WAFFLE PACK PACKAGING Search Results

VR-33CC-02-X4

Abstract: VR-76CC-02-X4 GP21D H20-045-66C02 VR-195CC-02-X0 H20-109168-66C02 VR-137CC-02-X4 hmc - 020 33CC0 VR-103CC-02-XL
Contextual Info: v05.0109 GEL-PAK & WAFFLE PACK BARE DIE CHIP PACKAGING INFORMATION Gel-Pak ® & Waffle Pack Package Label GEL-PAK ® & WAFFLE PACK Gel-Pak ® Waffle Pack Product Load Direction (Gel-Pak ® or Waffle Pack) Gel-Pak ® Dimensions & Part Numbers Manufacturer P/N

Waffle Pack Packaging

Abstract: waffle
Contextual Info: Waffle Pack Packaging Vishay Thin Film Waffle Pack Packaging VISHAY THIN FILM NIAGARA FALLS STANDARD WAFFLE PACK SPECIFIED (2 inch x 2 inch) SIZE OR STYLE NUMBER OF CELLS 0402 (40 x 20) 400 0502 (50 x 20) 400 0504 (50 x 40) 400 0505 (50 x 50) 400 0603 (60 x 30)

Waffle Pack Packaging

Contextual Info: Waffle Pack Packaging www.vishay.com Vishay Electro-Films VISHAY ELECTRO-FILMS WAFFLE PACK QUANTITY PER PRODUCT FAMILY 2 inch x 2 inch PRODUCT FAMILY CC1CC2CC3CC4CC5CC6CC7CC8SFC SFM SFP SFN SFX SC3 QFM QFN QFX BCR PWA PWB CTT CTA CCC CTR CTN CTM CTQ CCB

Opening Procedure

Abstract: foot step generation of electricity waffle MIL-HDBK-263
Contextual Info: APPLICATION NOTE Waffle Pack Chip Carrier Handling/Opening Procedure Proper ESD handling practice should be adhered to at all times when handling Skyworks product. Step 1 Remove carrier clip. Do not allow separation between the waffle pack and cover. Step 2

MIL-HDBK-263

Abstract: foot step generation of electricity
Contextual Info: REFERENCE MATERIAL APPLICATION NOTE Waffle Pack Chip Carrier Handling/Opening Procedure Proper ESD handling practice should be adhered to at all times when handling a Skyworks product. Step 1 Remove carrier clip. Do not allow separation between the waffle pack and cover.

Contextual Info: Waffle Pack Packaging Vishay Thin Film VISHAY THIN FILM NIAGARA FALLS STANDARD WAFFLE PACK SPECIFIED. (2 x 2 INCH) NUMBER OF CELLS 0402 (40 x 20) 400 0502 (50 x 20) 400 0504 (50 x 40) 400 0505 (50 x 50) 400 0603 (60 x 30) 100 0705 (70 x 50) 100 1005 (100 x 50)

VR-195CC-02-X0

Contextual Info: Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK PACKAGE INFORMATION v00.0213 GEL-PAK & WAFFLE PACK BARE DIE CHIP PACKAGING INFORMATION

mosfet p-channel 300v

Abstract: supertex VN
Contextual Info: SUPERTEX INC Ql D E | 0773215 00017^0 5 8-Channel Logic To High-Voltage Level Translator Ordering Information Part Number/Package 20 Lead CERDIP 20 Lead Plastic DIP 20 Terminal Ceramic LCC Plastic SOW-20* Die in waffle pack HT0130D HT0130P HT0130LC HT0130WG

SMD 2108 A

Abstract: SN63 NTC Thermistor smd
Contextual Info: APPLICATION NOTE: Handling and Soldering Methods for QTI SMD Thermistors HANDLING The electronic ceramics and dielectrics utilized in QTI SMD’s make them inherently fragile. SMD thermistors should be handled with appropriate tools, especially designed for this purpose. When removing devices from waffle pack packaging, use non metallic tweezers

Contextual Info: AIC111 www.ti.com SLAS382A – JUNE 2003 – REVISED NOVEMBER 2005 IC DESIGN SPECIFICATION 1.3-V microPower DSP/ C VOICE BAND AUDIO CODEC Check for Samples: AIC111 FEATURES – - 32-Pin QFN 5x5-mm Plastic Package – - 32-Pad Bumped Die in Waffle Pack wafer

AP01

Abstract: HT01 HT0130D HT0130LC HT0130P HT0130WG HT0130X SOW-20 EIGHT p-channel MOSFET ARRAY
Contextual Info: SUPERTEX INC Ql D E | 0773215 00017^0 5 8-Channel Logic To High-Voltage Level Translator Ordering Information Part Number/Package 20 Lead CERDIP HT0130D 20 Lead Plastic DIP HT0130P 20 Terminal Ceramic LCC HT0130LC Plastic SOW-20* HT0130WG Die in waffle pack

