard

vqfp100 package

Abstract: S2P24 BA4558F-T1
Contextual Info: Packaging Packaging type Package DIP/SDIP Tube SIP/HSIP/ZtP/SZIP Tube Packaging code Tube SOP/SSOP/HSOP QFP/SQFP/VQFP Paper taping T l, T2 Difference in taping direction Embossed taping E1, E2 (Difference in taping direction) Tray VP Tray (dry pack) FTR/TO-92/TO-220/TO-220FP

LQFP144

Abstract: QFN24 tray qfp32 QFN tray QFP52-A2 QFP52-S1 SSOP20 DIP18 DIP20 DIP32
Contextual Info: PACKING SPECIFICATION TABLE • General Description NJRC delivers ICs in 4 methods, plastic tube container, two kinds of Taping, tray and vinyl bag packing. Except adhesive tape treated anti electrostatic and contain carbon are using as the ESD Electrostatic

DIP18

Abstract: DIP20 DIP40 SDIP22 SDIP24 SDIP28 SDIP30 TO-252 njrc
Contextual Info: PACKING SPECIFICATION TABLE • General Description NJRC delivers ICs in 4 methods, plastic tube container, two kinds of Taping, tray and vinyl bag packing. Except adhesive tape treated anti electrostatic and contain carbon are using as the ESD Electrostatic

JEDEC tray standard

Abstract: QFP48-P-0707 QFP48 package QFP32-P-0707 QFP48
Contextual Info: Product Change Notification Type of Notification: ISSUE DATE LAST BUY DATE NOTIFICATION NO. LAST SHIP DATE March 23, 2005 NA 20050323-03 March, 2005 This is to advise you that the following product s have been discontinued. Product ID (Description): Tray change for all IC’s that are packaged in QFP32-P-0707 and QFP48-P-0707package.

LGA 1156 PIN OUT diagram

Abstract: QFP11T144-002 LGA 1156 Socket diagram 216-LQFP Wells-CTI 36 lead Flat Pack smd AAAS Wells-CTI LCC socket Wells-CTI 880 020 BGA136 Enplas drawings
Contextual Info: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and

T0220FP-5-V5

Contextual Info: Packaging Specifications Monolithic 1C ^ Monolithic ICs _ Quick reference of packaging specifications Package Container type DIP/SDIP Tube container SIP/HSIP/ZIP/SZIP Tube container Packaging specification code Tube container SO P/SSO P/HSO P Paper tape on reel

vqfp100 package

Abstract: TO220CP-3 TQFP128U SOP8 package tray VSOF5 TQFP176U TSSOP-B8J TSSOP-B14 tl 32 icp VQFP100
Contextual Info: Product Designation Company info Page 1 of 2 Products > LSIs Lineup • LSI Packages > Product Designation Sales Products LSIs ROHM LSI Solution General-purpose LSIs Mobile Phone LSIs Product Designation •When ordering, specify the part number. •Check each code against the tables shown below.

vqfp100 package

Abstract: TQFP128U SSOP-A20 Contact Image Sensor VQFP100
Contextual Info: Appendix Notes No technical content pages of this document may be reproduced in any form or transmitted by any means without prior permission of ROHM CO.,LTD. The contents described herein are subject to change without notice. The specifications for the product described in this document are for reference only. Upon actual use, therefore, please request

NE55321

Abstract: LM324 slew rate lm324 and lm339 BA10324 LM324 FUNCTION LS4558 LM358 lm358 24v slew rate LM324 QFP32
Contextual Info: LINEAR AND SPECIAL FUNCTION ICs OPERATIONAL AMPLIFIERS, COMPARATORS, SWITCHING REGULATORS, DRIVERS, COMMUNICATIONS • MADE PRIMARILY FOR CONSUMER MARKETS, OFTEN PROVIDING ADDITIONAL FEATURES COMPARED TO INDUSTRY STANDARD ITEMS SOP8 – 18 DIMENSIONS A • MANY PARTS PROVIDE OPERATION OVER -40˚C TO + 85˚C.

Contextual Info: Standard ICs Segment-type LCD driver BU9729K The BU9729K is a driver for segmented liquid crystal displays, which enables connection with a microcomputer through a serial interface. 4-bit common output and an internal power supply circuit for LCD drive make it possible to

transistor SR 13001

Abstract: RCA SK CROSS-REFERENCE PCD8572I ATmel 730 24c04 SR 13001 transistor atmel 716 24c04 UNITRODE applications handbook uc3842 -96 all 89c51 microcontroller references book QFP44 footprint HI5618
Contextual Info: INTEGRATED CIRCUITS DATA SHEET PCF5001 POCSAG Paging Decoder Product specification Supersedes data of 1995 Apr 27 File under Integrated Circuits, IC17 1997 Mar 04 Philips Semiconductors Product specification POCSAG Paging Decoder PCF5001 CONTENTS BLOCK DIAGRAMS

