W-CSP FOOTPRINT Search Results

W-CSP footprint

Abstract: MO-211-C DM056 wcsp package reliability WLCSP stencil design EH11 wcsp wcsp qualification WAN0158
Contextual Info: w WAN_0202 Guidelines on How to Use W-CSP Packages and Create Associated PCB Footprints INTRODUCTION The Wolfson Wafer level ChipScale Package W-CSP is a die-sized package, which obtains electrical contact via solder bumps on the bottom surface of the device to a Printed Circuit Board

mdfn60

Abstract: smd transistor marking j8 C1608X7R1H104KT JESD78 NCP2820 NCP2820FCT1G NCP2820FCT2G NCP2820MUTBG BD8x
Contextual Info: NCP2820 2.65 W Filterless Class−D Audio Power Amplifier Features • Optimized PWM Output Stage: Filterless Capability • Efficiency up to 90% • • • • • • • Low 2.5 mA Typical Quiescent Current Large Output Power Capability: 1.4 W with 8.0 W Load CSP and

Contextual Info: NCP2820 2.65 W Filterless Class−D Audio Power Amplifier Features • Optimized PWM Output Stage: Filterless Capability • Efficiency up to 90% • • • • • • • Low 2.5 mA Typical Quiescent Current Large Output Power Capability: 1.4 W with 8.0 W Load CSP and

oki qfp tray

Abstract: 1000H ED-4701 72 ball w-csp SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY wcsp reliability FBGA tray mobile phone
Contextual Info: Oki’s Wafer Level Chip Size Packaging Technology 1 W-CSP 12/02 The Market’s Requirement for a New Packaging Technology • The need for increased functionality, smaller device size and lower costs are major challenges for today’s design engineers < •

LG LX

Abstract: DIODE MARKING code UG 45
Contextual Info: NCP5230 Product Preview Precise Low Voltage Synchronous Buck Controller with Power Saving Mode http://onsemi.com MARKING DIAGRAMS 1 5230 A L Y W G Features • • • *Note: Microdot may be in either location VCC ROSC/EN CSP PIN CONNECTIONS 16 15 14 13

Contextual Info: NCP81031 Product Preview Low Voltage Synchronous Buck Controller with Power Saving and Transient Enhancement Features http://onsemi.com MARKING DIAGRAMS 1 XXXXX A L Y W G Features • • • • Note: Microdot may be in either location VCC ROSC/EN CSP PIN CONNECTIONS

NCP2820AFCT2G

Abstract: smd transistor marking j5 C1608X7R1H104KT JESD78 J-STD-020A NCP2820 NCP2820FCT1G MPZ1608S221A1 marking code NF SMD Transistor A2 SMD CODE MARKING
Contextual Info: NCP2820 Series 2.65 W Filterless Class-D Audio Power Amplifier http://onsemi.com MARKING DIAGRAMS 1 9-PIN FLIP-CHIP CSP FC SUFFIX CASE 499AL C1 xx A Y WW G = AQ for NCP2820 = BD for NCP2820A = Assembly Location = Year = Work Week = Pb-Free Package 8 Features

Contextual Info: NCP2820 Series 2.65 W Filterless Class-D Audio Power Amplifier http://onsemi.com MARKING DIAGRAMS 1 9-PIN FLIP-CHIP CSP FC SUFFIX CASE 499AL C1 xx A Y WW G = AQ for NCP2820 = BD for NCP2820A = Assembly Location = Year = Work Week = Pb-Free Package 8 Features

Zn107

Contextual Info: .Advance information Features • Easy m em ory expansion w ith CE1, CE2, OE inputs • Intelliwatt active pow er reduction circuitry • 2.3V to 3.0V operating range JESD 8 -5 • JEDEC registered packaging - 3 2 -pin TSOP package - 48-ball 8m m x 6m m CSP BGA

PCB design for very fine pitch csp package

Abstract: 0.3mm pitch csp package oki pitch wcsp reliability 0.4mm pitch BGA 2asic oki packaging gps watch ceramic QFP Package 100 lead
Contextual Info: Oki’s ASIC Wafer Level Chip Size Packaging Technology Overview March 2004 1 ASIC W-CSP 02/04 The Market’s Requirement for New ASIC Packaging Technology • The need for increased functionality, smaller device size and lower costs are major challenges for today’s ASIC design engineers

Contextual Info: NCP81147 Precise Low Voltage Synchronous Buck Controller with Power Saving Mode http://onsemi.com MARKING DIAGRAMS 1 81147 A L Y W G Features • • • *Note: Microdot may be in either location ROSC/EN 16 15 14 CSP VCC PIN CONNECTIONS 13 12 CSN/VO LG 2

Contextual Info: NCP2820 Series 2.65 W Filterless Class-D Audio Power Amplifier http://onsemi.com MARKING DIAGRAMS 1 9−PIN FLIP−CHIP CSP FC SUFFIX CASE 499AL C1 xx A Y WW G • • • • • • • • • • • = AQ for NCP2820 = BD for NCP2820A = Assembly Location

Contextual Info: NCP2820 Series 2.65 W Filterless Class-D Audio Power Amplifier http://onsemi.com MARKING DIAGRAMS 1 9−PIN FLIP−CHIP CSP FC SUFFIX CASE 499AL C1 xx A Y WW G • • • • • • • • • • • • = AQ for NCP2820 = BD for NCP2820A = Assembly Location

TAIYO PSR 4000

Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
Contextual Info: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).

