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    TSOP 48 LAYOUT Search Results

    TSOP 48 LAYOUT Datasheets Context Search

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    48-PIN

    Abstract: LRS1338A 1338a2
    Text: LRS1338A Data Sheet Stacked Chip 8M Flash Memory and 2M SRAM FEATURES PIN CONFIGURATION • Flash memory and SRAM • Stacked die chip scale package • 48-pin TSOP TSOP48-P-1014 plastic package 48-PIN TSOP TOP VIEW S-A16/F-A15 1 48 S-A17/F-A16 S-A15/F-A14


    Original     		PDF LRS1338A 48-pin TSOP48-P-1014) S-A16/F-A15 S-A17/F-A16 S-A15/F-A14 I/O15 S-A14/F-A13 S-A13/F-A12 LRS1338A 1338a2

    TSOP 48 LAYOUT

    Abstract: TSOP 28 SPI memory Package tsop 38 atmel 134
    Text: DataFlash TSOP Migration Path This application note describes how one can design a single PCBA to accommodate the full range of DataFlash products offered in the TSOP package. A board can be laid out for a larger TSOP e.g., 48-lead TSOP and smaller TSOP packages can be


    Original     		PDF 48-lead 28-lead 32-lead, 40-lead 3316E TSOP 48 LAYOUT TSOP 28 SPI memory Package tsop 38 atmel 134

    SpecTek flash

    Abstract: 64GB Nand flash spectek nand Micron ONFI 2.2 64gb NAND chip spectek nand flash BA12 CA12 L52A ONFI nand flash
    Text: 16Gb, 32Gb, 64Gb NAND Flash Memory Features NAND Flash Memory FxxL52A16K3WG, FxxL52A32K3WG, FxxL52A64K3WG Features Figure 1: 48-Pin TSOP Type 1 • Open NAND Flash Interface ONFI 1.0 compliant • Multilevel cell (MLC) technology • Organization – Page size: x8: 4,314 bytes (4,096 + 218 bytes)


    Original     		PDF FxxL52A16K3WG, FxxL52A32K3WG, FxxL52A64K3WG 48-Pin 12-bit 09005aef82f114cf/Source: 09005aef82f11fd1 SpecTek flash 64GB Nand flash spectek nand Micron ONFI 2.2 64gb NAND chip spectek nand flash BA12 CA12 L52A ONFI nand flash

    64GB Nand flash

    Abstract: SpecTek flash spectek 64gb micron nand flash chip 64gb spectek nand SpecTek 64Gb flash 64GB Nand flash MLC memory Micron NAND flash 32gb nand ONFI 3.0 64gb NAND chip
    Text: 16Gb, 32Gb, 64Gb NAND Flash Memory Features NAND Flash Memory FxxL52A 8Gb, 16Gb, 32Gb, 64Gb 1.8V, 3.3V Features Figure 1: 48-Pin TSOP Type 1 • Open NAND Flash Interface ONFI 1.0 compliant • Multilevel cell (MLC) technology • Organization – Page size: x8: 4,314 bytes (4,096 + 218 bytes)


    Original     		PDF FxxL52A 48-Pin 12-bit 09005aef82f114cf/Source: 09005aef82f11fd1 64GB Nand flash SpecTek flash spectek 64gb micron nand flash chip 64gb spectek nand SpecTek 64Gb flash 64GB Nand flash MLC memory Micron NAND flash 32gb nand ONFI 3.0 64gb NAND chip

    56-Lead TSOP Package

    Abstract: TSOP 56 LAYOUT ORCAD PCB LAYOUT BOOK svs 357 28F008SA 28F016SA DD28F032SA PCB Layout surge PCB layout TSOP 54 Package used in where
    Text: AP-607 APPLICATION NOTE Multi-Site Layout Planning with Intel’s FlashFileTM Components Including ROM Compatibility BILAL QURESHI APPLICATIONS ENGINEER SALIM B FEDEL SENIOR APPLICATIONS ENGINEER December 1995 Order Number 292159-002 Information in this document is provided in connection with Intel products Intel assumes no liability whatsoever including infringement of any patent or copyright for sale and use of Intel products except as provided in