Contextual Info: www.fairchildsemi.com FMS7950 Clock Multiplier Features • • • • • • • • • Feedback select FBsel pin allows for wider range of input frequencies. When connected low, the lower input frequency range is selected. This provides output frequencies of up to

d92 02

Abstract: BU9735K CS4725 POWER SUPPLY WITH 7 SEGMENT DISPLAY BU9796FS diode d92 02 power supply 3com BU9718KV variable power supply circuit d92 02 diode
Contextual Info: TECHNICAL NOTE LCD Segment Driver series For 72/80/96 Segment type LCD LCD Segment Driver BU9735K, BU9796FS, BU9716BKV, BU9718KV ● Outline This is LCD segment driver for 72-96 segment type display. There is a lineup which is suitable for multi function display and is integrated display RAM and power supply circuit for LCD driving with 4 common

SI510

Contextual Info: Timing Selector Guide SPRING 2014 HIGH PERFORMANCE CUSTOMIZABLE FREQUENCY FLEXIBILITY 2-WEEK LEAD TIME 2 / C L O C K A N D O S C I L L AT O R S E L E C T O R Timing Solutions Comprehensive — complete portfolio of oscillators, clock generators, clock buffers and jitter attenuators

AT89C51CC02CA-RATUM

Abstract: AT89C51CC02UA AT89C51CC02 T89C51CC02 80C51 PLCC28 SOIC24 SOIC28 VQFP32 EXEN21
Contextual Info: Features • • • • • • • • • • • • • • • • • • • • • • • • • • • 80C51 Core Architecture 256 Bytes of On-chip RAM 256 Bytes of On-chip XRAM 16K Bytes of On-chip Flash Memory – Data Retention: 10 Years at 85°C

T89C51CC02

Abstract: 89c51cc02ua AT89C51CC02UA ccf um 80C51 AT89C51CC02 PLCC28 SOIC24 SOIC28 VQFP32
Contextual Info: Features • • • • • • • • • • • • • • • • • • • • • • • • • • • 80C51 Core Architecture 256 Bytes of On-chip RAM 256 Bytes of On-chip XRAM 16K Bytes of On-chip Flash Memory – Data Retention: 10 Years at 85°C

89c51cc02ua

Abstract: T89C51CC02
Contextual Info: Features • • • • • • • • • • • • • • • • • • • • • • • • • • • 80C51 Core Architecture 256 Bytes of On-chip RAM 256 Bytes of On-chip XRAM 16K Bytes of On-chip Flash Memory – Data Retention: 10 Years at 85°C

T89C51CC02

Contextual Info: Features • • • • • • • • • • • • • • • • • • • • • • • • • 1. 80C51 Core Architecture 256 Bytes of On-chip RAM 256 Bytes of On-chip ERAM 16K Bytes of On-chip Flash Memory – Data Retention: 10 Years at 85°C

Contextual Info: Features • • • • • • • • • • • • • • • • • • • 80C51 Core Architecture 256 Bytes of On-chip RAM 256 Bytes of On-chip XRAM 16K Bytes of On-chip Flash Memory – Data Retention: 10 Years at 85°C – Erase/Write Cycle: 100K

AT89C5115 MICROCONTROLLER

Abstract: 80C51 AT89C5115 PLCC28 SOIC24 SOIC28 T89C5115 VQFP32
Contextual Info: Features • • • • • • • • • • • • • • • • • • • 80C51 Core Architecture 256 Bytes of On-chip RAM 256 Bytes of On-chip XRAM 16K Bytes of On-chip Flash Memory – Data Retention: 10 Years at 85°C – Erase/Write Cycle: 100K

T89C51CC02

Contextual Info: Features • • • • • • • • • • • • • • • • • • • • • • • • • 80C51 Core Architecture 256 Bytes of On-chip RAM 256 Bytes of On-chip ERAM 16K Bytes of On-chip Flash Memory – Data Retention: 10 Years at 85°C

80C51

Abstract: PLCC28 SO24 SOIC24 SOIC28 T89C51CC02 VQFP32 bipolar ROM 89C51CC02
Contextual Info: Features • • • • • • • • • • • • • • • • • • • • • • • • 80C51 Core Architecture 256 Bytes of On-chip RAM 256 Bytes of On-chip XRAM 16K Bytes of On-chip Flash Memory – Data Retention: 10 Years at 85°C – Erase/Write Cycle: 100K

80C51

Abstract: PLCC28 SO24 SOIC24 SOIC28 T89C51CC02 VQFP32 QFP32 Package
Contextual Info: Features • • • • • • • • • • • • • • • • • • • • • • • • 80C51 Core Architecture 256 Bytes of On-chip RAM 256 Bytes of On-chip XRAM 16K Bytes of On-chip Flash Memory – Data Retention: 10 Years at 85°C – Erase/Write Cycle: 100K