RB95
Abstract: b30h
Text: 8 7 F A D G M N O P R S T V W X Y Z CONTACT .000015" GOLD .00003" GOLD .00001" GOLD .00003" GOLD .00005" GOLD .00003" GOLD GOLD FLASH .00002" GOLD .00001" GOLD .0001" TIN/LEAD .00003" GOLD GOLD FLASH .00003" GOLD .00003" GOLD .00001" GOLD 4 5 6 PLATING SPECIFICATIONS
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B30HD-A350
B05DHRD
B06DHRD
B09DHRD
B10DHRD
B13DENTIAL
RB95
b30h
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T-1000-1
Abstract: 110A 202
Text: MICROWAVE CHIP RESISTORS MSMW SERIES MECHANICAL DA TA DAT W T L Shown with optional Gold Back SERIES MSMW 110 MSMW 112 MSMW 115 MSMW 118 MSMW 120 MSMW 121 MSMW 122 MSMW 124 L 0.040" 0.050" 0.050" 0.021" 0.100" 0.100" 0.020" 0.150" x x x x x x x x W 0.020"
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125mW
109-C-0698
T-10001F-GB
110AT
150ppm/
T-5R000K-G
T-1000-1
110A 202
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Untitled
Abstract: No abstract text available
Text: NON-MICROWAVE CHIP RESISTORS MSTF SERIES MECHANICAL DA TA DAT W T L Shown with optional Gold Back SERIES MSTF 110 MSTF 112 MSTF 115 MSTF 118 MSTF 120 MSTF 121 MSTF 122 MSTF 124 L 0.037" 0.050" 0.050" 0.021" 0.100" 0.100" 0.020" 0.150" x x x x x x x x W 0.017"
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10ppm/
100ppm/
141-B-0404
110AN-10001F-GB
25ppm/
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Infineon X-GOLD 110
Abstract: Infineon X-GOLD 618 infineon x-gold xmm 6180 X-GOLD 618 MIPI CSI-2 Parallel X-GOLD 110 smarti UE MIPI csi-2 MIPI csi
Text: Product Brief X-GOLD 618 TM Cost efficient HSPA Baseband for Multimedia enabled Cellular Phones Main Features THE Infineon X-GOLD 618 is a cellular system on chip comprising the 2G/3G digital and analog baseband and the power management functions monolithically integrated in 65nm CMOS technology. It is Infineon’s 3rd
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384kbps
MSC33
B153-H9353-G1-X-7600
NB09-1000
Infineon X-GOLD 110
Infineon X-GOLD 618
infineon x-gold
xmm 6180
X-GOLD 618
MIPI CSI-2 Parallel
X-GOLD 110
smarti UE
MIPI csi-2
MIPI csi
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Untitled
Abstract: No abstract text available
Text: NON-MICROWAVE CHIP RESISTORS MSTF SERIES MECHANICAL DA TA DAT W T Shown with optional Gold Back x x x x x x x x x W 0.010" 0.017" 0.050" 0.025" 0.017" 0.050" 0.100" 0.016" 0.085" x x x x x x x x x T 0.010" 0.010" 0.010" 0.010" 0.010" 0.010" 0.010" 0.010" 0.010"
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20Kant
10ppm/
100ppm/
141-C-0306
110AN-10001F-GB
25ppm/
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Untitled
Abstract: No abstract text available
Text: NON-MICROWAVE CHIP RESISTORS MSTF SERIES MECHANICAL DA TA DAT W T Shown with optional Gold Back x x x x x x x x x W 0.010" 0.017" 0.050" 0.025" 0.017" 0.050" 0.100" 0.016" 0.085" x x x x x x x x x T 0.010" 0.010" 0.010" 0.010" 0.010" 0.010" 0.010" 0.010" 0.010"
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141-C-0306
110AN-10001F-GB
10ppm/Â
100ppm/Â
25ppm/Â
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relay omron G2E
Abstract: G2E-184P-M-US omron g2e G2E-184P-M G2E-184P-H-M G2E-184P-H-M-US G2E-134P-H-M-US omron G2E-184p G2E184PHM E41515
Text: PCB Relay G2E Miniature, Single-pole PCB Relay Miniature: 15.5 x 10.5 x 11.5 mm W x L x H . Low power consumption: 200 mW. Bifurcated crossbar contacts available. Gold-clad contacts. Ideal for telecommunications equipment and security systems. Ordering Information
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G2E-184P-M
G2E-184P-H-M
G2E-184P-M
G2E-184P-H-M
110-VAC
relay omron G2E
G2E-184P-M-US
omron g2e
G2E-184P-H-M-US
G2E-134P-H-M-US
omron G2E-184p
G2E184PHM
E41515
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Untitled
Abstract: No abstract text available
Text: High Power Chipled EOC20IRH 100 AG Preliminary Data Chip-LED Features - Circuit substrate-glass laminated epoxy - Directive characteristic 110° - Dimension: 3.2 L x 2.8 (W) x 1,6 (H) mm3 - Soldering pads: gold plated, all soldering methods applicable - Infrared GaAlAs (870nm)