    Original     		PDF AP-607 56-Lead 16-Mbit 44-Lead 28F016SA 56-Lead TSOP Package TSOP 56 LAYOUT ORCAD PCB LAYOUT BOOK svs 357 28F008SA DD28F032SA PCB Layout surge PCB layout TSOP 54 Package used in where

    Meritec 980020-56

    Abstract: IC179-44600-500 IC197-4807-2000 980020-48 IC197-5606-2000 980020 IC191-0482-004 Enplas OTS 648-0482211 wells 648-0482211
    Text: The Complete Socket Solution 3 PCB land-pad layout similar close to that of device PRODUCTION PROTOTYPING AND TEST SOCKETS TO HELP YOU DESIGN IN INTEL FLASH MEMORY Socket vendors are actively working on solutions for Small Outline Packages This work includes robust


    Original     		PDF IC191-0402-002N IC191-0402-002 OTS-40-0 IC191-0482-004N IC191-0482-004 648-0482211-A31 IC191-0562-003N IC191-0562-003 CSP044-052 IC51-0442-1536 Meritec 980020-56 IC179-44600-500 IC197-4807-2000 980020-48 IC197-5606-2000 980020 IC191-0482-004 Enplas OTS 648-0482211 wells 648-0482211

    28F640J5a

    Abstract: iMC016FLSG 28F160B3 IMC016FLSC 9021b iMC008FLSC flash memory 5v 16m SmartDie 28F016B3 28F160F3
    Text: Flash Memory Quick Reference Guide ion 4 Vers ’98 June Flash Memory Components for New Designs New designs should be based on Intel’s “components for new designs” shown in bold text in this guide. For information on our full product line, including extended temperature products, contact your Intel Sales representative/distributor or refer to our linecard available on Intel’s Web site.


    Original     		PDF 28F320C3a 28F032C3a 28F320LSA USA/698/10K/MS 28F640J5a iMC016FLSG 28F160B3 IMC016FLSC 9021b iMC008FLSC flash memory 5v 16m SmartDie 28F016B3 28F160F3

    TSOP 54 socket

    Abstract: IC189 TSSOP YAMAICHI SOCKET IC189-0562 TSOP 48 socket IC189-0482 IC189-0482 TSOP 54 socket TSOP 62 Package IC189-0482-094 tsop 1230
    Text: Part Number Details Specifications 1,000M Ω min. at 100V DC, pitch 0.5 1,000M Ω min. at 500V DC, pitch 0.65, 0.8, 1.27 Insulation Resistance: IC189 - 042 2 - 025 * - * Series No. Dielec. Withstd. Voltage: for 1 minute at 100 V AC, pitch 0.5 for 1 minute at 500 V AC, pitch 0.65


    Original     		PDF IC189 10mA/20mV IC189-0562-067 IC189-0562-078 IC189-0622-084 TSOP 54 socket TSSOP YAMAICHI SOCKET IC189-0562 TSOP 48 socket IC189-0482 IC189-0482 TSOP 54 socket TSOP 62 Package IC189-0482-094 tsop 1230

    TSSOP YAMAICHI SOCKET

    Abstract: IC189-0482-077 IC189-0482-094 IC189 Series Open Top SOP, SSOP, TSOP Type I a IC189-0482-066 IC189 IC189-0422-025 from TSOP Type II ssop40 IC189-0482
    Text: IC189 Series Open Top Part Number (Details) Specifications Insulation Resistance: 1,000M Ω min. at 100V DC, pitch 0.5 1,000M Ω min. at 500V DC, pitch 0.65, 0.8, 1.27 IC189on - 040 2 - 068 * - * i Series No. Dielec. Withstd. Voltage: for 1 minute at 100 V AC, pitch 0.5


