TSSOP8 PACKAGE Search Results

Contextual Info: M24SR64-Y Dynamic NFC/RFID tag IC with 64-Kbit EEPROM, NFC Forum Type 4 Tag and I²C interface Datasheet - production data Package • 8-lead small-outline package SO8 ECOPACK 2 SO8 (MN) UFDFPN8 (MC) TSSOP8 (DW) • TSSOP8 ECOPACK®2 • UFDFPN8 ECOPACK®2

Contextual Info: M24SR04-Y Dynamic NFC/RFID tag IC with 4-Kbit EEPROM, NFC Forum Type 4 Tag and I²C interface Datasheet - production data Package • 8-lead small-outline package SO8 ECOPACK 2 • TSSOP8 ECOPACK®2 SO8 (MN) TSSOP8 (DW) UFDFPN8 (MC) • UFDFPN8 ECOPACK®2

Contextual Info: M24SR04-Y Dynamic NFC/RFID tag IC with 4-Kbit EEPROM, NFC Forum Type 4 Tag and I²C interface Datasheet - preliminary data Package • 8-lead small-outline package SO8 ECOPACK 2 • TSSOP8 ECOPACK®2 SO8 (MN) TSSOP8 (DW) UFDFPN8 (MC) • UFDFPN8 ECOPACK®2

Contextual Info: M24SR04-Y Dynamic NFC/RFID tag IC with 4-Kbit EEPROM, NFC Forum Type 4 Tag and I²C interface Datasheet - production data Package • 8-lead small-outline package SO8 ECOPACK 2 • TSSOP8 ECOPACK®2 SO8 (MN) TSSOP8 (DW) UFDFPN8 (MC) • UFDFPN8 ECOPACK®2

Contextual Info: M24SR04-Y Dynamic NFC/RFID tag IC with 4-Kbit EEPROM, NFC Forum Type 4 Tag and I²C interface Datasheet - production data Package • 8-lead small-outline package SO8 ECOPACK 2 SO8 (MN) TSSOP8 (DW) UFDFPN8 (MC) • TSSOP8 ECOPACK®2 • UFDFPN8 ECOPACK®2

Contextual Info: M24SR16-Y Dynamic NFC/RFID tag IC with 16-Kbit EEPROM, NFC Forum Type 4 Tag and I²C interface Datasheet - production data Package • 8-lead small-outline package SO8 ECOPACK 2 SO8 (MN) TSSOP8 (DW) UFDFPN8 (MC) • TSSOP8 ECOPACK®2 • UFDFPN8 ECOPACK®2

PD0023

Contextual Info: PD0023 Packing information Shipping media for TSSOP8 thin shrink small outline package Introduction The TSSOP8 thin shrink, small outline, surface mount package is supplied in tape and reel packing. The reels are standard 330 mm diameter and contain 4000 devices. The tape used

M24C128

Abstract: 16KX8 M24128 M24C64 QREE0031 TSSOP14 STMicroelectronics lot number m24c64
Contextual Info: QREE0031 QUALIFICATION REPORT TSSOP8 / TSSOP14 High Density Lead Frame ANAM THIS REPORT This Qualification Report summarizes the reliability trials and results performed to qualify High Density Lead Frame HDLF used on TSSOP8 (Thin Shrink Small Outline Package) and TSSOP14 by our

Contextual Info: M24SR02-Y Dynamic NFC/RFID tag IC with 2-Kbit EEPROM, NFC Forum Type 4 Tag and I²C interface Datasheet - production data Package • 8-lead small-outline package SO8 ECOPACK 2 SO8 (MN) UFDFPN8 (MC) TSSOP8 (DW) • TSSOP8 ECOPACK®2 • UFDFPN8 ECOPACK®2

Contextual Info: M24SR02-Y Dynamic NFC/RFID tag IC with 2-Kbit EEPROM, NFC Forum Type 4 Tag and I²C interface Datasheet - production data Package • 8-lead small-outline package SO8 ECOPACK 2 SO8 (MN) TSSOP8 (DW) UFDFPN8 (MC) • TSSOP8 ECOPACK®2 • UFDFPN8 ECOPACK®2

Contextual Info: M24SR16-Y Dynamic NFC/RFID tag IC with 16-Kbit EEPROM, NFC Forum Type 4 Tag and I²C interface Datasheet - production data Package • 8-lead small-outline package SO8 ECOPACK 2 • TSSOP8 ECOPACK®2 SO8 (MN) TSSOP8 (DW) UFDFPN8 (MC) • UFDFPN8 ECOPACK®2

Contextual Info: M24SR64-Y Dynamic NFC/RFID tag IC with 64-Kbit EEPROM, NFC Forum Type 4 Tag and I²C interface Datasheet - production data Package • 8-lead small-outline package SO8 ECOPACK 2 SO8 (MN) UFDFPN8 (MC) TSSOP8 (DW) • TSSOP8 ECOPACK®2 • UFDFPN8 ECOPACK®2

