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10131319-04221G0LF
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Amphenol Communications Solutions
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Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, 100u\\ Matte Tin overall plating, Black Color, 4 Positions, GW Compatible Nylon66, Tray Packing. |
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10131319-082110PLF
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Amphenol Communications Solutions
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Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, 100u\\ Matte Tin overall plating, Natural Color, 8 Positions, Non GW Compatible Nylon66, Tray Packing, With Pegs. |
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10131319-0412100LF
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Amphenol Communications Solutions
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Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Black Color, 4 Positions, Non GW Compatible Nylon66, Tray Packing. |
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77313-190-20LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 20 Positions |
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10131319-044110PLF
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Amphenol Communications Solutions
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Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, 30u\\ Gold on Contact area (100u\\ Matte Tin on Tails) plating, Natural Color, 4 Positions, Non GW Compatible Nylon66, Tray Packing, With Pegs. |
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