    Original     		PDF IC189 10mA/20mV IC189-0482-066 IC189-0482-066-2 IC189-0482-047 IC189-0482-077 65x23 TSSOP YAMAICHI SOCKET IC189-0482-077 IC189-0482-094 IC189 Series Open Top SOP, SSOP, TSOP Type I a IC189-0482-066 IC189-0422-025 from TSOP Type II ssop40 IC189-0482

    IC51-0242-1006-1

    Abstract: TSOP 44 socket IC51-0482-2018 TSOP 48 socket ic 4008 0262 IC51-0322-1207-1 IC51-0282-1032-1 IC51-0322-1031-1 IC51-0322-1219
    Text: IC51 - Clamshell Thin Small Outline Package TSOP Type I and II Part Number (Details) Specifications 1,000M Ω min. at 500V DC Insulation Resistance: Dielectric Withstanding Voltage: 700V AC for 1 minute 30m Ω max. at 10mA/20mV max. Contact Resistance:


    Original     		PDF 10mA/20mV 27x12 IC51-0262-1339 IC51-0442-1709 IC51-0502-1708 IC51-0242-1006-1 TSOP 44 socket IC51-0482-2018 TSOP 48 socket ic 4008 0262 IC51-0322-1207-1 IC51-0282-1032-1 IC51-0322-1031-1 IC51-0322-1219

    amd 15h power

    Abstract: TSOP-48 pcb LAYOUT TSOP 48 LAYOUT AM29LV640 TSOP-48 FOOTPRINT
    Text: Implementing a Common Layout for AMD MirrorBit and Intel StrataFlash™ Memory Devices Application Note -XO\  7KH IROORZLQJ GRFXPHQW UHIHUV WR 6SDQVLRQ PHPRU\ SURGXFWV WKDW DUH QRZ RIIHUHG E\ ERWK $GYDQFHG 0LFUR 'HYLFHV DQG XMLWVX $OWKRXJK WKH GRFXPHQW LV PDUNHG ZLWK WKH QDPH RI WKH FRPSDQ\ WKDW RULJ


    Original     		PDF

    IC51-0482-2018

    Abstract: MAX 232 IC PIN DETAILS IC51-0322-1031-1 IC51 socket IC51-0282-1032-1 IC51-0322-1207-1 IC51-0242-1006-1 IC51-0322-1219 IC51-0322-883-1 IC51-0402-1174-1
    Text: IC51 - Clamshell Thin Small Outline Package TSOP Type I Part Number (Details) Specifications Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Operating Temperature Range: Mating Cycles: 1,000MΩ min. at 500V DC 700V AC for 1 minute


    Original     		PDF 10mA/20mV IC51-0402-1174-1 IC51-0482-2018 IC51-0482-2018 MAX 232 IC PIN DETAILS IC51-0322-1031-1 IC51 socket IC51-0282-1032-1 IC51-0322-1207-1 IC51-0242-1006-1 IC51-0322-1219 IC51-0322-883-1 IC51-0402-1174-1

    amd 15h power

    Abstract: AM29LV640
    Text: Implementing a Common Layout for AMD MirrorBitTM and Intel StrataFlashTM Memory Devices Application Note Overview This document describes the benefits of designing with AMD MirrorBit Flash memory and the ease with which system designers can layout a board to accommodate high-density flash devices from both AMD and


    Original     		PDF 32Mb-128Mb 64Megabit amd 15h power AM29LV640

    land pattern for SSOP

    Abstract: TSOP 86 land pattern land pattern for SOP land pattern for TSOP TSOP 48 Pattern land pattern PQFP 208 land pattern for TSOP 2 86 tip 3035 land pattern PQFP 132 land pattern PQFP 100
    Text: Land Pattern Recommendations The following land pattern recommendations are provided as guidelines for board layout and assembly purposes. These recommendations cover the following National Semiconductor packages: PLCC, PQFP, SOP, SSOP and TSOP. For SOT-23 5-Lead and TO-263 (3- or 5-Lead) packages, refer to land patterns shown in the Physical Dimensions for


