XC95XX
Abstract: BGA95 sb 1240
Contextual Info: 1.400" Top View 0.100" 1.350" 1.350" 1.240" 0.5mm Pitch Relative Orientations BGA Pin A1 Side View 1 QFP Pin 1 0.477" 3 0.6" Assembled 2 0.293" Removable Alignment Pins Description: PACKAGE CONVERTER 208 position PQFP to 352 position BGA. Altera Max 9320 to Xilinx XC95XX.
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xc95xxfr4/g10finish10dc-qfp/bga-95xx-s-b-01+2bga95sb 1240
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XCR3032XL-10PC44C
Abstract: 7VQ44C XCR3064XL-10CS48C TQFP 256 XCR3064XL HQFP 208 XCR3128XL-10VQ100C
Contextual Info: Xilinx FPGAs XC4000EX/XL/XLA/XV FPGAs Continued FPGA Package Options and User I/O PLCC IOBs XC4005XL 112 XC4010XL 160 XC4013XLA 192 XC4020XLA 224 XC4028EX 256 XC4036EX 288 XC4028XLA 256 XC4036XLA 288 XC4044XLA 320 84 61 61 Ñ Ñ Ñ Ñ Ñ Ñ Ñ 100 160 208
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xc4000ex/xl/xla/xvxc4005xlxc4010xlxc4013xla+13xc4020xlaxc4028exxc4036exxc4028xlaxc4036xlaxc4044xlaxcr3032xl-10pc44c7vq44cxcr3064xl-10cs48ctqfp 256xcr3064xlhqfp 208xcr3128xl-10vq100c
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PQFP160 XILINX
Abstract: XC9536-44 plcc44 pinout numbers XC9500 pinout tas t23 Fuse n25 PLCC44 pinout PLCC84 package VQFP44 package XC9500 Family
Contextual Info: XILINX PROGRAMMER QUALIFICATION SPECIFICATION XC9500 FAMILY Introduction This document pertains to the following devices and packages: device addresses are contained on the included Add.dat floppy disk. Signature String 9536 - PLCC44, CSP48, and VQFP44 9572 - PLCC44, PLCC84, PQFP100,
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xc9500plcc44csp48vqfp44+13plcc84pqfp100tqfp100pqfp160 xilinxxc9536-44plcc44 pinout numbersxc9500 pinouttas t23fuse n25plcc44 pinoutplcc84 packagevqfp44 packagexc9500 family
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BGA PACKAGE thermal profile
Abstract: 225-pin BGA X3365 fine BGA thermal profile XC73108 TEXTOOL zif capacitance in BGA package
Contextual Info: Ball Grid Array Packaging The Cost Effective, High Density EPLD Solution November 1993 White Paper Introduction profile than conventional PQFPs 1.9 mm versus 3.7 mm which makes the package ideal for high pin count portable applications. The ball grid array (BGA) package is the latest in a series
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xc73108bga package thermal profile225-pin bgax3365+3fine bga thermal profiletextool zifcapacitance in bga package
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proteus
Abstract: HQFP 208 pbga 144 XC4036XLA-HQ240 R4036XLA-I-160H xc4036xl-hq240i XC4013XL-PQ240C XC4013XL-HT176C xc4013xla-pq208c xc4036xlahq208
Contextual Info: FPGA Replacement for 3.3-Volt Xilinx Products Introduction Proteus is a Chip Express FPGA • replacement program. In its initial release, supplies Proteus is available as a 5-volt product family serving the needs of specific Xilinx 4000E/EX devices and a Proteus 3.3-volt
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4000e/ex4000xl/xla1-800-95chipxproteus+9hqfp 208pbga 144xc4036xla-hq240r4036xla-i-160hxc4036xl-hq240ixc4013xl-pq240cxc4013xl-ht176cxc4013xla-pq208cxc4036xlahq208
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CLCC 84
Abstract: plcc20 socket HQFP-208 HW-137-DIP8 plcc 68 prom universal programmer XC9500 HW-130 XC1700 HW-133-PG144
Contextual Info: November 12, 1997 Version 1.2 HW-130 Programmer 9* HW-130 Programmer Device and Package Support Programming Socket Adapters • XC1700 Serial PROMs • XC9500 CPLDs • Supports all Xilinx package types • Programmer Accessories Supports all package styles: PLCC, PQFP, TQFP,
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hw-130xc1700xc9500hw-133-pc44+12hw-133-pq44hw-133-vq44hw-133-pc68hw-133-pc84hw-133-pq100clcc 84plcc20 sockethqfp-208hw-137-dip8plcc 68 promuniversal programmerhw-133-pg144
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ulc xc3030
Abstract: PQFP 176 Xilinx XC3090 altera EP300 EPM7128 Temic ulc xc3030 EPM7128 PLCC PLSI2032 Actel A1020 PLUS405
