WAVE FOOTPRINT Search Results

SD3502

Abstract: ZM5101
Contextual Info: ZM5101 General Purpose Z-Wave SiP Module The ZM5101 combines a Z-Wave SD3502 SoC with a built-in microcontroller and Z-Wave RF transceiver , crystal, and passive RF components within a single 8mm x 8mm module. This makes the ZM5101 ideal for small-footprint, single microcontroller products, such

Z-Wave Application Programming Guide

Abstract: ZW0301 Application Programming Guide APL10045 ins10247 APL10312 Z-Wave Guide INS10247 Z-Wave Programming Guide Zensys, INS10247 ZW0301 Zensys, APL10312, Application Note, Programming the 200 and 300 Series Z-Wave Single Chip Flash
Contextual Info: Datasheet ZM3102N Z-Wave Module Datasheet Document No: DSH10756 Version: 6 Description: Datasheet for the ZM3102N Z-Wave Module based on the ZW0301 Z-Wave Single Chip. Written By: SDH;TCA Date: 2007-10-01 Reviewed By: DCL Restrictions: None Approved by: Date

ZW0301

Abstract: ZM3102 ZW0401 ZW0402 ZW0102 z-wave ZENSYS wireless door BELL automatic door bell ZW0201
Contextual Info: Z-Wave 300-Series Single Chip – Overview – November 2006 Zensys Inc., 2006 – Confidential Z-Wave P300 Overview - 17 November 2006 - 1 Z-Wave evolution ZW0102 ZW0201 0.35um 0.18um ZW0301 … ZW0301XXXX XXXX … Static Controllers SUC / SIS 40 kbit/s

Contextual Info: Wave soldering footprint Footprint information for wave soldering of hermetically sealed glass surface-mounted package; 2 connectors SOD80C 6.30 4.90 2.70 1.90 2.90 1.70 solder land solder resist occupied area Dimensions in mm www.nxp.com 2010 NXP B.V.

sot363 wave soldering

Contextual Info: Wave soldering footprint Footprint information for wave soldering of plastic surface-mounted package; 6 leads SOT363 1.5 0.3 2.5 4.5 1.5 1.3 1.3 2.45 5.3 preferred transport direction during soldering solder land solder resist occupied area Dimensions in mm

3h32

Abstract: H32 Package 25H32 5h32 208E 213B 3H32-AT-16 22496
Contextual Info: CLOCK OSCILLATORS Logic: HCMOS “H32” series 3.2x2.5x1.1 mm; Wave Form: Square wave MERCURY Since 1973 ● Suitable for light weight and compact consumer electronic devices ● Ideal for high density boards ● Mercury’s smallest footprint clock oscillators.

Contextual Info: Wave soldering footprint Footprint information for wave soldering of plastic surface-mounted package; 4 leads SOT143B 4.45 2.2 1.2 3x 1.425 (3×) 4.6 2.575 preferred transport direction during soldering 1.425 solder land 1 solder resist 1.2 occupied area

Contextual Info: Wave soldering footprint Footprint information for wave soldering of plastic surface-mounted package with increased heatsink; 4 leads SOT223 8.9 6.7 1.9 4 6.2 8.7 preferred transport direction during soldering 1 2 3 1.9 3x solder land 2.7 solder resist

sot89 footprint

Contextual Info: Wave soldering footprint Footprint information for wave soldering of plastic surface-mounted package; 3 leads SOT89 6.6 2.4 3.5 7.6 0.5 preferred transport direction during soldering 1.8 2x solder land 1.9 1.5 (2×) solder resist occupied area www.nxp.com

Contextual Info: Wave soldering footprint Footprint information for wave soldering of plastic surface-mounted package; 3 leads SOT23 2.2 1.2 2x 1.4 (2×) 4.6 2.6 preferred transport direction during soldering 1.4 solder land 2.8 solder resist 4.5 occupied area www.nxp.com

sod323 wave soldering

Contextual Info: Wave soldering footprint Footprint information for wave soldering of plastic surface-mounted, 2 leads package SOD323 5 2.9 1.5 2x 2.75 1.2 (2×) preferred transport direction during soldering solder land solder resist occupied area Dimensions in mm www.nxp.com

wave footprint

Contextual Info: Wave soldering footprint Footprint information for wave soldering of plastic surface-mounted package; 3 leads SOT323 4.6 2.575 1.425 3x 1.8 3.65 2.1 09 (2×) preferred transport direction during soldering solder land solder resist occupied area Dimensions in mm