    Original     		PDF OT-23 O-263 MA05A MS011811-1 land pattern for SSOP TSOP 86 land pattern land pattern for SOP land pattern for TSOP TSOP 48 Pattern land pattern PQFP 208 land pattern for TSOP 2 86 tip 3035 land pattern PQFP 132 land pattern PQFP 100

    sample code read and write flash memory spansion

    Abstract: AMD29LV SPANSION date code format spansion S29GL064 sample code write buffer spansion intel MLC flash Intel 56 TSOP PL32LM amd 15h power S29GL
    Text: Implementing a Common Layout for Spansion MirrorBitTM and Intel StrataFlashTM Memory Devices Application Note Overview This document describes the benefits of designing with Spansion MirrorBit Flash memory and the ease with which system designers can layout a board to accommodate high-density flash devices from both


    Original     		PDF S29GL 32Mb-256Mb sample code read and write flash memory spansion AMD29LV SPANSION date code format spansion S29GL064 sample code write buffer spansion intel MLC flash Intel 56 TSOP PL32LM amd 15h power

    diode A14A

    Abstract: BIOS 32 Pin PLCC 845 bios chip PLCC 32 intel package dimensions amd 29f040 thermal resistance INTEL FLASH MEMORY DATA SHEET transistor ap 431 tsop 28-LEAD Footprints picture in picture chip psop 1
    Text: E AP-623 APPLICATION NOTE Multi-Site Layout Planning with Intel's Boot Block Flash Memory CHARLES ANYIMI SENIOR TECHNICAL MARKETING ENGINEER December 1995 Order Number: 292178-002 Information in this document is provided solely to enable use of Intel products. Intel assumes no liability whatsoever, including


    Original     		PDF AP-623 AP-607, AB-57, AB-60, diode A14A BIOS 32 Pin PLCC 845 bios chip PLCC 32 intel package dimensions amd 29f040 thermal resistance INTEL FLASH MEMORY DATA SHEET transistor ap 431 tsop 28-LEAD Footprints picture in picture chip psop 1

    tsop 0038

    Abstract: TSOP 48 LAYOUT TSOP 56 LAYOUT 0038 tsop TSOP 56 Package C7025
    Text: TSOP: THIN SMALL OUTLINE PACKAGE DRAWING A2 Z e SEE DETAIL B E Y A1 D1 D SEATING PLANE SEE DETAIL A A DETAIL A DETAIL B c b φ L Thin Small Outline Package TSOP Packaging Family Attributes Category Acronym Lead Configuration Lead Counts Lead Finish Lead Pitch


    Original     		PDF 56-Lead 48-Lead C7025 40-lead, 40lead 32-lead tsop 0038 TSOP 48 LAYOUT TSOP 56 LAYOUT 0038 tsop TSOP 56 Package

    AMD AM28F010 ca

    Abstract: AM29 flash 48-pin TSOP package tray tsop 48 PIN SOCKET pin identification AMD 2m flash memory Meritec Am29LV033B AM29F010 Am29F002N AM29F002
    Text: Flash Memory Quick Reference Guide Summer ’98 Package Migration Low-Voltage Am29LV004 Am29LV008B Am29LV081 Am29LV116B Am29LV017B 2 Mb 4 Mb 8 Mb 16 Mb Am29LV010B Am29LV001B Am29LV020B Am29LV102B Am29LV040B Am29LV104B 1 Mb 2 Mb 4 Mb Am29LV200 Am29DL400B Am29LV400


    Original     		PDF Am29LV004 Am29LV008B Am29LV081 Am29LV116B Am29LV017B Am29LV010B Am29LV001B Am29LV020B Am29LV102B Am29LV040B AMD AM28F010 ca AM29 flash 48-pin TSOP package tray tsop 48 PIN SOCKET pin identification AMD 2m flash memory Meritec Am29LV033B AM29F010 Am29F002N AM29F002

