X-GOLD 116 Search Results

Contextual Info: .156" 3.96mm Series 179 Right Angle Connector .156 (3.96) Centers Card Edge Tuning Fork Contacts PART NUMBER CODING 1 79- X X X - X X CONTACT PLATING CONTACT SURFACE AND TERMINATION 30 = .000010 GOLD OVERALL 32 = 000020 GOLD OVERALL ALL GOLD PLATED OVER .000050

Contextual Info: THIN FILM MULTI TAP RESISTORS 116 SERIES LOG RESISTOR MECHANICAL DATA .060" x . 020" X .010" + .0 0 3 " SILICON OR ALUMINA TANTALUM NITRIDE 25,000 A MINIMUM GOLD BARE SUBSTRATE GOLD BACK OPTIONAL SIZE SUBSTRATE RESISTOR BONDING PADS BACKSIDE SURFACE ELECTRICAL DATA

Contextual Info: DIP Sockets E L E C T R O N I C S DISK M cKenzie Socket Division Open and Closed Frame DIP Sockets EXTRA LONG SOLDER TAILS 'h _ '^ 4 'S fes f c ; .116 2,95 P n U 1 H , I .183 (4,65) .020— 1 (0,51) TYP Specify . . x x x I Contact/Shell 091B 30p" Gold/10p" Gold

J708

Abstract: 2X3-16 99 LM4
Contextual Info: PART NO. QQg n to .M Scries No.- X X & Q _ l - Tail Type SA: Slot 1KT D: No Kink No Of Pins- 02: 2 Pnlr Kinks Contort.- 04-: 4 P a ir Kinks • Gold Plating B! B ra ss P: Phosphor Bronze 01: Cold Flash Rating- 10: IQ u ' Gold

Contextual Info: THIN FILM MULTI-TAP RESISTORS MSMT 116 SERIES LOG RESISTOR MECHANICAL DA TA DAT Rmax. SIZE SUBSTRA TE SUBSTRATE RESISTOR BOND PADS BACKSIDE SURFACE 0.060" x 0.020" x 0.010" ±0.003" SILICON OR ALUMINA TANT ALUM NITRIDE ANTALUM 25,000 Å MINIMUM GOLD BARE SUBSTRA

Contextual Info: Customer Information Sheet DRAWING N o .: SHEET M80-882XXXX 2 OF 2 I If IN D OUBT M80-882XXXX FIN IS 22 45 42 H : : : O F WAY S 1 7 . 22 : -S E L E C T I V E GOLD GOLD S E L E C T I V E GOLD ♦ TIN/LEAD / I00X TIN | | •2.00 x No.

Mini-Systems

Contextual Info: THIN FILM MULTI-TAP RESISTORS MSMT 116 SERIES LOG RESISTOR MECHANICAL DA TA DAT SIZE SUBSTRA TE SUBSTRATE RESISTOR BOND PADS BACKSIDE SURFACE 0.060" x 0.020" x 0.010" ±0.003" SILICON OR ALUMINA TANT ALUM NITRIDE ANTALUM 25,000 Å MINIMUM GOLD BARE SUBSTRA

Contextual Info: NOTES: 1. MATERIALS AND FINISHES: BODY - BRASS, GOLD PLATING CONTACT - BERYLLIUM COPPER, GOLD PLATING INSULATOR - TEFLON 2. ELECTRICAL: A. IMPEDANCE: 50 OHM B. DIELECTRIC WITHSTANDING VOLTAGE: 1000 VRMS, 3. MECHANICAL: A. DURABILITY: 500 CYCLES MIN. B. TEMPERATURE RANGE: - 65'C to + 1 6 5 X

Ab00

Contextual Info: REV ORDER INFORMATION A 288 90 XX XX X APP. ECN NO. DATE NEW DESIGN Plating: 2: Selective Gold 3: All Gold No. Of Contact 08 ~ 80 Pin Chart SPECIFICATION -Type * Current Rating: 1A * Withstanding Voltage: 500 VAC (1 min.) Insulation Resistance: * 1000 Megohms MIN.

622-0641

Abstract: 622-3041 622-1430
Contextual Info: IDC Systems Female Sockets FEMALE SOCKET CONNECTOR WITH 30µ INCHES GOLD .100" x .100" CENTERS LR92984 E60980 PHYSICAL PROPERTIES INSULATION MATERIAL: Glass filled thermoplastic rated UL 94V-0 COLOR: Blue CONTACTS: Beryllium copper 30µ inches minimum gold over 50µ inches nickel in contact zone;

Contextual Info: IDC Systems Female Sockets FEMALE SOCKET CONNECTOR WITH 15µ INCHES GOLD .100" x .100" CENTERS LR92984 E60980 PHYSICAL PROPERTIES INSULATION MATERIAL: Glass filled thermoplastic rated UL 94V-0 COLOR: Black CONTACTS: Phosphor bronze 15µ inches minimum gold over 50µ inches nickel in contact zone;

Contextual Info: REV A APP. ECN NO. NEW DESIGN ORDER INFORMATION 288 84 XX XX X H - Plating: 2: Selective Gold 3: All Gold No. Of Contact 08 ~ 80 Pin Chart 00: B:0.9 01: B:1.3 SPECIFICATION * Current Rating: 1 A * Withstanding Voltage: 500 VAC ( 1 min. ) * Insulation Resistance:

