DNDA
Abstract: No abstract text available
Text: 1.0 m Process Family: XDH10 Modular 1.0μm 650V Trench Insulated BCD Process DESCRIPTION XDH10 is X-Fab´s dielectric trench insulated smart power technology. Main target applications are analog switch ICs, driver ICs for capacitive, inductive and resistive loads and EL / piezo driver ICs for
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XDH10
XDH10
DNDA
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nd65d
Abstract: nd35b nd65c PMOS XDH10
Text: 1.0 µm BCD Process XDH10 MIXED-SIGNAL FOUNDRY EXPERTS Modular 1.0µm 650V Trench Insulated BCD Process Thick SOI material together with area efficient deep trench insulation allows the design of plenty of silicon islands separated by dielectrical insulation deep enough to construct vertical devices up to 650V.
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XDH10
XDH10
nd65d
nd35b
nd65c
PMOS
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"X-Fab" Core cell library
Abstract: nd65d RM3 transistors XDH10 analog devices transistor tutorials pnp transistor 650v mos rm3 data 20 PHB zener MOS RM3 nd35b
Text: 1.0 µm BCD Process XDH10 MIXED-SIGNAL FOUNDRY EXPERTS Modular 1.0µm 650V Trench Insulated BCD Process Description XDH10 is X-Fab´s dielectric trench insulated smart power technology. Main target applications are analog switch ICs, driver ICs for capacitive, inductive and resistive loads and EL / piezo driver ICs for
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XDH10
XDH10
"X-Fab" Core cell library
nd65d
RM3 transistors
analog devices transistor tutorials
pnp transistor 650v
mos rm3 data
20 PHB zener
MOS RM3
nd35b
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zener diode phc 24
Abstract: 350v ZENER DIODE -20/zener diode phc 24
Text: 1.0 µm BCD Process XDM10 MIXED-SIGNAL FOUNDRY EXPERTS Modular 1.0µm 350V Trench Insulated BCD Process Description Key Features XDM10 is X-Fab´s dielectric trench insulated smart power technology. Main target applications are analog switch ICs, driver ICs for capacitive, inductive and resistive loads and EL / piezo driver ICs for
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XDM10
XDM10
zener diode phc 24
350v ZENER DIODE
-20/zener diode phc 24
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