VSP8 PACKAGE DIMENSION Search Results

VSP8 Package

Abstract: vSP8 Vsp8 Package dimension equivalent components of diode By 127
Contextual Info: PACKAGE DIMENSIONS VSP8 +0.3 2.9 -0.1 ~ 10º 1 0.55 ±0.2 4.0±0.3 5 2.8±0.2 8 4 +0.1 0.127 -0.05 0.65 +0.1 0.1 - 0.05 1.1±0.1 0.6MAX 0.1 0.2±0.1 0.1 M UNIT : mm

ET-7101

Abstract: SSOP10 SSOP14 SSOP20
Contextual Info: TAPING DIMENSIONS 2. TAPING DIMENSIONS There are two types of taping packing, Adhesive Taping in accordance with EIAJ standard ET-7101 ”Packaging of Electronic Components on Continuous Tapes Adhesive Types ” and Emboss carrier taping in accordance with

4558D

Abstract: 4556 op-amp IC 4558 surround sound circuit REGULATOR IC l7812cv TDA2822M SMD TYPE circuit inter CV 203 NE555N IC AUDIO FILTER NJM2060 "cross reference" IC L7912CV MC34063P1
Contextual Info: NJR CORPORATION Product Reference Overview SEMICONDUCTORS LINEAR RF & WIRELESS PACKAGING 27 PART NUMBER SYSTEMS 33 CROSS REFERENCE 35 AUDIO ICs 8 COMMUNICATION ICs 9 VIDEO ICs 10 CMOS SWITCH 11 MCU & PERIPHERAL 13 LCD DRIVER 15 LSI/OTHER 16 SPECIAL FUNCTIONS

PACKAGE DIMENSIONS

Abstract: SSOP10 SSOP14 SSOP20
Contextual Info: PACKAGE DIMENSIONS 3. PACKAGE DIMENSIONS SSOP10 +0.3 3.50 -0.1 0 – 10º 0.5 ±0.2 4.4 ±0.2 6.4 ±0.3 6 10 1 5 0.50 +0.1 0.15 -0.05 0.1 ±0.1 1.15 ±0.1 0.9MAX 0.1 0.2±0.1 0.1 M UNIT :mm SSOP14 +0.3 5.0 - 0.1 0 – 10º 1 0.5±0.2 6.4 ±0.3 4.4±0.2 8 7

Contextual Info: NJM8512 Precision, Dual, JFET Input Operational Amplifier • FEATURES ■GENERAL DESCRIPTION ●Low Input Offset Voltage ●Low Input Offset Voltage Drift ●Low Supply Current ●High Slew Rate ●Wide Bandwidth ●Low Noise ●Low Input Bias Current ●No Phase Reversal

NJU7084

Abstract: NJU7084R NJU7084M
Contextual Info: NJU7084 HIGH-POWER & LOW-VOLTAGE AUDIO POWER AMPLIFIER • GENERAL DESCRIPTION The NJU7084 is an audio power amplifier designed for telephone applications. No external coupling capacitors are required because of the differential outputs. The closed loop gain is adjusted by two external resistors,

Contextual Info: NJM8512 Precision, Dual, JFET Input Operational Amplifier • FEATURES ■GENERAL DESCRIPTION ●Low Input Offset Voltage ●Low Input Offset Voltage Drift ●Low Supply Current ●High Slew Rate ●Wide Bandwidth ●Low Noise ●Low Input Bias Current ●No Phase Reversal

Contextual Info: NJM8512 Precision, Dual, JFET Input Operational Amplifier • FEATURES ■ PACKAGE OUTLINE ●Low Input Offset Voltage ●Low Input Offset Voltage Drift ●Low Supply Current ●High Slew Rate ●Wide Bandwidth ●Low Noise ●Low Input Bias Current ●No Phase Reversal

NJM2903 equivalent

Abstract: NJM2903R
Contextual Info: AEC-Q100 ISO/TS16949 Automotive NJM2903 SINGLE-SUPPLY DUAL COMPARATOR • FEATURES ● Operating Temperature -40ºC ≤ Ta ≤ +125ºC ● Operating Voltage +2V~+36V ● Single Supply Operation ● Open Collector Output ● High Output Sink Current ● Package Outline

Contextual Info: RECOMMENDED MOUNTING METHOD • RECOMMENDED MOUNTING METHOD 1.Soldering Methods The recommended soldering methods for each package are shown in the following table. 1 Recommended Soldering Methods Table Through-Hole mounted device type package PKG TO-92

Contextual Info: RECOMMENDED MOUNTING METHOD • RECONENDED MOUNTING METHOD 1.Soldering Methods The recommended soldering methods for each package are shown in the following table. 1 Recommended Soldering Methods Table Through-Hole mounted device type package PKG REFLOW

SS0P24

Abstract: SS0P-24 QFP64-E1 SS0P14 144/QFP64-E1
Contextual Info: csa RECOMMENDED MOUNTING METHOD A • RECONENDED MOUNTING METHOD 1.Solderins Methods The recommended soldering methods for each package are shown in the following table. 1 Recommended Soldering Methods Table Through-Hole mounted device type package PKG TO-92

SC74A

Abstract: SSOP14 SSOP20 VSP8 Package SC-74A
Contextual Info: PACKAGE OUTLINE TABLE I PACKAGE CODE TABLE 1. PACKAGE OUTLINE TABLE Suffix 6Pin 8Pin 10Pin 14Pin 20Pin SSOP V . _ O O VSP R . O _ _ . O* _ _ _ _ _ - - FLP K MTP6 F MTP6-1 F o o ' _ - - * : PRELIMINARY SSOP 2. PACKAGE CODE TABLE VSP NJRC vs . e ia j FLP6 MTP6

SSOP14 package

Abstract: 74a diode SSOP20 SSOP10 SSOP14 vSP8 Mtp6 SSOP020-P-0225 SC74A
Contextual Info: PACKAGE OUTLINE TABLE / PACKAGE CODE TABLE 1. PACKAGE OUTLINE TABLE Suffix 6Pin 8Pin 10Pin 14Pin 20Pin SSOP V - - √ √ √ VSP R - √ - - - FLP K √ - √ - - MTP6 F √ - - - - MTP6-1 F √ - - - - SSOP VSP FLP6 MTP6 MTP6-1 2. PACKAGE CODE TABLE NJRC vs. EIAJ CODE

DIP18 package

Abstract: SOP20 Package SSOP10 DIP18 DIP20 DIP40 SDIP22 jedec MS-013 EIAJ SSOP020-P-0225
Contextual Info: PACKAGE CODE TABLE 2. PACKAGE CODE TABLE NJRC vs. EIAJ CODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. NJRC CODE <DIP> DIP8 DIP14 DIP16 DIP16-D2/D3 DIP18 DIP20

QFP80

Abstract: SOP40 VQFN20 jedec QFP100 QFN28 QFP44-A1 QFP48 SOP20 Package sop28 SOP32
Contextual Info: PACKAGE CODE TABLE PACKAGE CODE TABLE NJRC vs. EIAJ CODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. NJRC CODE <DIP> DIP8 DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18

SOP18 EIAJ

Abstract: QFP64 package jedec MS-013 emp8 Package dimension jedec QFP80 QFP80 jedec QFP100 QFP44-A1 SOP20 Package SOP24 EIAJ
Contextual Info: PACKAGE CODE TABLE PACKAGE CODE TABLE NJRC vs. EIAJ CODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. NJRC CODE <DIP> DIP8 DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18

QFP80

Abstract: QFP44-A1 SOP20 Package sop28 SSOP10 jedec MS-013
Contextual Info: PACKAGE CODE TABLE 2. PACKAGE CODE TABLE NJRC vs. EIAJ CODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. NJRC CODE <DIP> DIP8 DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18

DIP18

Abstract: DIP20 DIP40
Contextual Info: PACKAGE CODE TABLE PACKAGE CODE TABLE NJRC vs. EIAJ CODE The package codes using in this Data Book are NJRC codes defined by NJRC. EIAJ codes which correspond to NJRC codes are shown as follows. NJRC CODE <DIP> DIP8 DIP14 DIP14-D1 DIP16 DIP16-D2/D3 DIP18

QFP80-CI

Abstract: 10B10T DIP40 NJU9702 SDIP22 SDIP24
Contextual Info: g - 5= -£ o C •1 CC =c c -c ? > 6.4*“ K3 • oo 1 TI g TD > O * > O m s_ O £ í f j'. > V 6.41 s m z « o z <z> A PACKAGE DIMENSIONS DIP 16 Unît: î DIP 18 I 24.2 r^rnirnirnirriifnirnirnir^\ o a M 2 o ~ ir Unit mm 2-4- Nêu^apan RadioCo^HcL PACKAGE DIMENSIONS

EMP20-E2

Abstract: QFP80 QFP64 package QFP80-C3 SSOP20
Contextual Info: RECOMMENDED SOLDER PADS 4. Recommended Solder Pads for Surface Mount Package Recommended solder pads for each package are shown in the following table. Please take easiness of mounting, reliability of bonding, prevention of solder bridge, margin of pattern area into consideration when

EMP24-E3

Abstract: EMP20-E2 QFP80-C3 DMP14 DMP16 EMP14 EMP16-E2 SDMP30 SSOP10
Contextual Info: RECOMMENDED SOLDER PADS 4. Recommended Solder Pads for Surface Mount Package Recommended solder pads for each package are shown in the following table. Please take easiness of mounting, reliability of bonding, prevention of solder bridge, margin of pattern area into consideration when

SSOP14 pcb

Abstract: dmp 30 package DMP8 pcb pattern QFP80 SOP32 data sheet SSOP10 Package QFP-100C EMP20-E2 QFP64 package QFP80-C3
Contextual Info: RECOMMENDED SOLDER PADS 4. Recommended Solder Pads for Surface Mount Package Recommended solder pads for each package are shown in the following table. Please take easiness of mounting, reliability of bonding, prevention of solder bridge, margin of pattern area into consideration when

FLH 211

Abstract: IR 92 0151 MENS MENS package
Contextual Info: •PACKAGE DIMENSIONS DIP8 Pi8 r~i r^ i h 3 «o O V K? \J LJ rzzzi a ’• r 0-15* Unit: m m DIP 14 r^ i U nit: m m N ew fa panfh cloi Co.,dil . 2-3 4 D I MENS I ONS DIP 16 19.0 O 0 —15* U nit: m m DIP 18 V I J 1 l^ J U 9 7.62 J I = Z L i\ 0 —15* U n it i