Contextual Info: LSI CSP • CSP Chip Size Package •CSP The FBGA (commonly known as CSP) has an area array terminal structure with solder balls on the bottom, to give it a near chip-size footprint. This high-density, compact and low-profile package technology will greatly help in the design of compact mobile equipment, such as mobile phones and

CM1442-06l

Abstract: MARKING 1053
Contextual Info: CM1442-06LP LCD and Camera EMI Filter Array with ESD Protection Functional Description Features • Six Channels of EMI Filtering with Integrated ESD Protection • 0.4 mm Pitch, 15−Bump, 2.360 mm x 1.053 mm Footprint Chip • • • • • Scale Package CSP

Contextual Info: SiT1542 Preliminary Smallest Footprint 1.2mm2 , Ultra-Low Power 32.768 kHz Oscillator in CSP for Single-Cell Li+ Unregulated Battery Powered Applications The Smart Timing Choice The Smart Timing Choice Features Applications  Supply voltage optimized for Li+ battery voltage: 2.7V to 4.3V

Contextual Info: SiT1532 Preliminary Smallest Footprint 1.2mm2 , Ultra-Low Power 32.768 kHz Oscillator in CSP The Smart Timing Choice The Smart Timing Choice Features Applications  Smallest footprint in chip-scale (CSP): 1.5 x 0.8 mm  Mobile Phones  Ultra-low power: <1µA

SMD capacitor aa4 aa5

Contextual Info: SiT1532 Preliminary Smallest Footprint 1.2mm2 , Ultra-Low Power 32.768 kHz Oscillator in CSP The Smart Timing Choice The Smart Timing Choice Features Applications  Smallest footprint in chip-scale (CSP): 1.5 x 0.8 mm  Mobile Phones  Ultra-low power: <1 µA

32.768Khz oscillator SMD

Contextual Info: SiT1544 Preliminary Smallest Footprint 1.2mm2 , Ultra-Low Power 1 Hz - 32.768 kHz Programmable Oscillator for Li+ Unregulated Battery Powered Applications The Smart Timing Choice The Smart Timing Choice Features Applications  Factory programmable from 32.768 kHz down to 1 Hz

01802

Contextual Info: Si8401DB Vishay Siliconix P-Channel 20-V D-S MOSFET FEATURES PRODUCT SUMMARY VDS (V) - 20 RDS(on) (Ω) ID (A) 0.065 at VGS = - 4.5 V - 4.9 0.095 at VGS = - 2.5 V - 4.1 • TrenchFET Power MOSFET • MICRO FOOT® Chipscale Packaging Reduces Footprint Area Profile (0.62 mm) and

Contextual Info: Si8413DB Vishay Siliconix P-Channel 20-V D-S MOSFET FEATURES PRODUCT SUMMARY VDS (V) - 20 RDS(on) (Ω) ID (A) 0.048 at VGS = - 4.5 V - 6.5 0.063 at VGS = - 2.5 V - 5.7 Qg (Typ.) 14 • TrenchFET Power MOSFET • MICRO FOOT® Chipscale Packaging Reduces Footprint Area Profile (0.62 mm) and

00984a2

Abstract: top side marking b2 PACDN1404C PACDN1404CG PACDN1408C PACDN1408CG PACDN1416C PACDN1416CG 1416C
Contextual Info: PACDN1404C/1408C/1416C ESD Protection Arrays, Chip Scale Package Features Product Description • The PACDN1404C, PACDN1408C and PACDN1416C are transient voltage suppressor arrays that provide a very high level of protection for sensitive electronic components that may be subjected to ESD.

Contextual Info: Si8409DB Vishay Siliconix P-Channel 30-V D-S MOSFET FEATURES PRODUCT SUMMARY VDS (V) - 30 RDS(on) (Ω) ID (A) 0.046 at VGS = - 4.5 V - 6.3 0.065 at VGS = - 2.5 V - 5.3 Qg (Typ.) 17 • TrenchFET Power MOSFET • MICRO FOOT® Chipscale Packaging Reduces Footprint Area Profile (0.62 mm) and