TSOP-II 44 LAYOUT Search Results

IC 4407

Abstract: IC235 TSOP 54 socket IC235-0442-207 4407 pin details 4407 TSOP 50 socket IC235-0542-218-2 IC235-0242-202 IC235-0082-236
Contextual Info: IC235 Series Open Top Thin and Small Outline Package (TSOP -Type II / SOP) Part Number (Details) Specifications 1,000M Ω min. at 500V DC 700V AC for 1 minute 30m Ω max. at 10mA/20mV max. –40°C to +150°C 10,000 insertions min. 30g min. per pin at minimum

TSOP 54 socket

Abstract: IC189 TSSOP YAMAICHI SOCKET IC189-0562 TSOP 48 socket IC189-0482 IC189-0482 TSOP 54 socket TSOP 62 Package IC189-0482-094 tsop 1230
Contextual Info: Part Number Details Specifications 1,000M Ω min. at 100V DC, pitch 0.5 1,000M Ω min. at 500V DC, pitch 0.65, 0.8, 1.27 Insulation Resistance: IC189 - 042 2 - 025 * - * Series No. Dielec. Withstd. Voltage: for 1 minute at 100 V AC, pitch 0.5 for 1 minute at 500 V AC, pitch 0.65

TSSOP YAMAICHI SOCKET

Abstract: IC189-0482-077 IC189-0482-094 IC189 Series Open Top SOP, SSOP, TSOP Type I a IC189-0482-066 IC189 IC189-0422-025 from TSOP Type II ssop40 IC189-0482
Contextual Info: IC189 Series Open Top Part Number (Details) Specifications Insulation Resistance: 1,000M Ω min. at 100V DC, pitch 0.5 1,000M Ω min. at 500V DC, pitch 0.65, 0.8, 1.27 IC189on - 040 2 - 068 * - * i Series No. Dielec. Withstd. Voltage: for 1 minute at 100 V AC, pitch 0.5

IC51-0242-1006-1

Abstract: TSOP 44 socket IC51-0482-2018 TSOP 48 socket ic 4008 0262 IC51-0322-1207-1 IC51-0282-1032-1 IC51-0322-1031-1 IC51-0322-1219
Contextual Info: IC51 - Clamshell Thin Small Outline Package TSOP Type I and II Part Number (Details) Specifications 1,000M Ω min. at 500V DC Insulation Resistance: Dielectric Withstanding Voltage: 700V AC for 1 minute 30m Ω max. at 10mA/20mV max. Contact Resistance:

land pattern for TSOP

Abstract: TSOP 86 land pattern land pattern for SOP land pattern PQFP 208 land pattern for TSOP 2 86 MA05A land pattern for TSOP 2 land pattern for SSOP land pattern PQFP 100
Contextual Info: Land Pattern Recommendations The following land pattern recommendations are provided as guidelines for board layout and assembly purposes. These recommendations cover the following National Semiconductor packages: PLCC, PQFP, SOP, SSOP and TSOP. For SOT-23 5-Lead and TO-263 (3- or 5-Lead) packages,

TSOP 50 socket

Abstract: IC51-0442-1709 IC51-0262-1339 IC51-0502-1708
Contextual Info: IC51 - Clam shel l Thi n Sm all Out line Package TSOP Type II Part Number (Details) Specifications Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Operating Temperature Range: Mating Cycles: 1,000MΩ min. at 500V DC 700V AC for 1 minute

land pattern for SSOP

Abstract: TSOP 86 land pattern land pattern for SOP land pattern for TSOP TSOP 48 Pattern land pattern PQFP 208 land pattern for TSOP 2 86 tip 3035 land pattern PQFP 132 land pattern PQFP 100
Contextual Info: Land Pattern Recommendations The following land pattern recommendations are provided as guidelines for board layout and assembly purposes. These recommendations cover the following National Semiconductor packages: PLCC, PQFP, SOP, SSOP and TSOP. For SOT-23 5-Lead and TO-263 (3- or 5-Lead) packages, refer to land patterns shown in the Physical Dimensions for

Contextual Info: TSOP Type II, Open Top IC 235 Series Characteristics Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temperature: 1.OOOMfiminimum at 500 VDC 700 VAC for 1 Minute 30mQ max. at 10mA/20mV (Initial) -40"C ~ +150'C Material Insulator:

