Untitled
Abstract: No abstract text available
Text: THIN SMALL OUTLINE L-LEADED PACKAGE 50 PIN PLASTIC FPT-50P-M06 50-pin plastic TSOP II Lead pitch 0.80mm Package width 400mil Lead shape Gullwing Sealing method Plastic mold (FPT-50P-M06) * : Resin protrusion. (Each side : 0.15 (.006) Max) 50-pin plastic TSOP (II)
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FPT-50P-M06
400mil
50-pin
FPT-50P-M06)
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400MIL
Abstract: No abstract text available
Text: THIN SMALL OUTLINE L-LEADED PACKAGE 50 PIN PLASTIC FPT-50P-M05 50-pin plastic TSOP II Lead pitch 0.80mm Package width 400mil Lead shape Gullwing Sealing method Plastic mold (FPT-50P-M05) * : Resin protrusion. (Each side : 0.15 (.006) Max) 50-pin plastic TSOP (II)
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FPT-50P-M05
400mil
50-pin
FPT-50P-M05)
F50005S-2C-1
400MIL
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50-PIN
Abstract: No abstract text available
Text: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 50 PIN PLASTIC FPT-50P-M06 50-pin plastic TSOP II Lead pitch 0.80 mm Package width 400 mil Lead shape Gullwing Sealing method Plastic mold (FPT-50P-M06) 50-pin plastic TSOP (II) (FPT-50P-M06)
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FPT-50P-M06
50-pin
FPT-50P-M06)
F50006S-2C-1
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Untitled
Abstract: No abstract text available
Text: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 50 PIN PLASTIC FPT-50P-M05 50-pin plastic TSOP II Lead pitch 0.80 mm Package width 400 mil Lead shape Gullwing Sealing method Plastic mold (FPT-50P-M05) 50-pin plastic TSOP (II) (FPT-50P-M05)
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FPT-50P-M05
50-pin
FPT-50P-M05)
F50005S-2C-1
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TSOP package tray
Abstract: JEDEC TRAY DIMENSIONS 10936 TSOP TRAY
Text: HEAT PROOF 7 A' 12 13.67 135°C MAX. PPE 135.9 13.27 A NEC TSOP 2 400MIL21 9x13=117 109.36 UNIT : mm 21.1 22.96 19.74 275.52 315.0 (322.6) SECTION A – A' 21.1 5.62 (6.35) 7.62 18.0 Applied Package Quantity (pcs) 32-pin Plastic TSOP(II)(400mil) 50-pin Plastic TSOP(II)(400mil)
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400MIL21
32-pin
400mil)
50-pin
400MIL21
TSOP package tray
JEDEC TRAY DIMENSIONS
10936
TSOP TRAY
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Untitled
Abstract: No abstract text available
Text: Packing JEDEC Tray Name TSOP 2 400MIL21 Mounting Pad 50 pin TSOP (II) (400 mil) 26 50 F P E detail of lead end 1 25 A D M M C B L G K N I J H NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.
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400MIL21
S50G5-80-7KF2
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Untitled
Abstract: No abstract text available
Text: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL21 50 pin TSOP (II) (400 mil) 50 26 E P F detail of lead end 1 25 A H J K G I N B C D M L M NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.
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400MIL21
005Each
S50G5-80-7JF1
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Untitled
Abstract: No abstract text available
Text: Packing JEDEC Tray Name TSOP 2 400MIL21 Mounting Pad 50 pin TSOP (II) (400 mil) 50 26 F E P detail of lead end 1 25 A D M M C B L G K N I J H NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.
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400MIL21
00Each
S50G5-80-7KF1
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Untitled
Abstract: No abstract text available
Text: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL21 50 pin TSOP (II) (400 mil) 50 26 E P F detail of lead end 1 25 A H J K G I N B C D M L M NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.
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400MIL21
S50G5-80-7JF2
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Untitled
Abstract: No abstract text available
Text: TSOP Series Ultra Precision Molded Resistor Networks HOW TO ORDER TSOP 08 A 1003 B C TCR PPM/°°C R = +5 S = +10 E = +25 C = +50 Resistance Tolerance A = +0.05% B = +0.10% C = +0.25% Resistance Value 3 sig. fig & 1 multiplier +1% FEATURES TSOP High Precision NiCr Thin Film Resistor
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Untitled
Abstract: No abstract text available
Text: Packing JEDEC Tray Name TSOP 2 400MIL21 Mounting Pad 50 pin TSOP (II) (400 mil) 50 26 E 5°±5° F detail of lead end 1 25 A H J K G I N D L B C M M S50G5-80-7JF-1 NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at
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400MIL21
S50G5-80-7JF-1
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Untitled
Abstract: No abstract text available
Text: Packing JEDEC Tray Name TSOP 2 400MIL21 Mounting Pad 50 pin TSOP (II) (400 mil) 50 26 F E 5°±5° detail of lead end 1 25 A D M M C B L G K N I J H S50G5-80-7KF-1 NOTE Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at
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400MIL21
S50G5-80-7KF-1
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U 821 B
Abstract: No abstract text available
Text: Packing JEDEC Tray Name TSOP 2 400MIL21 50 pin TSOP (II) (400 mil) 50 26 detail of lead end U Q L R T 1 25 A∗3 D M S M K C N G S B S I J H NOTE 1. Controlling dimension millimeter. 2. Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.
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400MIL21
006inch)
002otrusions
048MAX.
S50G5-80-9PF
U 821 B
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Untitled
Abstract: No abstract text available
Text: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL21 50 pin TSOP (II) (400 mil) 50 26 detail of lead end F P E 1 25 A H I S G C D N M J L S K B M NOTE 1. Controlling dimension millimeter. 2. Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.