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EOC20IRH
870nm)
EN60825)
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G2E-184P-M-US
Abstract: E41515 G2E-134P-H-M-US G2E-184P-H-M-US G2E-134P-M-US g2e184pmusdc G2E-184P-M-US12VDC
Text: Back PCB Relay G2E Miniature, Low-cost, Single-pole PCB Relay Miniature: 15.5 x 10.5 x 11.5 mm L x W x H . Low power consumption: 200 mW. Bifurcated crossbar contacts. Gold-clad contacts. Plastic-sealed type available. Ideal for telecommunications equipment and
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G2E-184P-M-US
G2E-184P-H-M-US
G2E-134P-M-US
G2E-134P-H-M-US
G2E-184P-M-US
110-VAC
K06-E1-9C
E41515
G2E-134P-H-M-US
G2E-184P-H-M-US
G2E-134P-M-US
g2e184pmusdc
G2E-184P-M-US12VDC
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Untitled
Abstract: No abstract text available
Text: REVISION E SMA-J-C-X-ST-SR2 DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] GENDER -J: JACK DO NOT SCALE FROM THIS PRINT TERMINATION -SR2: SEALED REVERSE POLARITY BULKHEAD RG178 TYPE -C: CABLE ORIENTATION -ST: STRAIGHT PLATING SPECIFICATION E -H: HEAVY GOLD / FLASH GOLD
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RG178)
RG178-
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G2E-184P-M-US
Abstract: G2E-134P-H-M-US Crossbar contact E41515 G2E-134P-M-US relay omron G2E AT-110 G2E-184P-H-M mw 137 G2E-184P-H-M-US
Text: PCB Relay G2E Miniature, Low-cost, Single-pole PCB Relay Miniature: 15.5 x 10.5 x 11.5 mm L x W x H . Low power consumption: 200 mW. Bifurcated crossbar contacts. Gold-clad contacts. Plastic-sealed type available. Ideal for telecommunications equipment and
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G2E-184P-M-US
G2E-184P-H-M-US
G2E-134P-M-US
G2E-134P-H-M-US
G2E-184P-M-US
110-VAC
K06-E1-9C
G2E-134P-H-M-US
Crossbar contact
E41515
G2E-134P-M-US
relay omron G2E
AT-110
G2E-184P-H-M
mw 137
G2E-184P-H-M-US
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Untitled
Abstract: No abstract text available
Text: CATALOG 126 backup:CATALOG 126.qxd 3/29/2011 11:09 AM ELECTRONICS & TECHNOLOGY, INC. Page 64 Vectorbord Plugbordtm 8801-1 S-100 Bus 10.50”H x 5.3”L x .062” TH Plugbord 0.100” grid on 0.42” diameter holes. Gold-plated edge contacts only. Bare prototyping board allows unrestricted component placement. 100 gold-plated edge contacts 50 on
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S-100
16-Pin
R681-3
R681-2
CCK100
R656-1
R656-2
CCK13
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CED-61108-02A-2-GDXX
Abstract: No abstract text available
Text: 1 2 3 4 5 6 7 8 9 A A B B C C D D E F SPECIFICATIONS Contact material: Lock link material: Series CED DIN41612 Brass, gold plated Brass, nickel plated Type Gender Dimension øA Plating Options 61108 02A X GDXX Power contact 02A=Straight female, 2=ø2.85mm .110” , 20 amps GD=Gold flash
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DIN41612
CED-61108-02A-2-GDXX
CED-61108-02A-2-GDXX
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E41515
Abstract: G5A-234P G5AU-234P
Text: Back PCB Relay G5A Subminiature Relay 16 x 9.9 x 8.4 mm (L x W x H with DPDT Contact Unique moving-loop armature reduces relay size, magnetic interference and contact bounce time. Miniature permissible load: 0.01 mA 10 mVDC. Bifurcated gold-clad crossbar contact.
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54-mm
G5A-234P
G5AU-234P
G5AK-234P
G5A-234P
K19-E1-4C
E41515
G5AU-234P
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Untitled
Abstract: No abstract text available
Text: REVISION C GRFS-P-C-X-ST-CA2 DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] GENDER -P: PLUG DO NOT SCALE FROM THIS PRINT TERMINATION -CA2: RG-178 CABLE TYPE -C: CABLE ORIENTATION -ST: STRAIGHT PLATING SPECIFICATION -H: 30µ" GOLD CENTER CONTACT, 3µ" GOLD OUTER CONTACT
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RG-178
CO-HD-WI-3040-M.