Contextual Info: M24SR64-Y Dynamic NFC/RFID tag IC with 64-Kbit EEPROM, NFC Forum Type 4 Tag and I²C interface Datasheet - production data Package • 8-lead small-outline package SO8 ECOPACK 2 SO8 (MN) TSSOP8 (DW) UFDFPN8 (MC) • TSSOP8 ECOPACK®2 • UFDFPN8 ECOPACK®2

Contextual Info: M24SR02-Y Dynamic NFC/RFID tag IC with 2-Kbit EEPROM, NFC Forum Type 4 Tag and I²C interface Datasheet - production data Package • 8-lead small-outline package SO8 ECOPACK 2 SO8 (MN) TSSOP8 (DW) UFDFPN8 (MC) • TSSOP8 ECOPACK®2 • UFDFPN8 ECOPACK®2

Contextual Info: M24SR16-Y Dynamic NFC/RFID tag IC with 16-Kbit EEPROM, NFC Forum Type 4 Tag and I²C interface Datasheet - preliminary data Package • 8-lead small-outline package SO8 ECOPACK 2 • TSSOP8 ECOPACK®2 SO8 (MN) TSSOP8 (DW) UFDFPN8 (MC) • UFDFPN8 ECOPACK®2

Contextual Info: M24SR64-Y Dynamic NFC/RFID tag IC with 64-Kbit EEPROM, NFC Forum Type 4 Tag and I²C interface Datasheet - preliminary data Package • 8-lead small-outline package SO8 ECOPACK 2 SO8 (MN) TSSOP8 (DW) UFDFPN8 (MC) • TSSOP8 ECOPACK®2 • UFDFPN8 ECOPACK®2

Contextual Info: M24SR16-Y Dynamic NFC/RFID tag IC with 16-Kbit EEPROM, NFC Forum Type 4 Tag and I²C interface Datasheet - production data Package • 8-lead small-outline package SO8 ECOPACK 2 • TSSOP8 ECOPACK®2 SO8 (MN) TSSOP8 (DW) UFDFPN8 (MC) • UFDFPN8 ECOPACK®2

Contextual Info: M24SR64-Y Dynamic NFC/RFID tag IC with 64-Kbit EEPROM, NFC Forum Type 4 Tag and I²C interface Datasheet - production data Package • 8-lead small-outline package SO8 ECOPACK 2 SO8 (MN) TSSOP8 (DW) UFDFPN8 (MC) • TSSOP8 ECOPACK®2 • UFDFPN8 ECOPACK®2

MAX1966

Abstract: PMWD16UN
Contextual Info: µTrenchMOS Applications Point of Load DC-DC Converter using TSSOP8 Philips innovative dual µTrenchMOS devices in the TSSOP8 package provide an ideal solution for highly- efficient Point of Load DC-DC power conversion while at the same time meeting space constraints, crucial for designers today.

PMWD15UN

Abstract: PMWD16UN PMWD18UN PMWD19UN PMWD26UN PMWD30UN SC75
Contextual Info: µTrenchMOS Dual MOSFETs in TSSOP8 A new dimension in power Committed to delivering a complete range of essential multimarket semiconductors, Philips Semiconductors has expanded its innovative µTrenchMOS portfolio with the introduction of a series of 20 V and 30 V dual MOSFETs in the compact TSSOP8

EEPROM

Abstract: M24M01-TSSOP8 M24M01
Contextual Info: M24M01-TSSOP8 1 Mbit serial I²C bus EEPROM in TSSOP8 package Preliminary data Features • Compatible with all I2C bus modes: – 1 MHz Fast-mode Plus – 400 kHz Fast mode – 100 kHz Standard mode ■ Memory array: – 1 Mb 128 Kbytes of EEPROM – Page size: 256 bytes

SX3702

Contextual Info: TSX3702 Micropower dual CMOS voltage comparators Datasheet - production data Features • • D SO8 plastic micropackage • • • • • P TSSOP8 (thin shrink small outline package) • • S MiniSO8 (plastic package) Applications • • Automotive

Contextual Info: TSC1021 High-side current sense amplifier Datasheet - production data Applications • Automotive current monitoring • Notebook computers • Server power supplies • Telecom equipment • Industrial SMPS • Current sharing TSSOP8 Plastic package • LED current measurement

OF TL084 OPAMP

Abstract: audio Amp. mosfet 1000 watt 3000 Watt BTL Audio Amplifier AUDIO AMPLIFIER 140 WATT MOSFET 24v 5 amp smps TDA2320A replacement DC MOTOR DRIVE WITH LM324 NE555 IGBT DRIVER TSM1001 lm336 sot23
Contextual Info: Standard linear portfolio From innovative devices to application specific products Package Flip chip DFN8 Mini SO8 SO8 S014/16 SO20 SO24 batwing SOT23-3/5 TO92 TQFP44/48 TSSOP8 TSSOP14/16 TSSOP28 Tape width mm Qty/reel (min.order qty) Lead-free available