    PLCC 32 intel package dimensions

    Abstract: 845 bios chip intel 845 circuit diagram all chip TSOP 48 thermal resistance TSOP 48 LAYOUT ap623 am 28f040 AP-623 PCB Layout tsop 48 PIN SOCKET
    Text: E AP-623 APPLICATION NOTE Multi-Site Layout Planning with Intel’s Boot Block Flash Memory December 1996 Order Number: 292178-003 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of


    Original     		PDF AP-623 AP-607 AB-57 AB-60 PLCC 32 intel package dimensions 845 bios chip intel 845 circuit diagram all chip TSOP 48 thermal resistance TSOP 48 LAYOUT ap623 am 28f040 AP-623 PCB Layout tsop 48 PIN SOCKET

    toshiba toggle mode nand

    Abstract: TC518128 TC518129 TC551001 equivalent 551664 TC518512 sgs-thomson power supply Toggle DDR NAND flash jeida 38 norm APPLE A5 CHIP
    Text: DRAM Technology n TOSHIBA DRAM TECHNOLOGY Toshiba DRAM Technology 2 DRAM Technology n DRAM TECHNOLOGY TRENDS Density Design Rule 64M→128M →256M →512M →1G 0.35µm →0.25 µm →0.20 µm →0.175 µm Cost Down, Yield Improvement High Bandwidth Multi - bit


    Original     		PDF 64M128M 66MHz 100MHz 200MHz) 500/600MHz 800MHz 400MHz 800MHz) X16/X18X32 PhotoPC550 toshiba toggle mode nand TC518128 TC518129 TC551001 equivalent 551664 TC518512 sgs-thomson power supply Toggle DDR NAND flash jeida 38 norm APPLE A5 CHIP

    IC191-0562-003

    Abstract: IC191-0482-004 ic191-0482-004 pin details IC191 TSOP 56 socket IC191-0402-002 TSOP 56 Package TSOP 48 socket
    Text: IC191 Series Open Top Thin Small Outline Package (TSOP - Type I) Part Number (Details) Specifications 1,000M Ω min. at 500V DC Insulation Resistance: Dielectric Withstanding Voltage: 700V AC for 1 minute 30m Ω max. at 10mA/20mV max. Contact Resistance:


    Original     		PDF IC191 10mA/20mV IC191-0402-002 IC191-0562-003 IC191-0482-004 IC191-0562-003 IC191-0482-004 ic191-0482-004 pin details TSOP 56 socket IC191-0402-002 TSOP 56 Package TSOP 48 socket

    IC191-0482-004

    Abstract: IC191-0322-001 TSOP 48 socket ic191-0482-004 pin details IC191 IC191-0402-002
    Text: IC191 - Open Top Type I ng Thin Small Outline Package (TSOP) Specifications Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Current Rating: Operating Temperature Range: Mating Cycles: Contact Force: 1,000M Ω min. at 500V DC


    Original     		PDF IC191 10mA/20mV IC191-0322-001 IC191-0482-004 IC191-0402-002 IC191-0482-004 IC191-0322-001 TSOP 48 socket ic191-0482-004 pin details IC191-0402-002

    land pattern for TSOP 2-44

    Abstract: Wells programming adapter TSOP 48 intel 44-lead psop land pattern for TSOP 56 pin F9232 E28F016SA70 tsop tray matrix outline wells 648-0482211 memory card thickness 29f200 tsop adapter
    Text: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: sop / f soic z:;: IC 189 Series Characteristics Insulation Resistance: 1,OOOMQminimum at 500 VDC Withstanding Voltage: 700 VAC for 1 Minute Contact Resistance: 30mQ max. at 10mA/20mV (Initial) Operating Temperature: -40‘ C ~ +150'C Material Insulator:


    OCR Scan     		PDF 10mA/20mV IC189-0482-077 IC189-0482-094 IC189-0482-047 IC189-0542-088 IC189-0562-067 IC189-0542-093 IC189-0562-078 IC189-0622-084 IC189-0642-028