XC3042 PC84 Search Results

XC2064

Abstract: XC3030A xc3142 PP175 Xilinx XC3090 xc2064 fpga xact xc3090 XC3190 Xilinx XC3090A X04008
Contextual Info: Component Availability Pins 44 Type Plastic PLCC Plastic DIP Plastic VQFP Plastic PLCC Ceramic PGA Plastic PLCC Ceramic PGA Plastic PQFP Plastic TQFP Code PC44 PD48 VQ64 PC 68 PG68 PC84 PG84 PQ100 TQ100 ✓ ✓ ✓ ✓ ✓ ✓ XC2064 48 64 68 XC2O10 ✓ ✓

XC3030

Abstract: XC3042 XC3030-70PC XC3020 XC3030-100 XC3000 XC3000A XC3064 XC3090 XC3100
Contextual Info: IMPORTANT NOTICE  All new designs should use XC3000A. Information on XC3000 is presented here as a reference for existing designs. XC3000 bitstreams are upward compatible to XC3000A without modification. XC3000 Logic Cell Array Family Product Specification

M3P1

Abstract: KD 2107 X3032
Contextual Info: XC3000, XC3000A, XC3000L, XC3100, XC3100A Logic Cell Array Families £ Product Description Features • Complete XACT Development System - Schematic capture, automatic place and route - Logic and timing simulation - Interactive design editor for design optimization

Contextual Info: IM P O R T A N T N O TIC E All new designs should use XC3000A or XC3100A. Information on XC3000 and XC3100 is presented here as reference for existing designs. £ x il in x XC3000, XC3000A, XC3000L, XC3100, XC3100A Logic Cell Array Families Product Description

OF4199

Abstract: 3195A C3000 XC3000 XC3000A XC3000L XC31 XC3100 XC3100A XC3195
Contextual Info:  XC3000 Logic Cell Array Families Table of Contents Overview . 2-104 XC3000, XC3000A, XC3000L, XC3100, XC3100A Logic Cell Array Families . 2-105 Architecture . 2-106

XC3300

Contextual Info: K , XC3000 Logic Cell Array Family :v Product Specification D e sc rip tio n F eatu res Industry-leading FPGA family with five device types - Logic densities from 1,000 to 6,000 gates - Up to 144 user-definable l/Os XC3000 is the original family of devices in the XC3000

Contextual Info: XC3000 Logic Celi “Array Family Product Specification FEATURES The LCA user logic functions and interconnections are determined by the configuration program data stored in internal static memory cells. The program can be loaded in any of several modes to accommodate various system

diagram transistor tt 2140

Abstract: JCA Technology low noise amplifier 3195A Xilinx XC3090 transistor A6I Transistor TT 2140 3164A equivalent for transistor tt 2146
Contextual Info: _ XC3000, XC3000A, XC3000L, XC3100, XC3100A Logic Cell Array Families Product Description F e a tu re s • Complete XACT Development System - Schematic capture, automatic place and route - Logic and timing simulation - Interactive design editor for design optimization

Contextual Info: IMPORTANT NOTICE All new designs should use XC3000A or XC3100A. Information on XC3000 and XC3100 is presented here as reference for existing designs. IIX IL IN X ’ XC3000, XC3000A, XC3000L, XC3100, XC3100A Logic Cell Array Families Product Description F eatu res

XC2064

Abstract: XC2018 PC84 XC3030A XC3064 XC2018 XC3020 XC3020A XC3030 XC3042 XC3090
Contextual Info: 44 10 ◆ = New since last issue of XCELL 48 64 68 84 100 120 132 144 156 160 164 175 176 184 191 196 208 223 225 228 240 299 304 PLASTIC LCC PLASTIC QFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA

Denso L 918 8

Abstract: Denso L 918 P-PGA-132 MQFP-208 XC4000 XC4000E XC5000 XC1765D 145C XC1700D
Contextual Info: The Reliability Data Program October 1, 1996 Expanded Version Index • • • • • • HTOL High Temperature Operating Life . 85/85 (Bias Moisture Life). PCT (Unbiased Pressure Pot).