RG178
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Untitled
Abstract: No abstract text available
Text: .156" 3.96mm Series 179 Right Angle Connector .156 (3.96) Centers Card Edge Tuning Fork Contacts PART NUMBER CODING 1 79- X X X - X X CONTACT PLATING CONTACT SURFACE AND TERMINATION 30 = .000010 GOLD OVERALL 32 = 000020 GOLD OVERALL ALL GOLD PLATED OVER .000050
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X79-XX3-XX
X79-XX4-XX
X79-XX5-XX
X79-XX6-XX
X79-XX7-XX
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10-Resistors
Abstract: No abstract text available
Text: THIN FILM MULTI TAP RESISTORS 117 SERIES MECHANICAL DATA .030" SIZE SUBSTRATE RESISTOR BONDING PADS BACKSIDE SURFACE .030" x .030" x .010" ± .0 03" SILICON TANTALUM NITRIDE 25,000 À MINIMUM GOLD; ALUMINUM OPTIONAL BARE SUBSTRATE GOLD BACK OPTIONAL ELECTRICAL DATA
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150ppm/
-30dB
100mW
125-11000K-0001
10-Resistors
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PE44433
Abstract: No abstract text available
Text: BODY CONTACT INSULATOR MATERIALS STAINLESS STEEL GOLD PLATED GOLD PLATED PTFE 1100 ,0930 2 PLACES MOUNTING HOLES PASTERNACK ENTERPRISES, INC, P.O B O X 16759, IRVINE, C A 92623 P H O N E (949) 261-1920 F A X <949) 261-7451 W E B A D D R E S S : w w w .p asternackxo m
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PE44433
PE44433
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FA324
Abstract: No abstract text available
Text: Com bo D - C o a x ia l/75 Ohm Right Angle Receptacle for PC B Mounting for PC Board Thickness Up to .125 [3.18] 75 Ohm Impedance Contact Finish Compliant Boardlock Gold Over Ni No Gold Over Ni Yes 30/i in. Gold No 30/i in. Gold Yes DE-5W1 DEMP5C1SJA197
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DEMP5C1SJA197
DEMC5C1SJA197
DEMP5C1SJK126
DAMP7C2SJA197
DAMC7C2SJA197
DAMP7C2SJK126
DAMC7C2SJK126
DAMP11C1SJK126
DAMC11C1SJK126
DAMP11C1SJA197
FA324
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Untitled
Abstract: No abstract text available
Text: DIP Sockets E L E C T R O N I C S DISK M cKenzie Socket Division Open and Closed Frame DIP Sockets EXTRA LONG SOLDER TAILS 'h _ '^ 4 'S fes f c ; .116 2,95 P n U 1 H , I .183 (4,65) .020— 1 (0,51) TYP Specify . . x x x I Contact/Shell 091B 30p" Gold/10p" Gold
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Gold/10p"
Gold/200
/Tin/200
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J708
Abstract: 2X3-16 99 LM4
Text: PART NO. QQg n to .M Scries No.- X X & Q _ l - Tail Type SA: Slot 1KT D: No Kink No Of Pins- 02: 2 Pnlr Kinks Contort.- 04-: 4 P a ir Kinks • Gold Plating B! B ra ss P: Phosphor Bronze 01: Cold Flash Rating- 10: IQ u ' Gold
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UL94V-0
2XZ5-50
2X55-110
2X26-52
2X56-112
2X29-58
2X59-116
S00D07001
J708
2X3-16
99 LM4
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WTS 1.7 IC 28 PIN
Abstract: WTS 1.7 IC
Text: PRELIMINARY M IC R O N I 4 MEG X 36, 8 MEG 4 MEG DRAM MODULE X X M T12D 436 18 DRAM M OD ULE 36, 8 MEG X 18 FAST PAGE MODE FEATURES PIN ASSIGNMENT Top View OPTIONS M T 1 2 D 4 3 6 D M /G m r r n m r rm m T m SIMM SIM M (gold) SIM M low profile SIM M (gold) low profile
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72-pin
048-cycle
DE-14)
DE-18)
MT12D436
A0-A10
T12D436
WTS 1.7 IC 28 PIN
WTS 1.7 IC
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Untitled
Abstract: No abstract text available
Text: 2I3 LEADED PRODUCT NUMBER RoHs COMPATIBLE PRODUCT NUMBER 5 4 1 1 1- X X X X X X X X X LF _ JR PLATING C_ = 0.76pm GOLD/GXT ON CONTACT AREA 2pm MIN MAHE TIN ON TAIL OVER 1.27pm Ni MIN INDICATES THE PRODUCT IS RoHS COMPATIBLE, NOTE 8 -TOTAL NB OF POSITIONS
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UL94V-0
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Untitled
Abstract: No abstract text available
Text: r 1 LEADED PRODUCT NUMBER RoHs COMPATIBLE PRODUCT NUMBER 5 4 1 2 2 —X X X X X X X X X X LF PLATING _ r _ R : RETENTIVE LEG NOTE 8 8 = 0.38pm GOLD/GXT ON CONTACT AREA 2pm MIN MATTE TIN ON TAIL OVER 1.27pm Ni MIN .STACK HEIGHT, NOTE 6 -TOTAL NB OE POSITIONS
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UL94V-0
S-14-92G
76/jm
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