VCC15A Search Results

AFS600-FG256

Abstract: zo 103 ma 75 607 A54 ZENER flashpro3 schematic mark AT0 Unipolar PC atx 400 P4 power supply diagram zener Diode B23 PQ208 QN108 QN180
Contextual Info: Preliminary v1.7 Actel Fusion Mixed-Signal FPGAs Family with Optional ARM® Support Features and Benefits – Frequency: Input 1.5–350 MHz, Output 0.75–350 MHz Low Power Consumption High-Performance Reprogrammable Flash Technology • • • • • Single 3.3 V Power Supply with On-Chip 1.5 V Regulator

A54 ZENER

Abstract: AFS600-FG256 mark AT0 QN108 CORE8051 bipolar ROM
Contextual Info: v2.0 Actel Fusion Family of Mixed-Signal FPGAs Features and Benefits In-System Programming ISP and Security High-Performance Reprogrammable Flash Technology Advanced Digital I/O • • • • • Secure ISP with 128-Bit AES via JTAG • FlashLock® to Secure FPGA Contents

a51 ZENER DIODE

Abstract: transistor 2n2222 bipolar ROM EQUIVALENCES TRANSISTOR LIST ProASIC3 lvds yl 1060
Contextual Info: Revision 3 Fusion Family of Mixed Signal FPGAs Features and Benefits In-System Programming ISP and Security • ISP with 128-Bit AES via JTAG • FlashLock Designed to Protect FPGA Contents High-Performance Reprogrammable Flash Technology • • • •

Schematic

Abstract: DLP-2232H-SF
Contextual Info: DLP-2232H-SF LEAD FREE USB - MICRONTROLLER - FPGA MODULE FEATURES: • • • • • • • • • • Microsemi/Actel SmartFusion Customizable System-on-Chip cSoC FPGA Internal 100MHz, 32-Bit ARM Cortex™-M3 Microcontroller Subsystem (MSS) Internal 100MHz RC Oscillator-1% Accurate

8a320

Abstract: TEESVB TEESVB21A VT1631 RM06FTN TEESVA1A 2R5TPE330M9 sanyo TEESVB21 CB1410QF smd transistor A7p
Contextual Info: 5 3 2 1 First International Computer,Inc Portable Computer Group HW Department D C 4 Board name : Mother Board Schematic 1. Schematic Page Description : Project : LM7WV 2. PCI & IRQ & DMA Description : Version : 0.2 3. Block Diagram : D C 4. Net name Description :

VT1634AL

Abstract: tf041-th-pcb via vt1634al PCT303W PCT303A ad7 l59 16pin soic MITAC schematic 39-XI amilo schematic W83L950
Contextual Info: SERVICE MANUAL FOR 8650 BY: Sanny.Gao Repair Technology Research Department /EDVD November. 2005/R01 8650 N/B Maintenance Contents 1. Hardware Engineering Specification …………………………………………………………………. 4 1.1 Introduction …………………………………………………………………………………………………………… 4

CP2211

Abstract: VT1634 ac14g mitac 8 W83L950 LM358 K8N800 h55 MOTHERBOARD CIRCUIT diagram ICS952007 cb-1410
Contextual Info: SERVICE MANUAL FOR 8889 BY: Star Meng Repair Technology Research Department /EDVD Nov.2004 8889 N/B Maintenance Contents 1. Hardware Engineering Specification ……………………………………………………………………… 4 1.1 Introduction ………………………………………………………………………………………………………………. 4

ps4 schematic

Abstract: 820 B10 45g D5036 c945 TRANSISTOR equivalent D74 DIODE zener diode c531 c337 transistor nec equivalent smd transistor A7p vt1631 vt8235
Contextual Info: 5 3 2 1 First International Computer,Inc Protable Computer Group HW Department D C 4 Board name : Mother Board Schematic 1. Schematic Page Description : Project : PS4 2. PCI & IRQ & DMA Description : Version : 0.6 3. Block Diagram : D C 4. Nat name Description :

intel chipset g31 motherboard repair

Abstract: l7251 mitac 8666 diode 25PH 800 PN800 intel g31 motherboard repair g31 motherboard repair CGR18650C PC709 VIA vt8237
Contextual Info: SERVICE MANUAL FOR 8666 BY: Star Meng Repair Technology Research Department /EDVD Apr.2005 / R01 8666 N/B Maintenance Contents 1. Hardware Engineering Specification ……………………………………………………………………… 4 1.1 Introduction ………………………………………………………………………………………………………………. 4

CP2211F

Abstract: SP8K10SFD5TB m660s 4835B M665S HCB2012KF-121T30 CP2211F d3 sp8k10s VIA vt8237 mb39a126
Contextual Info: Preface Notebook Computer M660S/M665S Service Manual Preface I Preface Notice The company reserves the right to revise this publication or to change its contents without notice. Information contained herein is for reference only and does not constitute a commitment on the part of the manufacturer or any subsequent vendor. They assume no responsibility or liability for any errors or inaccuracies that may appear in this publication nor are

equivalent ZO 607

Abstract: JESD 201 class 1A crystal k 1058 mosfet
Contextual Info: Advanced v0.8 Fusion Family of Mixed-Signal Flash FPGAs ® with Optional Soft ARM Support Features and Benefits Low Power Consumption High-Performance Reprogrammable Flash Technology • • • • • • Advanced 130-nm, 7-Layer Metal, Flash-Based CMOS Process