Contextual Info: ULC Reference Guide This reference guide lists most devices available for conversion. This list is not exhaustive, as new devices are added regularly. Additional devices not shown in this list may also be supported. Updated versions are available on the TEMIC web site. Check with factory if
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ulc/a1010ulc/a1020ulc xc3030pqfp 176+8xilinx xc3090altera ep300epm7128temic ulc xc3030epm7128 plccplsi2032actel a1020plus405
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d431000agw
Abstract: D75304GF AIC6360Q Actel a1280 intel 80386dx HG62G027 AIC-6360Q CL-SH260 L1A9349 5252 F 1002
Contextual Info: P o m o n a Electronics IC Test Clips Logic Scope Probe JEDEC PQFP Test Clips PomonaÕs JEDEC QFP test clips are designed to fit on surfacemounted plastic and ceramic JEDEC chips. Choose from four clip types specifically designed to give you optimum functionality and ease of use for testing, troubleshooting and
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abt16244act16245fct16223fct162511+10d431000agwd75304gfaic6360qactel a1280intel 80386dxhg62g027aic-6360qcl-sh260l1a93495252 f 1002
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MO-83-AF
Abstract: PQFP moisture sensitive handling and packaging footprint jedec MS-026 TQFP schematic impulse sealer BGA 11x11 junction to board thermal resistance EIA standards 481 JEDEC MS-026 footprint eftec 64 EFTEC-64 footprint jedec MS-026 TQFP 128
Contextual Info: Packages and Thermal Characteristics August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336
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xc7236axc7272axc7318xc7336+16xc7336qxc7354xc7372xc73108xc73144xc9536mo-83-afpqfp moisture sensitive handling and packagingfootprint jedec ms-026 tqfpschematic impulse sealerbga 11x11 junction to board thermal resistanceeia standards 481jedec ms-026 footprinteftec 64eftec-64footprint jedec ms-026 tqfp 128
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proteus
Abstract: XC4013E-PQ160C XC4013EPQ160 XC4013E-HQ208I "CHIP EXPRESS" pq208C xc4028exhq208c XC4013E-PQ208C XC4036EX-HQ240 XC4013E-PQ240
Contextual Info: FPGA Replacement for 5-Volt Xilinx Products Introduction Proteus is a Chip Express FPGA replacement program. In its initial release, Proteus is available as a 5-volt product family serving the needs of specific Xilinx 4000E/EX devices and a Proteus 3.3-volt
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4000e/ex4000xl/xla1-800-95chipxproteus+9xc4013e-pq160cxc4013epq160xc4013e-hq208ichip expresspq208cxc4028exhq208cxc4013e-pq208cxc4036ex-hq240xc4013e-pq240
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footprint jedec MS-026 TQFP 128
Abstract: schematic impulse sealer footprint jedec MS-026 TQFP JEDEC Package Code MS-026-AED BGA 11x11 junction to board thermal resistance QFP Package 128 lead .5mm .65mm bga land pattern MS-026-BGA Shipping Trays 16x16 XC4010E-PQ208
Contextual Info: Packages and Thermal Characteristics June 1, 1996 Version 1.1 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336
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xc7236axc7272axc7318xc7336+16xc7336qxc7354xc7372xc73108xc73144xc9536footprint jedec ms-026 tqfp 128schematic impulse sealerfootprint jedec ms-026 tqfpjedec package code ms-026-aedbga 11x11 junction to board thermal resistanceqfp package 128 lead .5mm65mm bga land patternms-026-bgashipping trays 16x16xc4010e-pq208
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PCB footprint cqfp 132
Abstract: schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318
Contextual Info: Packages and Thermal Characteristics August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336
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xc7236axc7272axc7318xc7336+14xc7336qxc7354xc7372xc73108xc73144xc9536pcb footprint cqfp 132schematic impulse sealerxc4010e-pq208footprint pga 84tsop 54 pin footprint 14mm x 20 mm65mm bga land patternqfp package thermal resistance die downxc4013e-pq240
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XC9500 pinout