Contextual Info: AIC111 www.ti.com SLAS382A – JUNE 2003 – REVISED NOVEMBER 2005 IC DESIGN SPECIFICATION 1.3-V microPower DSP/ C VOICE BAND AUDIO CODEC Check for Samples: AIC111 FEATURES – - 32-Pin QFN 5x5-mm Plastic Package – - 32-Pad Bumped Die in Waffle Pack wafer

mil spec capacitor catalog

Contextual Info: STANDARD SMT CHIP P/N BREAKDOWN 1206 N 823 J 101 N X050 H T M Marking Case Size M = Marked None = Unmarked Marking not available on sizes 0603 and below Dielectric Code Code EIA Packaging Class T= Tape and Reel W = Waffle Pack None = Bulk N B X Y COG/NP0 X7R

hearing aid integrated circuits

Abstract: 2808990 circuit diagram of hearing aid using transistors
Contextual Info: AIC111 www.ti.com SLAS382A – JUNE 2003 – REVISED NOVEMBER 2005 IC DESIGN SPECIFICATION 1.3-V microPower DSP/ C VOICE BAND AUDIO CODEC Check for Samples: AIC111 FEATURES – - 32-Pin QFN 5x5-mm Plastic Package – - 32-Pad Bumped Die in Waffle Pack wafer

Contextual Info: TITLE: SPECIFICATION CONTROL DRAWING EMC PROPRIETARY REV SHEET DATE 1 2 A B C 1-2 1-3 1-3 1-3 1 1-2 1-2 1-2 10/28/03 12/3/03 12/4/03 2/5/04 10/8/04 12/8/04 1/26/10 03/26/12 REVISIONS RECORD DESCRIPTION PRELIMINARY PRELIMINARY EN 03-268, INITIAL RELEASE EN 04-E033, ADD SERIALIZED WAFFLE PACK NOTE, NO REV CHANGE

Contextual Info: AVX Tantalum Division Biddeford Surface Mount Military/Aerospace Products PART NUMBERING, TEST & PACKAGING OPTIONS Part Numbering: AVX part numbers have 19 character fields. Standard characters are used to denote AVX series, case size, capacitance code, capacitance tolerance, voltage code and standard / Low ESR designator.

SRC9000

Abstract: etr4 waffle
Contextual Info: AVX Tantalum Division Biddeford Surface Mount Military/Aerospace Products PART NUMBERING, TEST & PACKAGING OPTIONS Part Numbering: AVX part numbers have 19 character fields. Standard characters are used to denote AVX series, case size, capacitance code, capacitance tolerance, voltage code and standard / Low ESR designator.

X7RA

Abstract: GB10 GH25 L38112 W381 GH50
Contextual Info: Gigahertz Single Layer Microwave Capacitors Single Layer Ceramic - GH Series W L T Termination Fine grained high density ceramic dielectric Standard Packaging HOW TO ORDER GH35 5 A 6R8 C A W 1 23 4 567 1 Case Size 2 Voltage: 5 = 50V, 1 = 100V 3 Dielectric Code: (See Table below)

QCI-39000

Abstract: QCI-30014 30014 dry cooling tower RG41 200B
Contextual Info: M PACKAGING Overview of Microchip Die/Wafer Support INTRODUCTION ELECTRICAL SPECIFICATIONS Microchip Technology Inc. devices are available in wafer form and in die form. All products sold in die or wafers have been characterized and qualified according to the requirements of Microchip Technology Inc.

QCI-39000

Abstract: QCI-30014 SPI-41014 microchip lot code
Contextual Info: M PACKAGING Overview of Microchip Die/Wafer Support INTRODUCTION ELECTRICAL SPECIFICATIONS Microchip Technology Inc. devices are available in wafer form and in die form. All products sold in die or wafers have been characterized and qualified according to the requirements of Microchip Technology Inc.

MDC 2301

Abstract: 74ACT04 J330 LM108 MIL-HDBK-263 National semiconductor die fr003 NSC die
Contextual Info: Name: ME MAS-2301 Department Specification Title:" GENERAL PROCEDURE FOR DIE AND WAFER SALES " Rev:"2.0" Page: 1 TABLE OF CONTENTS 1. PURPOSE 2 2. APPLICABLE DOCUMENTS 2 3. GENERAL INFORMATION 2 4. DIE AND WAFER PACKAGING SPECIFICATIONS 3 5. GENERAL INSPECTION CRITERIA

VQFN48

Abstract: XE8000 SO20 SOIC20 SOIC28 tn8000 JEDEC MS-026 so20w
Contextual Info: Technical Note TN8000.07 XE8000 Packaging Information TN8000.07 Technical Note XE8000 packaging information Rev 1 February 2006 www.semtech.com 1 Technical Note TN8000.07 XE8000 Packaging Information 1 INTRODUCTION This application note describes the packaging of XE8000 circuits.

Contextual Info: Low Inductance Capacitors LICA Low Inductance Decoupling Capacitor Arrays LICA® arrays utilize up to four separate capacitor sections in one ceramic body (see Configurations and Capacitance Options). These designs exhibit a number of technical advancements:

97Pb

Abstract: H20-080
Contextual Info: Low Inductance Capacitors LICA Low Inductance Decoupling Capacitor Arrays LICA® arrays utilize up to four separate capacitor sections in one ceramic body (see Configurations and Capacitance Options). These designs exhibit a number of technical advancements: