X-GOLD 102 Search Results

AMPOMATOR CLS IV

Abstract: 90274-2 extraction tool tyco
Contextual Info: AMPMODU Interconnection System Mod I Receptacles, Crimp Snap-In Wire Applied , .031 x .062 [0.79 x 1.57] Centerline Material and Finish Copper alloy, plated as follows: Plating A — Selectively plated .000030 [0.00076] gold on contact area, with gold flash over .000050 [0.00127]

Contextual Info: 5 3 4 1 2 Global Connector Technology Ltd. - BD032: 1.27mm PITCH SHROUDED PIN HEADER, DUAL ROW, THROUGH HOLE, VERTICAL 6 7 8 A A B B C C D D Ordering Grid BD032 E XX X XXX X XXXX X N Contact Plating A = Gold Flash All Over B = Selective Gold Flash Contact Area/

K/2531P02H

Contextual Info: 1 4 3 Ordering Information: 2531 P * H ± 1. Plating : 1 ^ 0=Tin plated 100/x’ over 30~50yu” nickel overall U=Gold flash over 30 ~ 50 ¡1' nickel overall X= 10 /Li” gold over 30^ 50 /Li” nickel overall 2. Color options: 00= Color White 13= Color Nature

PE4370

Contextual Info: MATERIALS BODY CONTACT INSULATOR STAINLESS STEEL GOLD PLATED GOLD PLATED PTFE .475.375- .005 THICK X .050 WIDE TAB £ ,250-36 U N S-2A- .065 .223 .481 .625 .1020 2 HOLES MOUNTING HOLES PASTERNACK ENTERPRISES, INC. P.O BOX 16759, IRVINE, CA 92G23 PHONE (949) 261-1920 FAX <949) 261-7451

Contextual Info: 6 APPROVED: DATE:_ TITLE: .591 [15.00] UUUUUUUU 8 7 6 5 4 3 2 1 .728 [1 8 .5 0 ]- > |—— .620 [1 5 .7 5 ]— »- X 1 2 PLATING 15 uin Gold 30 uin Gold SO uin Gold i n ITT .559 [14.20] .450 [11.43] SPECIFICATIONS: Material: .610 [15.50] Insulator: Nylon46, rated UL 94V—0

Contextual Info: REVISION J MCX-J-C-X-ST-CA2 DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] GENDER -J: JACK DO NOT SCALE FROM THIS PRINT TERMINATION -CA2: CABLE RG178 TYPE -C: CABLE ORIENTATION -ST: STRAIGHT PLATING SPECIFICATION -H: HEAVY GOLD 30µ" GOLD CENTER CONTACT,

Contextual Info: REVISION H DO NOT SCALE FROM THIS PRINT MCX-J-C-X-ST-CA2 DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] GENDER -J: JACK TERMINATION -CA2: CABLE RG178 TYPE -C: CABLE H H ORIENTATION -ST: STRAIGHT PLATING SPECIFICATION -H: HEAVY GOLD 30µ" GOLD CENTER CONTACT,

Contextual Info: DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] REVISION L SCP2-10-10-X-XX.XX-XX-XX SIZE -10 END 2 OPTION * -S: SOCKET -T: TERMINAL -BC: BLUNT CUT * -SE: SOCKET EXTENSION POSITIONS -10 PLATING -S: SELECTIVE GOLD USE T-1R31-2024-01-S -F: FLASH SELECTIVE GOLD

PE44226

Contextual Info: BODY CONTACT SUPPORT BEAD MATERIALS PASSIVATED STAINLESS STEEL GOLD PLATED AIR-POLYPHENYLENE OXIDE COMPOSITE .475- .045 ,003 THK, X ’.Oil WIDE M7 X .7 5 -6 G - .010 .050 ,1620 ,1020 4 HOLES MOUNTING HOLES PASTERNACK ENTERPRISES, INC. P.O BOX 16759, IRVINE, CA 92623

622-1041

Abstract: IDC Male Headers 622-1030 622-4041 622-2041 thomas betts 622-1630 622-0641 622-1430 conn w 622-5030
Contextual Info: IDC Systems Female Sockets FEMALE SOCKET CONNECTOR WITH 30µ INCHES GOLD .100" x .100" CENTERS LR92984 E60980 PHYSICAL PROPERTIES INSULATION MATERIAL: Glass filled thermoplastic rated UL 94V-0 COLOR: Blue CONTACTS: Beryllium copper 30µ inches minimum gold over 50µ inches nickel in contact zone;

Contextual Info: 3.96 X 5.08mm GRID PATTERN CR21 SERIES DUAL LINE CONNECTORS General CR21 series are 3.96mm .156 inch centers dual line connectors featuring bifurcated contacts finished by traditional whole gold plating or contemporary selective gold plating. 36, 44, 56, 60, and 72 pin are line-uped with

Contextual Info: Customer Information Sheet DRAWING N o . : H 3 I 8 5 - X X S HE E T 2 OF 2 | IF IN DOUBT - ASK SPECIFICATION: SECTI ON MATERIAL: CONTACT S H E L L : BRASS CONTACT C L I P = B E R Y L L I U M COPPER FINISH: 01 : 4 jj T I N S H E L L , 0. 15ju GOLD C L I P 05 : O . l p GOLD S H E L L , O . I 5 jj GOLD C L I P

MA-405

Abstract: coil 101
Contextual Info: PCB Relay G5A Subminiature Relay 16 x 9.9 x 8.4 mm (L x W x H with DPDT Contact • Unique moving-loop armature reduces relay size, ■ ■ ■ ■ magnetic interference and contact bounce time. Miniature permissible load: 0.01 mA 10 mVDC. Bifurcated gold-clad crossbar contact.

Contextual Info: 4 PART NO. 3 2 1 REVISIONS CA-22SAHS-X-2-3-X-X 38.73±0.15 1.525±.006 2.54 .100 3.86 .152 LTR A DESCRIPTION INITIAL RELEASE SEE DO 5336 DATE C.P. 11-19-03 APPROVED A.J. ORDERING NOMENCLATURE : D 3.70 .146 22SAHS-X-2-3-X-X NUMBER OF CONTACT POS D PLATING A = CONTACT AREA : GOLD FLASH

Contextual Info: 4 PART NO. 3 2 CA-22SAHS-X-2-1-X-X 3.85 .152 38.73±0.15 1.525±.006 2.54 .100 1 REVISIONS LTR A DESCRIPTION INITIAL RELEASE SEE DO 5336 DATE C.P. 11-19-03 APPROVED A.J. ORDERING NOMENCLATURE : D 3.70 .146 22SAHS-X-2-1-X-X NUMBER OF CONTACT POS D PLATING A = CONTACT AREA : GOLD FLASH

Contextual Info: Product Number: 582-11-272-10-005414 Description: BGA Socket .050 Grid; BGA Socket Surface Mount Accepts .015-.022" Leads Plating Code: 11 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 10 µ" Gold over 50 µ" Nickel 272-10-005 20 X 20

Contextual Info: Product Number: 582-11-676-13-005414 Description: BGA Socket .050 Grid; BGA Socket Surface Mount Accepts .015-.022" Leads Plating Code: 11 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 10 µ" Gold over 50 µ" Nickel 676-13-005 26 X 26

Contextual Info: Product Number: 582-11-656-15-005414 Description: BGA Socket .050 Grid; BGA Socket Surface Mount Accepts .015-.022" Leads Plating Code: 11 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 10 µ" Gold over 50 µ" Nickel 656-15-005 30 X 30

Contextual Info: Product Number: 582-11-316-10-005414 Description: BGA Socket .050 Grid; BGA Socket Surface Mount Accepts .015-.022" Leads Plating Code: 11 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 10 µ" Gold over 50 µ" Nickel 316-10-005 20 X 20

582-11-484-13-005414

Contextual Info: Product Number: 582-11-484-13-005414 Description: BGA Socket .050 Grid; BGA Socket Surface Mount Accepts .015-.022" Leads Plating Code: 11 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 10 µ" Gold over 50 µ" Nickel 484-13-005 26 X 26

Contextual Info: Product Number: 582-11-444-13-005414 Description: BGA Socket .050 Grid; BGA Socket Surface Mount Accepts .015-.022" Leads Plating Code: 11 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 10 µ" Gold over 50 µ" Nickel 444-13-005 25 X 25

Contextual Info: Product Number: 582-11-400-10-005414 Description: BGA Socket .050 Grid; BGA Socket Surface Mount Accepts .015-.022" Leads Plating Code: 11 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 10 µ" Gold over 50 µ" Nickel 400-10-005 20 X 20

Contextual Info: Product Number: 582-11-357-09-005414 Description: BGA Socket .050 Grid; BGA Socket Surface Mount Accepts .015-.022" Leads Plating Code: 11 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 10 µ" Gold over 50 µ" Nickel 357-09-005 19 X 19

Contextual Info: Product Number: 582-11-644-15-005414 Description: BGA Socket .050 Grid; BGA Socket Surface Mount Accepts .015-.022" Leads Plating Code: 11 Shell Plating: 10 µ" Gold over 100 µ" Nickel Inner Contact Plating: 10 µ" Gold over 50 µ" Nickel 644-15-005 30 X 30