TSOP 54 PACKAGE Search Results

54-pin

Abstract: TSOP 54 Package TSOP 54 II
Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 54 PIN PLASTIC FPT-54P-M01 54-pin plastic TSOP II Lead pitch 0.80 mm Package width 500 mil Lead shape Gullwing Sealing method Plastic mold (FPT-54-M01) 54-pin plastic TSOP (II) (FPT-54P-M01)

TSOP 86 Package

Abstract: A11E 128MB PC266 TSOP 54 Package 4mx32 TSOP 400 86 TSOP 54 PIN tsop 66 TSOP 66 Package ddr 240 pin
Contextual Info: 1999 DRAM Design Guidelines Options Package Width Data Rate Voltage I/O 16Mb 64Mb 128Mb 256Mb Clock MHz 1 54 TSOP x4 SDR 3.3V LVTTL na 16Mx4 32Mx4 64Mx4 PC100/133 2 54 TSOP x8 SDR 3.3V LVTTL na 8Mx8 16Mx8 32Mx8 PC100/133 3 54 TSOP x16 SDR 3.3V LVTTL na 4Mx16 8Mx16 16Mx16

TSOP 54 Package

Abstract: TSOP 54 PIN 54-PIN TSOP II 54 Package
Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE 54 PIN PLASTIC FPT-54P-M01 54-pin plastic TSOP II Lead pitch 0.80mm Package width 500mil Lead shape Gullwing Sealing method Plastic mold (FPT-54P-M01) * : Resin protrusion. (Each side : 0.15 (.006) Max) 54-pin plastic TSOP (II)

54-PIN

Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 54 PIN PLASTIC FPT-54P-M02 54-pin plastic TSOP II Lead pitch 0.80 mm Package width 400 mil Lead shape Gullwing Sealing method Plastic mold (FPT-54P-M02) 54-pin plastic TSOP (II) (FPT-54P-M02)

MT48LC16M8A2BB

Contextual Info: 128Mb: x4, x8, x16 SDRAM Features SDR SDRAM MT48LC32M4A2 – 8 Meg x 4 x 4 Banks MT48LC16M8A2 – 4 Meg x 8 x 4 Banks MT48LC8M16A2 – 2 Meg x 16 x 4 Banks Features Options • Plastic package – OCPL2 – 54-pin TSOP II 400 mil – 54-pin TSOP II (400 mil) Pb-free

MT48LC16M8A2BB

Contextual Info: 128Mb: x4, x8, x16 SDRAM Features SDR SDRAM MT48LC32M4A2 – 8 Meg x 4 x 4 Banks MT48LC16M8A2 – 4 Meg x 8 x 4 Banks MT48LC8M16A2 – 2 Meg x 16 x 4 Banks Features Options • Plastic package – OCPL2 – 54-pin TSOP II 400 mil – 54-pin TSOP II (400 mil) Pb-free

TSOP 54 Package

Abstract: TSOP 54 Package used in where TSOP 54 PIN TSOP II 54 Package TSOP 54 II 54-PIN
Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 54 PIN PLASTIC To Top / Package Lineup / Package Index FPT-54P-M01 54-pin plastic TSOP II Lead pitch 0.80 mm Package width 500 mil Lead shape Gullwing Sealing method Plastic mold (FPT-54-M01)

TSOP II 54

Abstract: TSOP II 54 Package 54PIN 54P3G-C
Contextual Info: 54P3G-C Plastic 54pin 400mil TSOP II (LOC) EIAJ Package Code TSOP II 54-P-400-0.80 Weight(g) JEDEC Code – Lead Material Alloy 42 e b2 F 54 E Recommended Mount Pad Symbol 1 A 27 D e L c L1 HE ME l2 28 y b A2 Detail F A A1 A2 b c D E e HE L L1 y A1 ME I2

TSOP 54 Package

Abstract: TSOP 54 Package used in where 54-PIN TSOP 54 PIN
Contextual Info: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 54 PIN PLASTIC To Top / Package Lineup / Package Index FPT-54P-M02 54-pin plastic TSOP II Lead pitch 0.80 mm Package width 400 mil Lead shape Gullwing Sealing method Plastic mold (FPT-54P-M02)

TSOP 86 Package

Abstract: TSOP 54 tray TSOP package tray TSOP 54 Package TSOP 54 PIN TSOP 66 Package JEDEC tray standard tsop TSOP II 54 Package tsop 66 tsop package
Contextual Info: TRAY CONTAINER UNIT : mm HEAT PROOF PRE 7 112.0 NEC 135° MAX. A' 11.8 14.00 12.00 TSOP 2 400MIL22 135.9 9¥12=108 A 24.70 21.70 21.8 271.7 315.0 (322.6) SECTION A – A' 5.62 7.62 (6.35) 21.80 16.50 Applied Package Quantity (pcs) Material 54-pin • Plastic TSOP(II)

TSOP 86 Package

Abstract: TSOP 54 tray TSOP 54 Package TSOP 66 Package TSOP II 54 Package TSOP 62 Package JEDEC tray standard tsop TSOP package tray
Contextual Info: UNIT : mm HEAT PROOF PRE 7 112.0 NEC 135° MAX. 14.00 12.00 TSOP 2 400MIL22 135.9 9x12=108 A A' 11.8 24.70 21.70 21.8 271.7 315.0 (322.6) SECTION A – A' 5.62 (6.35) 7.62 21.8 16.5 Applied Package Quantity (pcs) Material 54-pin • Plastic TSOP(II)(400mil)