ZM5202

Abstract: SD3502
Contextual Info: ZM5202 General Purpose Z-Wave Module The ZM5202 module combines a Z-Wave® SD3502 SoC with a built-in microcontroller and Z-Wave RF transceiver , crystal, and passive RF components. This makes the ZM5202 ideal for single microcontroller products, such as lighting control and sensors. The

Contextual Info: Wave soldering footprint Footprint information for wave soldering of SO20 package SOT163-1 1.20 2x enlarged solder land 0.3 (2×) 1.50 8.00 11.00 11.40 0.60 (18×) 1.27 (18×) 13.40 preferred transport direction during soldering solder land solder resist

Contextual Info: Wave soldering footprint Footprint information for wave soldering of SO8 package SOT96-1 1.20 2x enlarged solder land 0.3 (2×) 0.60 (6×) 1.30 4.00 6.60 7.00 1.27 (6×) 5.50 preferred transport direction during soldering solder land solder resist occupied area

Contextual Info: Wave soldering footprint Footprint information for wave soldering of TSOP6 package SOT457 5.3 1.5 4x 1.475 0.45 (2×) 5.05 1.475 1.45 (6×) 2.85 solder land solder resist occupied area Dimensions in mm www.nxp.com 2010 NXP B.V. preferred transport direction during soldering

3H53

Abstract: 3H53-AT-13 H53 mercury 208E 213B 5X3.2
Contextual Info: CLOCK OSCILLATORS “H53” series 5x3.2 mm Logic: HCMOS Wave Form: Square wave MERCURY Since 1973 H53 5x3.2x1.2 mm is Mercury smallest footprint and lowest profile SMD clock oscillators. Its applications include PDAs, ATM, PCMCOA, networking, laptops, digital camera, wireless LAN and disk and tape drives. Output is

Contextual Info: BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 288 SERIES Compact Wave-Solderable Low-Cost Heat Sinks Standard P/N Height Above PC Board in. mm Maximum Footprint in. (mm) 288-1ABE 1.250 (31.8) 0.875 (22.2) x 0.215 (5.5) Mounting tabs are pre-tinned to ensure excellent wave-solder bond and good

Contextual Info: Temperature Compensated Crystal Oscillators TRUE SINEWAVE SMD 11.4x9.6 mm TCXO/VCTCXO IN LEADLESS PACKAGE - TCLS Series FEATURES RoHS Compliant (Pb-Free), True Sine Wave or Clipped Sine Wave Output Voltage Control Option for Electric Frequency Adjustments

Contextual Info: FREQUENCY CONTROL PRODUCTS HIGH FREQUENCY SMD SINE WAVE VCXO TYPES DFV S7-S / MS SURFACE MOUNT PACKAGE 19.9± 0.1 HIGH FREQUENCIES 1.27 WIDE PULLING RANGE 7.62 12.9± 0.2 SINE WAVE OUTPUT 1.6 1 2 3 4 19.0 PC board footprint 4 3 1 2 1.3 DFV S7-S/MS V control

Contextual Info: VCXO “G534” series 5x3.2 mm Logic: HCMOS Wave Form: Square wave MERCURY Since 1973 G534 5x3.2x1.2 mm is Mercury smallest footprint and lowest profile SMD VCXO. Its applications include phase lock loop, SONET/ATM, set-top boxes, MPEG, audio video modulations, video game consoles and HDTV sets. Output is TTL/CMOS

Contextual Info: Crystal oscillator Product Number please contact us VOLTAGE -CONTROLLED SAW OSCILLATOR (VCSO) LV-PECL: X1M000242xxxxxx Sine wave: X1M000262xxxxxx OUTPUT : LV-PECL, Sine wave LOW-JITTER, LOW PHASE NOISE EV - 9100JG •Frequency range : 800 MHz to 2500 MHz

BWT190

Abstract: Duplexer 15 ghz GSM duplexer BWR240 Philips WLAN WLAN2400 BWD210 umts duplexer BWD190A
Contextual Info: High performance miniature BAW filters and duplexers Bulk Acoustic Wave BAW filters and duplexers for Front-End Modules and Cellular Phones Bulk Acoustic Wave filters provide high performance, ultra small size solutions for next generation integrated cellular

TO-220 footprint

Abstract: Heat Sinks 288-1AB 750 271
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 288 SERIES Compact Wave-Solderable Low-Cost Heat Sinks Standard P/N Height Above PC Board in. mm Maximum Footprint in. (mm) 288-1AB ̆ 1.250 (31.8) 0.875 (22.2) x 0.215 (5.5) Mounting tabs are pre-tinned to ensure excellent wave-solder bond and good