1736a

Abstract: xc1736 die
Contextual Info: XC3000 Logic CeU Array Family Product Specification FEATURES The LCA user logic functions and interconnections are determined by the configuration program data stored in internal static memory cells. The program can be loaded in any of several modes to accommodate various system

XC2064

Abstract: XC3030 XC2018 XC3020 XC3020A XC3030A XC3042 XC3064 XC3090 xc5204
Contextual Info: 10 44 48 64 68 84 100 120 132 144 156 160 164 175 176 184 191 196 208 223 225 228 240 299 304 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA CERAMIC QFP PLASTIC PQFP

306E-09

Abstract: MQFP-208 XC7000 XC4005E PHYSICAL HT 208 X9500 XC1700D XC2000 XC4000E XC5000
Contextual Info: Reliability Testing Summary High Temperature Life Test Qualification & Monitor Combined Technology: Device Type: Package Type: Actual Temperature Actual Voltage: Assumed Activation Energy: XC1700D Period: 26 Combined Started Lot: 26 Combined Completed Lots:

xilinx XC3000 Architecture

Abstract: CB100 Xilinx XC3090 PG68 Xilinx XC3090A XC2064 fpga programming XC2000 Xilinx XC3030A
Contextual Info: A Technical Overview For the First-Time User In the XC2000, XC3000, and XC4000 devices, Xilinx offers three evolutionary and compatible generations of Field Programmable Gate Arrays FPGAs . Here is a short description of their common features. Every Xilinx FPGA performs the function of a custom LSI

XC2018 PC84

Abstract: xc4300 XC4020 HQFP208 HQFP34 XC1765D XC3342 XC4305 XC4005E PHYSICAL XC500 356E-09
Contextual Info: The Reliability Data Program Expanded Version April 1, 1998 Cover TABLE OF CONTENTS Introduction .3 The Reliability Program. .3

PC84

Abstract: TQ100 VQ100 XC2000 XC3000A XC3000L XC3030 XC3042 XC3100 XC3100A
Contextual Info: 2 XCELL Please direct all inquiries, comments and submissions to: Editor: Bradly Fawcett Xilinx, Inc. 2100 Logic Drive San Jose, CA 95124 Phone: 408-879-5097 FAX: 408-879-4676 E-Mail: brad.fawcett@xilinx.com 1996 Xilinx Inc. All rights reserved. XCELL is published quarterly for

A9701

Abstract: MIL-PRF38535 XC1700D XC7000 XC9500 xc4310 XC3390A vqfp100 package XC95XX XCS40 failure
Contextual Info: The Reliability Data Program Expanded Version Jan. 1, 1999 Cover P1 TABLE OF CONTENTS Introduction .… 4 The Reliability Program. .… 4

XcxxX

Abstract: vqfp100 package PQFP160 XILINX mp8000ch4 marking 611 016 soic-8 XCS40 failure Xcs17 xc95144 XC95144 equivalent
Contextual Info: The Reliability Data Program Expanded Version April. 1, 1999 Cover P1 TABLE OF CONTENTS Introduction .… 4 The Reliability Program. .… 4

MO-83-AF

Abstract: PQFP moisture sensitive handling and packaging footprint jedec MS-026 TQFP schematic impulse sealer BGA 11x11 junction to board thermal resistance EIA standards 481 JEDEC MS-026 footprint eftec 64 EFTEC-64 footprint jedec MS-026 TQFP 128
Contextual Info: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336

PCB footprint cqfp 132

Abstract: schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318
Contextual Info: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336

footprint jedec MS-026 TQFP 128

Abstract: schematic impulse sealer footprint jedec MS-026 TQFP JEDEC Package Code MS-026-AED BGA 11x11 junction to board thermal resistance QFP Package 128 lead .5mm .65mm bga land pattern MS-026-BGA Shipping Trays 16x16 XC4010E-PQ208
Contextual Info: Packages and Thermal Characteristics  June 1, 1996 Version 1.1 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336

footprint pga 84

Abstract: footprint plcc 208 footprint pga 208 XC7000 XILINX XC4008E PC84 PQ100 TQ100 XC3030 XC3042
Contextual Info: APPLICATION BRIEF  XBRF 004 November 19, 1996 Version 1.1 PLDs, Pins, and PCBs: The Importance of Pin-Locking and Footprint Compatibility Application Brief Summary The ability to maintain fixed I/O pin locations during PLD design and to migrate designs between footprint-compatible PLDs

121C-2

Abstract: XC1765D XC95108 XL mp8000ch4 p103 pot datasheet reliability report PQFP240 XC95xxx 17256d D1 PGA 478
Contextual Info: The Reliability Data Program Expanded Version Jan. 1, 2000 Cover P1 TABLE OF CONTENTS Introduction .…4 The Reliability Program. .…4