TWP CABLE Search Results

Contextual Info: Crimp-Validation product: DELPHI PN 13718671 material: surface: material thickness: CUNISI AG 0,32 mm cross section [mm²]: 3,0 strip length: 4,30 mm cable type: insulation ø [mm]: TWP 3,04 - 3,20 seal: conductor dimension cable type cross sect. [mm²] struct.

Transparent, Extended ribbon cable

Abstract: DS1217A 746616-2 DS1217
Contextual Info: DS1217A DS1217A Nonvolatile Read/Write Cartridge FEATURES • User-insertable • Capacity up to 32K x 8 • Standard bytewide pinout facilitates connection to JEDEC 28-pin DIP socket via ribbon cable • Data retention greater than 10 years • Automatic

TWB600

Abstract: TWB3054 TWF30 TWB2063 ecm 4f TWF10 TWB1111 TWB-1000 TWB2111 TWB2112
Contextual Info: 108-109.qxp 8/11/2010 10:49 AM Page 109 TW Series THRU-WALL BARRIER Cable/Conduit Sealing Device 4F 4F Applications: THRU-WALL BARRIER cable/conduit sealing device is used wherever there is a need to seal cables or conduits penetrating fireor non-fire-rated walls, ceilings, floors, bulkheads or decks. For nonfire-rated walls, ceilings, floors, bulkheads or decks, THRU-WALL

DS1217

Contextual Info: DS1217A DA LLA S DS1217A Nonvolstil Resd/Writ© Cartridge s e m ic o n d u c t o r PIN ASSIGNMENT FEATURES • User-insertable Name • Capacity up to 32K x 8 Ground +5 Volts • Standard bytewide pinout facilitates connection to JEDEC 28-pin DIP socket via ribbon cable

DS1217

Contextual Info: D A LLA S DS1217A WMHìftHftUCTOR Nonvolatile Read/Write Cartridge PIN ASSIGNMENT FEATURES • User-insertable • Standard bytewide pinout facilitates connection to JEDEC 28-pin DIP socket via ribbon cable • Automatic write against data loss protection

LXT332

Abstract: T7290 abam
Contextual Info: Dual Channel Tranceiver Solution Migration from AT&T T7290 to LXT332 TABLE OF CONTENTSAPRIL, 1996 APPLICATION NOTE 39 LXT332 Dual Channel T1/E1 Transceiver Solution Migration from Dual-Chip AT&T T7290 to Single-Chip (LXT332) Implementation G ENERAL INFORMATION

AN039

Abstract: LXT332 T7290 abam
Contextual Info: LXT332 Dual Channel T1/E1 Transceiver Solution Migration from Dual-Chip AT&T T7290 to Single-Chip (LXT332) Implementation Application Note January 2001 Order Number: 249154-001 As of January 15, 2001, this document replaces the Level One document known as AN039.

LXT332

Abstract: AN038
Contextual Info: LXT332 Dual Channel T1/E1 Transceiver Solution Migration from Dual-Chip Siemens PEB 2236 to Single-Chip (LXT332) Implementation Application Note January 2001 Order Number: 249153-001 As of January 15, 2001, this document replaces the Level One document known as AN038.

AO-A14

Abstract: DS1217M DS1222 DS1217
Contextual Info: DALLAS SEMICONDUCTOR DS1217M Nonvolatile Read/Write Cartridge PIN ASSIGNMENT FEATURES • User-insertable Name • Capacity up to 51 2K x 8 • Standard bytewide pinout facilitates connection to JEDEC 28-pin DIP via ribbon cable A2 B2 Write Enable Address 13

DS1217

Contextual Info: DALLAS SEMICONDUCTOR DS1217M Nonvolatile Read/Write Cartridge FEATURES PIN ASSIGNMENT • User-insertable Name • Data retention greater than 5 years • C apacity up to 512K x 8 • Standard bytewide pinout facilitates connection to JEDEC 28-pin DIP via ribbon cable

e1 cable

Abstract: LXT384 characteristics of twisted pair cable cable e1 16 x E1 G.703 coaxial d5 coaxial d8 mark tv2 twisted pair cable with parameter TWP cable
Contextual Info: LXT380/1/4/6/8 Redundancy Applications Application Note January 2001 Order Number: 249134-001 As of January 15, 2001, this document replaces the Level One document known as AN119. Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual

Contextual Info: SMART SM5400880F4EUUU SM5400880E4EUUU Modular Technologies Preliminary 32MByte 8M x 40 DRAM Module - 8Mx8 based 72-pin SIMM, ECC with Level Translators Features Part Numbers • • • • • • • • • • • SM5400880F4EUUU SM5400880E4EUUU Standard

Contextual Info: SMART SM5640430UUN6GU Modular Technologies May 6, 1998 32MByte 4M x 64 DRAM Module - 4Mx16 based 168-pin DIMM, Non-buffered Features Part Numbers • • • • • • • • • • • SM56404301UN6GU SM56404309UN6GU Standard : JEDEC Configuration

Contextual Info: SMART SM5720830U4E6GU Modular Technologies September 23, 1997 64MByte 8M x 72 DRAM Module - 4Mx16, 4Mx4 based 168-pin DIMM, Buffered, ECC Features Part Numbers • • • • • • • • • • SM572083014E6GU SM572083094E6GU Configuration : ECC

LXT380

Contextual Info: 1+1 Protection without Relays Using Cortina Systems LXT380/1/4/6/8 Hitless Protection Switching Application Note 10 August 2007 Document Number 249464 Revision 2.0 LXT38x LIU Application Note 249464, Revision 2.0 10 August 2007 Legal Disclaimers This document contains information proprietary to Cortina Systems, Inc. Cortina . Any use or disclosure, in whole or in part, of this

Contextual Info: SMART SM5640830UUNWGU Modular Technologies December 22, 1998 Revision History • December 22, 1998 Changed physical dimensions from inches to mm page 11 . • October 6, 1997 Datasheet released. Corporate Headquarters: 4305 Cushing Pkwy., Fremont, CA 94538, USA • Tel:(510) 623-1231 • Fax:(510) 623-1434 • E-mail: info@smartm.com

Contextual Info: SMART SM5403240U4EUUU Modular Technologies May 22, 1998 128MByte 32M x 40 DRAM Module - 16Mx4 based 72-pin SIMM, ECC Features Part Numbers • • • • • • • • • • • SM540324004EUUU SM540324014EUUU SM540324084EUUU SM540324094EUUU Standard

Contextual Info: SMART SM5360140U1EUUU Modular Technologies November 12, 1996 4MByte 1M x 36 DRAM Module - 1Mx4 based 72-pin SIMM, ECC Features Part Numbers • • • • • • • • • • • SM536014001EUUU SM536014011EUUU SM536014081EUUU SM536014091EUUU Standard

Contextual Info: SMART SM5320430UUF6GU Modular Technologies September 8, 1997 16MByte 4M x 32 DRAM Module - 4Mx16 based 100-pin DIMM, Non-buffered Features Part Numbers • • • • • • • • • • • SM53204301UF6GU SM53204309UF6GU Standard : JEDEC Configuration

Contextual Info: SMART SM5720430UUDWGU Modular Technologies Preliminary Revision History • December 23, 1998 Changed physical dimensions from inches to mm page 11 . • March 21, 1997 Datasheet released. Corporate Headquarters: 4305 Cushing Pkwy., Fremont, CA 94538, USA • Tel:(510) 623-1231 • Fax:(510) 623-1434 • E-mail: info@smartm.com

Contextual Info: SMART SM5363240U4EUUU Modular Technologies Preliminary 128MByte 32M x 36 DRAM Module - 16Mx4 based 72-pin SIMM, ECC Features Part Numbers • • • • • • • • • • • SM536324004EUUU SM536324014EUUU SM536324084EUUU SM536324094EUUU Standard

8k refresh simm

Contextual Info: SMART SM5640830UUN6GU Modular Technologies November 12, 1997 64MByte 8M x 64 DRAM Module - 4Mx16 based 168-pin DIMM, Non-buffered Features Part Numbers • • • • • • • • • • • SM56408301UN6GU SM56408319UN6GU Standard : JEDEC Configuration

Contextual Info: SMART SM5360240U1EUUU Modular Technologies November 12, 1996 8MByte 2M x 36 DRAM Module - 1Mx4 based 72-pin SIMM, ECC Features Part Numbers • • • • • • • • • • • SM536024001EUUU SM536024011EUUU SM536024081EUUU SM536024091EUUU Standard

Contextual Info: SMART SM5400880U4EUUU Modular Technologies Preliminary A 32MByte 8M x 40 DRAM Module - 8Mx8 based 72-pin SIMM, ECC Features Part Numbers • • • • • • • • • • • SM540088004EUUU SM540088014EUUU SM540088084EUUU SM540088094EUUU Standard