Contextual Info: TSOP Type II, Open Top IC235 Series Characteristics 1,000M½minimum at 500 VDC 700 VAC for 1 Minute 30m½ max. at 10mA/20mV (Initial) -40ûC ~ +150ûC Socket Series No. of Leads No. of Sides with Contacts Inline Memory Modules Insulation Resistance: Withstanding Voltage:

amd 15h power

Abstract: TSOP-48 pcb LAYOUT TSOP 48 LAYOUT AM29LV640 TSOP-48 FOOTPRINT
Contextual Info: Implementing a Common Layout for AMD MirrorBit and Intel StrataFlash™ Memory Devices Application Note -XO\  7KH IROORZLQJ GRFXPHQW UHIHUV WR 6SDQVLRQ PHPRU\ SURGXFWV WKDW DUH QRZ RIIHUHG E\ ERWK $GYDQFHG 0LFUR 'HYLFHV DQG XMLWVX $OWKRXJK WKH GRFXPHQW LV PDUNHG ZLWK WKH QDPH RI WKH FRPSDQ\ WKDW RULJ

amd 15h power

Abstract: AM29LV640
Contextual Info: Implementing a Common Layout for AMD MirrorBitTM and Intel StrataFlashTM Memory Devices Application Note Overview This document describes the benefits of designing with AMD MirrorBit Flash memory and the ease with which system designers can layout a board to accommodate high-density flash devices from both AMD and

ISD4002

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ISD4002

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ISD4003 Series

Abstract: ISD4003
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sample code read and write flash memory spansion

Abstract: AMD29LV SPANSION date code format spansion S29GL064 sample code write buffer spansion intel MLC flash Intel 56 TSOP PL32LM amd 15h power S29GL
Contextual Info: Implementing a Common Layout for Spansion MirrorBitTM and Intel StrataFlashTM Memory Devices Application Note Overview This document describes the benefits of designing with Spansion MirrorBit Flash memory and the ease with which system designers can layout a board to accommodate high-density flash devices from both

MSM7731-02

Abstract: P-BGA313-3535-1 TBA 931 MsM82C59 MSM66 arm processor msm5299 SSOP20-P-250-0 QFJ28-P-S450-1 MSM65524A
Contextual Info: Datasheet CD-ROM Ver 1.23, July 1999 Bay of Islands, New Zealand Attention Please! People to People Technology 1. Regarding Operation • This is NOT a music CD. Please do not play it on an ordinary music CD player. It may cause damage to your ears and loudspeakers.

Contextual Info: PRELIMINARY CY14B116K/CY14B116M 16-Mbit 2048 K x 8/1024 K × 16 nvSRAM with Real Time Clock Features Functional Description 16-Mbit nonvolatile static random access memory (nvSRAM) ❐ 25-ns and 45-ns access times ❐ Internally organized as 2048 K × 8 (CY14B116K),

cx20185

Abstract: UHF FM Transceiver motorola 5118 motorola 5118 uhf CXA1446S Sony Semiconductor ILX511 CXA1691 CXA1733M CXA1619S SONY ICX
Contextual Info: Sony Semiconductor 96.10 Sony Semiconductor Product List ’96 – 10 TABLE OF CONTENTS MEMORY CMOS/Bi-CMOS SRAM . 1 • LINEUP . 1

Contextual Info: SOP, SSOP, TSOP IC51 Series IC51- 028 2- 334-1 * Socket Series Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temperature: No. of Leads No. of Sides with Contact Design No. Material PES / PEI Glass Filled Beryllium Copper Gold over Nickel

70241k

Abstract: d5611 61c256 ic 9022 61c64 RELIABILITY REPORT ISSI vacuum tubes CMS 2015 S/TRANSISTOR J 5804 EQUIVALENT 28F010P
Contextual Info: ISSI Integrated Silicon Solution, Inc. Quality and Reliability 1997-1998 An ISO 9001 Company ISSI ® Reliability Report 1997-1998 An ISO 9001 Company 1997 Integrated Silicon Solution, Inc. Integrated Silicon Solution, Inc. • 2231 Lawson Lane • Santa Clara, CA 95054

c9013

Abstract: 84 pin PBGA oscilloscope MTBF TSMC retention memory dc 8069 IS61C1024 IC Data-book Q-16 car radio 14x20 TSOP 8638
Contextual Info: ISSI Integrated Silicon Solution, Inc. Quality and Reliability 1997-1998 An ISO 9001 Company ISSI ® Quality System Manual QUALITY Reliabilty Report 1997-1998 RELIABILITY Integrated Silicon Solution, Inc. An ISO 9001 Company 1997 Integrated Silicon Solution, Inc.

Contextual Info: PRELIMINARY CY14B116K/CY14B116M 16-Mbit 2048 K x 8/1024 K × 16 nvSRAM with Real Time Clock Features Functional Description • The Cypress CY14B116K/CY14B116M combines a 16-Mbit nvSRAM with a full-featured RTC in a monolithic integrated circuit. The nvSRAM is a fast SRAM with a nonvolatile element

INFORMATION STORAGE DEVICES

Abstract: chipcorder isd chipcorder 2D ED
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MSM52V1017LP

Contextual Info: E2I0022-17-Y1 ¡ Semiconductor MSM52V1017LP ¡ Semiconductor This version: Jan. 1998 MSM52V1017LP Previous version: Aug. 1996 65,536-Word ¥ 16-Bit CMOS STATIC RAM DESCRIPTION The MSM52V1017LP is a 65,536-word by 16-bit CMOS static RAM featuring 3.0 V to 3.6 V power