C2888

Contextual Info: REV ECN NO. APP. NEW DESIGN A ORDER INFORMATION 288 84 XX XX X H - Plating: 2: Selective Gold 3: All Gold No. Of Contact 08 ~ 80 Pin Chart 00: B:0.9 01: B:1.3 SPECIFICATION * Current Rating: 1 A * Withstanding Voltage: 500 VAC ( 1 min. ) * Insulation Resistance:

Contextual Info: REV A ORDER INFORMATION APP. ECN NO. NEW DESIGN DATE 288 90 XX XX X I _ Plating: 2: Selective Gold 3: All Gold No. O f Contact 08 ~ 80 Pin Chart 0.7 SPECIFICATION -Type * Current Rating: 1A * Withstanding Voltage: 4-.0±0.20 500 VAC (1 m in.) o Insulation Resistance:

12MM

Abstract: HDAM-15-12 C12C10 c12 assembly instruction
Contextual Info: REVISION A HDAM-XX-XX.X-X-13-X-X "D" REF PIN 11A (13 ROW PER POSITION) -11 -15 -23 3.25 .128 (REF) DO NOT SCALE FROM THIS PRINT 22.50 .886 (REF) LEAD STYLE -12.0: 12MM -17.0: 17MM CL No OF ROWS -13 PLATING SPECIFICATION -S: SELECTIVE, .000030 INCHES GOLD IN MATING AREA,

Transistor S 40443

Contextual Info: bbS3T31 0024T37 flOO « A P X Philips Semiconductors NPN 7 GHz wideband transistor £ BFG197; BFG197/X; BFG197/XR AMER PHILIPS/ DIS CRETE FEATURES Product specification b?E D PINNING PIN • High power gain • Low noise figure • Gold metallization ensures

transistor vc 548

Abstract: transistor C 548 B Philips
Contextual Info: bbSBTBl DDSMflDT Tb5 « A P X P hilips Sem iconductors NPN 12 GHz wideband transistor BFG33; BFG33/X N AUER PHILIPS/DISCRETE FEATURES Product specification b7E J> PINNING PIN • High power gain • Low noise figure • Gold metallization ensures excellent reliability.

Contextual Info: UG78D6646JG Data sheets can be downloaded at www.unigen.com 64M Bytes 8M x 64 bits SYNCHRONOUS DRAM MODULE 184 Pin DDR SDRAM Unbuffered DIMM based on 4 pcs 8M x 16 DDR SDRAM 4K Refresh FEATURES • • PART IDENTIFICATION SDRAM PACKAGE PLATING 4K TSOP Gold

609-F161M

Contextual Info: IDC Systems Female Sockets FEMALE SOCKET CONNECTOR .100" x .200" .100" x .300" CENTERS LR92984 E60980 PHYSICAL PROPERTIES INSULATION MATERIAL: Glass reinforced thermoplastic, rated UL 94V-0 COLOR: Blue CONTACT MATERIAL: Beryllium copper with 30µ inches min. gold over 50µ inches min. nickel in contact

Contextual Info: APP. REV ECN NO. A NEW DESIGN CUSTOMER COPY DATE ORDER INFORMATION 188 66 XX XX X n n n n n n n n • Plating: 2: Selective Gold 3: All Gold No. Of Contact 0 8 ~ u u u u u u u u 2.0±0.10 80 Chart — 0.50±0.05 Type 2.00*(NO OF CONTACTS/2-1) ±0.25 4.0±0.20

thv8

Abstract: HYB39S16800T 16m x 4 hyb
Contextual Info: SIEMENS SIMM-Modules Product View S IM M -M odules Product View SIMM-Modules non-parity 2M X 32 FPM EDO FPM G = Gold leaded Semiconductor Group 26 EDO SIEMENS SIMM-Modules Product View 4M x 3 2 8M FPM EDO 32 FPM L-SIM-72-12 HYM 324020S/GS X EDO L-SIM-72-15

Contextual Info: REVISION B SEE NOTE 2 DO NOT SCALE FROM THIS PRINT SPM-05-X-X-XXX-PF DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] OPTION -PF: PANEL FLANGE No OF POSITIONS -05 1.78 .070 REF PLATING SPECIFICATION -S: SELECTIVE, .000030 GOLD ON POST, TIN ON TAIL OR-112-01 TERMINATION

Contextual Info: REVISION C SEE NOTE 2 SPM-05-X-X-XXX-PF DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] DO NOT SCALE FROM THIS PRINT OPTION -PF: PANEL FLANGE No OF POSITIONS -05 1.78 .070 REF PLATING SPECIFICATION -S: SELECTIVE, .000030 GOLD ON POST, TIN ON TAIL OR-112-01 TERMINATION

SPM-05-S-B-VT1-PF

Contextual Info: REVISION D SEE NOTE 2 SPM-05-X-X-XXX-PF DESIGNED & DIMENSIONED IN MILLIMETERS[INCHES] OPTION -PF: PANEL FLANGE No OF POSITIONS -05 1.78 .070 REF DO NOT SCALE FROM THIS PRINT PLATING SPECIFICATION -S: SELECTIVE, .000030 GOLD ON POST, TIN ON TAIL OR-112-01 TERMINATION