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400MIL21
S50G5-80-7JF4-1
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Untitled
Abstract: No abstract text available
Text: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL21 50 pin TSOP (II) (400 mil) 50 26 detail of lead end F E 1 P 25 A M D M K N C S G B L S I J H NOTE 1. Controlling dimension millimeter. 2. Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.
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400MIL21
S50G5-80-7KF3-1
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Untitled
Abstract: No abstract text available
Text: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL21 50 pin TSOP (II) (400 mil) 50 26 detail of lead end F E P 1 25 A M D M K C N S G B L S I J H NOTE 1. Controlling dimension millimeter. 2. Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.
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400MIL21
S50G5-80-7KF4-1
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Untitled
Abstract: No abstract text available
Text: Mounting Pad Packing JEDEC Tray Name TSOP 2 400MIL21 50 pin TSOP (II) (400 mil) 50 26 detail of lead end F P E 1 25 A H J I G N C S B L S K D M M NOTE 1. Controlling dimension millimeter. 2. Each lead centerline is located within 0.13 mm (0.005 inch) of its true position (T.P.) at maximum material condition.
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400MIL21
S50G5-80-7JF3-1
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TSOP package tray
Abstract: 50-pin TRAY TSOP JEDEC TRAY DIMENSIONS DSAE00696 913117
Text: 7 PPE NEC 135°C MAX. A A' 20.65 22.96 19.74 11.8 109.36 13.67 13.27 TSOP 2 400MIL21 135.9 9x13=117 HEAT PROOF UNIT : mm 275.52 315.0 (322.6) SECTION A – A' 20.65 5.62 7.62 (6.35) 17 Applied Package Quantity (pcs) 50-pin Plastic TSOP(II)(400mil) MAX. 117
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400MIL21
50-pin
400mil)
TSOP package tray
TRAY TSOP
JEDEC TRAY DIMENSIONS
DSAE00696
913117
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TSOP-16
Abstract: tsop series A-1003B
Text: TSOP Series Ultra Precision Molded Resistor Networks The content of this specification may change without notification 1/01/06 Custom solutions are available. HOW TO ORDER TSOP 08 A 1003 B C TCR PPM/°C R = +5 S = +10 E = +25 C = +50 Resistance Tolerance
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BA5 marking
Abstract: DQ112-127 BA7 marking HMD4M144D9WG DQ113 BA6 marking BA6137 DQ99
Text: HANBit HMD4M144D9WG 64Mbyte 4Mx144 200-pin ECC Mode 4K Ref. DIMM Design 5V Part No. HMD4M144D9WG GENERAL DESCRIPTION The HMD4M144D9WG is a 4Mbit x 144bit dynamic RAM high-density memory module. The module consists of eight CMOS 4Mx16bit DRAMs in 50-pin TSOP packages and one CMOS 4M x 16bit DRAM in 50pin TSOP package
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HMD4M144D9WG
64Mbyte
4Mx144)
200-pin
HMD4M144D9WG
144bit
4Mx16bit
50-pin
16bit
BA5 marking
DQ112-127
BA7 marking
DQ113
BA6 marking
BA6137
DQ99
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Untitled
Abstract: No abstract text available
Text: Gold Termination TSOP Series Ultra Precision Molded Resistor Networks HOW TO ORDER TSOP G 08 A 1003 B C TCR PPM/°°C R = +5 S = +10 E = +25 C = +50 Resistance Tolerance A = +0.05% B = +0.10% C = +0.25% Resistance Value 3 sig. fig & 1 multiplier +1% FEATURES
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Untitled
Abstract: No abstract text available
Text: PRELIMINARY MICRON I TECHNOLOGY, 1 6 M l n b XAM INC. FEATURES 50-Pin TSOP V cc DQ0 DQ1 V ssQ DQ2 DQ3 V ccQ DQ4 DQ5 V ssQ DQ6 DQ7 V ccQ DQ M L W E# C AS# RAS# C S# BA A10 A0 A1 A2 A3 V cc MARKING 1M16 • Plastic Package - OCPL 50-pin TSOP 400 mil TG • Timing
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OCR Scan
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PDF
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50-Pin
MT48LC1M16A1TG-8A
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Untitled
Abstract: No abstract text available
Text: PRELIMINARY MICRON 4 MEG x 16 EDO DRAM I MT4LC4M16R6 DRAM FEATURES PIN ASSIGNMENT Top View OPTIONS 50-Pin TSOP (DB-7) Vcc DQ1 DQ2 DQ3 DQ4 Vcc DQ5 DQ6 DQ7 DQ8 NC Vcc WE# RAS# NC NC NC NC A0 A1 A2 A3 A4 A5 Vcc MARKING • Package Plastic TSOP (400 mil) TG
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MT4LC4M16R6
50-Pin
MT4LC4M16R6TG-5
104ns
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ECO6
Abstract: No abstract text available
Text: HYUNDAI HYM572A220 X-Series 2M x 72-bit CMOS DRAM MODULE DESCRIPTION The HYM572A220 is a 1M x 72-bit Fast page mode CMOS DRAM module consisting of four HY514400A in 20/26 pin SOJ or TSOP-II, eight HY5118160 42/42 pin SOJ or 44/50 pin TSOP-II and two 16-bit BiCMOS line driver in
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HYM572A220
72-bit
HY514400A
HY5118160
16-bit
HYM572A220TXG/LTXG
DQ0-DQ71)
1EC06-10-APR95
ECO6
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