54-P-400-0

Contextual Info: TSOP 2 54-P-400-0.80-K Mirror finish Package material Lead frame material Pin treatment Package weight (g) Rev. No./Last Revised Epoxy resin 42 alloy Solder plating( 5 m) 0.55 TYP. 2/Aug.14,1997

Contextual Info: TSOP 2 54-P-400-0.80-K Mirror finish 5 Package material Lead frame material Pin treatment Package weight (g) Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.55 TYP. 1/Aug. 14, 1997

TSOP 54 Package

Contextual Info: EDS1216AGTA Package Drawing 54-pin Plastic TSOP ll Unit: mm 22.22 ± 0.10 A 10.16 28 PIN#1 ID 1 11.76 ± 0.20 54 27 B 0.80 0.25 to 0.45 0.16 M S A B 0.80 Nom 0.91 max. 0.25 0.10 +0.08 −0.05 0.10 S 0.09 to 0.21 S 1.2 max. 1.0 ± 0.05 0 to 8° 0.40 to 0.75

70-pin

Contextual Info: 70P3S-M Plastic 70pin 400mil TSOP EIAJ Package Code TSOP II 70/68-P-400-0.65 Weight(g) JEDEC Code – Lead Material Alloy 42 e b2 1 17 35 Recommended Mount Pad E Symbol 54 70 52 36 A c L D L1 HE ME 19 I2 F e y b A2 Detail F A1 A A1 A2 b c D E e HE L L1

TSOP II 54

Abstract: TSOP 54 Package tsop-54 54P3G-C 54PIN TSOP 54PIN
Contextual Info: E HE 1 54 e EIAJ Package Code TSOP II 54-P-400-0.80 D JEDEC Code – y Weight g b 27 28 F Lead Material Alloy 42 L1 Detail F A2 A c A1 b2 ME I2 b2 A A1 A2 b c D E e HE L L1 y Symbol Mar.’98 Dimension in Millimeters Min Nom Max – – 1.2 0.125 0.2 0.05

Contextual Info: GMM26417233ATG 16,777,216 WORDS x64bit LG Semicon Co.,Ltd. Description The GMM26417233ATG is a 16M x 64bits Synchronous Dynamic RAM MODULE which is assembled 8 pieces of 16M x 8bits Synchronous DRAMs in 54 pin TSOP II package and one 2048 bit EEPROM in 8pin

Contextual Info: GMM27317233ATG 16,777,216 WORDS x72BIT LG Semicon Co.,Ltd. Description The GMM27317233ATG is a 16M x 72bits Synchronous Dynamic RAM MODULE which is assembled 9 pieces of 16M x 8bits Synchronous DRAMs in 54 pin TSOP II package and one 2048 bit EEPROM in 8pin

Contextual Info: GMM27317230ATG LG Semicon Co.,Ltd. Description 16,777,216 WORDS x72BIT SYNCHRONOUS DYNAMIC RAM MODULE Features The GMM27317230ATG is a 16M x 72bits Synchronous Dynamic RAM MODULE which is assembled 9 pieces of 16M x 8bits Synchronous DRAMs in 54 pin TSOP II

EDS2516APTA-75TI-E

Abstract: EDS2516APTA-TI-E
Contextual Info: DATA SHEET 256M bits SDRAM WTR Wide Temperature Range EDS2516APTA-TI-E (16M words x 16 bits) Specifications Pin Configurations • Density: 256M bits • Organization ⎯ 4M words × 16 bits × 4 banks • Package: 54-pin plastic TSOP (II) ⎯ Lead-free (RoHS compliant)

Contextual Info: PRELIMINARY DATA SHEET 64M bits SDRAM WTR Wide Temperature Range EDS6416AJTA-TI (4M words x 16 bits) Specifications Pin Configurations • Density: 64M bits • Organization ⎯ 1M words × 16 bits × 4 banks • Package: 54-pin plastic TSOP (II) ⎯ Lead-free (RoHS compliant)

Contextual Info: GMM26433233ANTG 33,554,432 WORDS x64bit SYNCHRONOUS DYNAMIC RAM MODULE LG Sem icon Co.,Ltd. Description The GMM26433233ANTG is a 32M x 64bits Synchronous Dynamic RAM MODULE which is assembled 16 pieces of 16M x 8bits Synchronous DRAMs in 54 pin TSOP II package and one 2048 bit EEPROM

Contextual Info: PRELIMINARY DATA SHEET 64M bits SDRAM WTR Wide Temperature Range EDS6416AJTA-TI (4M words x 16 bits) Specifications Pin Configurations • Density: 64M bits • Organization  1M words × 16 bits × 4 banks • Package: 54-pin plastic TSOP (II)  Lead-free (RoHS compliant)

Contextual Info: DATA SHEET 128M bits SDRAM WTR Wide Temperature Range EDS1216AHTA-LI (8M words x 16 bits) Specifications Pin Configurations • Density: 128M bits • Organization  2M words × 16 bits × 4 banks • Package: 54-pin plastic TSOP (II)  Lead-free (RoHS compliant)