Contextual Info: Revision 2 Extended Temperature Fusion Family of Mixed Signal FPGAs Features and Benefits • Extended Temperature Tested • Each Device Tested from –55°C to 100°C Junction Temperature High-Performance Reprogrammable Flash Technology • • • • Advanced 130-nm, 7-Layer Metal, Flash-Based CMOS Process

A2F060

Contextual Info: Revision 10 SmartFusion Customizable System-on-Chip cSoC Microcontroller Subsystem (MSS) • • • • • • • • • • • • Hard 100 MHz 32-Bit ARM Cortex -M3 – 1.25 DMIPS/MHz Throughput from Zero Wait State Memory – Memory Protection Unit (MPU)

vt1631

Abstract: vt8237r VT8233 VT1632A STR W 5453 C vt8237 VT6103 VT8237R PLUS via vt8237R Plus chipset south bridge STR W 5453 A
Contextual Info: Data Sheet CN333 North Bridge with Integrated UniChrome Pro 3D / 2D Graphics Controller Revision 1.0 January 5, 2005 VIA TECHNOLOGIES, INC. Copyright Notice: Copyright 2004-2005, VIA Technologies Incorporated. All Rights Reserved. No part of this document may be reproduced, transmitted,

IO51NDB1V0

Abstract: IO83NPB4V0 IO10PDB0V1
Contextual Info: Actel Fusion Mixed-Signal FPGA for the MicroBlade AdvancedMC Solution 4 – Package Pin Assignments 256-Pin FBGA A1 Ball Pad Corner 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 A B C D E F G H J K L M N P R T Note For Package Manufacturing and Environmental information, visit the Resource Center at

A2F500M3

Abstract: A2F500 A2F500 FG484 A2F200-FG484 A2F500 pin details A2F060 A2F060M A2F200M3 A2F200M3F-FG256 A2F200M3F
Contextual Info: Revision 9 SmartFusion Customizable System-on-Chip cSoC Microcontroller Subsystem (MSS) • • • • • • • • • • • • Hard 100 MHz 32-Bit ARM Cortex -M3 – 1.25 DMIPS/MHz Throughput from Zero Wait State Memory – Memory Protection Unit (MPU)

RT3PE3000

Abstract: ycl pcb 452 kt 501 transistor 1N12 SP6-3 kt 803 a CEN 2N2222A 1437
Contextual Info: Actel Fusion Mixed-Signal FPGA for the MicroBlade Advanced Mezzanine Card Solution Actel Fusion Mixed-Signal FPGA for the MicroBlade AdvancedMC Solution Table of Contents Low-Power Flash Device Handbooks Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . i

JESD8-11

Contextual Info: Actel Fusion Mixed-Signal FPGAs DC and Power Characteristics General Specifications DC and switching characteristics for –F speed grade targets are based only on simulation. The characteristics provided for –F speed grade are subject to change after establishing FPGA specifications. Some

TBD 234 V12

Abstract: ACM 944 motor IG 2200 19 X 000 15 R
Contextual Info: Advanced v1.2 Actel Fusion Programmable System Chips Mixed-Signal Family with Optional ARM® Support Features and Benefits Low Power Consumption • • High-Performance Reprogrammable Flash Technology • • • • Advanced 130-nm, 7-Layer Metal, Flash-Based CMOS Process

Power MOSFET TT 2146

Abstract: equivalent of transistor tt 2148 zener diode A39 Libero LVPECL multidrop
Contextual Info: Advanced v0.5 Fusion Family of Mixed-Signal Flash FPGAs ® with Optional Soft ARM Support Features and Benefits – High Performance Reprogrammable Flash Technology • • • • • • Advanced 130-nm, 7-Layer Metal, Flash-Based CMOS Process Nonvolatile, Retains Program When Powered-Off

zo 103 ma 75 607

Contextual Info: Advanced v1.6 Actel Fusion Mixed-Signal FPGAs ® with Optional ARM® Support Features and Benefits Low Power Consumption • • High-Performance Reprogrammable Flash Technology • • • • Advanced 130-nm, 7-Layer Metal, Flash-Based CMOS Process Nonvolatile, Retains Program when Powered Off

F5 DIODE

Abstract: class AB2 push pull power amplifier
Contextual Info: Advanced v0.9 Fusion Family of Mixed-Signal Flash FPGAs ® with Optional Soft ARM Support Features and Benefits Low Power Consumption High-Performance Reprogrammable Flash Technology • • • • • • Advanced 130-nm, 7-Layer Metal, Flash-Based CMOS Process

Power MOSFET TT 2146

Contextual Info: Fusion Family of Mixed-Signal Flash FPGAs Device Architecture Fusion Stack Architecture To manage the unprecedented level of integration in Fusion devices, Actel developed the Fusion technology stack Figure 2-1 . This layered model offers a flexible design environment, enabling design at very high and

a52 zener diode

Abstract: diode ZENER A26 A54 ZENER mark AT0 QN108 CORE8051 NF 838 G bipolar ROM EQUIVALENCES TRANSISTOR LIST 2168 4K1
Contextual Info: Revision 1 Actel Fusion Family of Mixed Signal FPGAs Features and Benefits In-System Programming ISP and Security • Secure ISP with 128-Bit AES via JTAG • FlashLock® to Secure FPGA Contents High-Performance Reprogrammable Flash Technology • •