UP124A Search Results

UP124A

Contextual Info: 124 Pin Molded Plastic Pin Grid Array NS Package Number UP124A All dimensions are in inches millimeters LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL

UP124A

Abstract: UP159A UP175A
Contextual Info: Plastic Pin Grid Array PPGA 124 Pin Molded Plastic Pin Grid Array NS Package Number UP124A 159 Pin Molded Plastic Pin Grid Array NS Package Number UP159A 2000 National Semiconductor Corporation MS101166 www.national.com Plastic Pin Grid Array (PPGA) May 1999

SmD TRANSISTOR a42

Abstract: TRANSISTOR BC 136 TRANSISTOR BC 157 transistor BC 945 TRANSISTOR BC 187 SNA10A TRANSISTOR BC 413 MO-220-WGGD-2 pdf on BC 187 TRANSISTOR MO-220-WKKD-2
Contextual Info: Plastic Package Dimensional/Thermal Data The following table identifies all of the plastic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the plastic packages

amd 29000

Abstract: V29BMC 29861 AA10 C1995 NSBMC290 NSBMC290-16 NSBMC290UP NSBMC290VF UP124A
Contextual Info: NSBMC290 TM -16 -20 -25 -33 Burst Mode Memory Controller General Description The NSBMC290 is functionally equivalent to the V29BMCTM The NSBMC290 Burst Mode Memory Controller is a single chip device designed to simplify the implementation of burst mode access in high performance systems using the Am29000TM Streamlined Instruction Processor

vjp44a

Abstract: MO-16B-AB TA11B TF11B cu50 ad 153 transistor transistor bd 905 transistor BC 185 mkt 344 MS-026-bcd
Contextual Info: Plastic Package Dimensional/Thermal Data The following table identifies all of the plastic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the plastic packages

iso 1043-1

Abstract: DIN 6120 iso 1043-1 polypropylene j1344 sae j1344 W28B D1972 DIN6120 d24j TA11A
Contextual Info: Packing Considerations Methods, Materials and Recycling Transport Media All NSC commercial devices are prepared, inspected and packed to insure proper physical support and protection during handling, transportation and shipment. Assembled devices are packed in one or more of the following container

Contextual Info: NSBMC290 -16/-20/-25/-33 Burst Mode Memory Controller General Description The NSBMC290 is functionally equivalent to the V29BMC™. The NSBMC290 Burst Mode Memory Control­ ler is a single chip device designed to simplify the imple­ mentation of burst mode access in high performance sys­

iso 1043-1

Abstract: DIN 6120 sae j1344 j1344 w28c iso 1043-1 polypropylene bga Shipping Trays MEC34 BGA OUTLINE DRAWING TSOP package tray
Contextual Info: Packing Considerations Methods, Materials and Recycling Transport Media All NSC commercial devices are prepared, inspected and packed to insure proper physical support and protection during handling, transportation and shipment. Assembled devices are packed in one or more of the following container

T03A

Abstract: TO-202 transistor mkt 344 Cu50 TRANSISTOR BC 136 MTL 728 MS-026-bcd M03A BD 669 V84A
Contextual Info: Plastic Package Dimensional/Thermal Data The following table identifies all of the plastic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the plastic packages