Abstract: AC24-AC25 Fuse n25 xilinx xc9536 XC9500 XC95108 XC95144 XC95216 XC95288 XC9536
Contextual Info: XILINX PROGRAMMER QUALIFICATION SPECIFICATION XC9500 FAMILY Introduction Signature String The device programming and verification procedures are similar to those used with standard FLASH EPROM memories. Initially, and after each erasure, all cells in the device
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xc9500xc9500 pinoutac24-ac25fuse n25+6xilinx xc9536xc95108xc95144xc95216xc95288xc9536
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XC2064
Abstract: XC3030A xc3142 PP175 Xilinx XC3090 xc2064 fpga xact xc3090 XC3190 Xilinx XC3090A X04008
Contextual Info: Component Availability Pins 44 Type Plastic PLCC Plastic DIP Plastic VQFP Plastic PLCC Ceramic PGA Plastic PLCC Ceramic PGA Plastic PQFP Plastic TQFP Code PC44 PD48 VQ64 PC 68 PG68 PC84 PG84 PQ100 TQ100 ✓ ✓ ✓ ✓ ✓ ✓ XC2064 48 64 68 XC2O10 ✓ ✓
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xc2064xc2o10xc2064lxc2o10l+15xc3020xc3030xc3042xc3064xc3090xc3020axc3030axc3142pp175xilinx xc3090xc2064 fpgaxact xc3090xc3190xilinx xc3090ax04008
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XC95288XL evaluation board schematic
Abstract: 34992 xilinx xc9536 digital clock 104x156 542k XC95288XL evaluation board XC95288XL pinout missile guidance XC95144XL prom XC9536
Contextual Info: An Introduction to Xilinx Products R February 15, 2000 1* About Xilinx Xilinx is the leading provider of complete programmable logic solutions. The company’s products help minimize risks for manufacturers of electronic equipment by shortening the time required to develop products and take them to
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xcr5032cpz5032cxcr3384xlxcr5064c+15pz5064cxcr5128cpz5128cxcr3032xlxcr3064xlxc95288xl evaluation board schematic34992xilinx xc9536 digital clock104x156542kxc95288xl evaluation boardxc95288xl pinoutmissile guidancexc95144xl promxc9536
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HW-137-DIP8
Abstract: soic-20 XCN07022 XCR3000XL HW-133-PC44 HW-130-J HW-137-PC44/VQ44 XC18V00 XC7200 HW-130
Contextual Info: R HW-130 Programmer DS019 v1.9 February 8, 2008 Product Specification This product is undergoing discontinuance. Please refer to XCN07022, Product Discontinuation Notice, for more information on last-time purchases and replacement products. Device and Package Support
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hw-130ds019xcn07022xc1700/xc17s00/xl+10xc17v00/xc17s00axc18v00xc9500/xl/xvxcr3000xlhw-137-dip8soic-20hw-133-pc44hw-130-jhw-137-pc44/vq44xc7200
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XC3020A
Abstract: XC3020L XC3030A XC3030L XC3042A XC3042L XC3064A XC3064L XC3090A XC3090L
Contextual Info: 44 48 64 68 84 100 120 132 144 156 160 164 24 175 176 184 191 196 208 223 225 228 240 299 304 352 411 432 475 560 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA
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tq144pg144pg156pq160+16cq164cb164pp175pg175tq176pg184xc3020axc3020lxc3030axc3030lxc3042axc3042lxc3064axc3064lxc3090axc3090l
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XCR3000XL
Abstract: vqfp 44 HW-137-DIP8 HQFP HW-133-BG256 HW-136-VQ100 vqfp44 HW-137-PC44/VQ44 HW-136-CS144 xc17v00
Contextual Info: HW-130 Programmer R DS019 v1.8 May 25, 2007 Product Specification Device and Package Support Programmer Functional Specifications • XC1700/XC17S00/XL Serial PROMs • Device programming, erasing, and verification • XC17V00/XC17S00A Serial PROMs • CPLD security control
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hw-130ds019xc1700/xc17s00/xlxc17v00/xc17s00a+15xc18v00xc9500/xl/xvxcr3000xlxc7200/7300xc9500/xlxc1800vqfp 44hw-137-dip8hqfphw-133-bg256hw-136-vq100vqfp44hw-137-pc44/vq44hw-136-cs144xc17v00
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XCF00S
Abstract: automotive ecu automotive ecu circuit LVDSEXT-25 AEC-Q100 TS16949 VQG100 LVDSEXT25 BLVDS-25
Contextual Info: 06 Spartan-3 Automotive XA FPGA Family: Introduction and Ordering R DS314-1 v1.0 October 18, 2004 Advance Product Specification Introduction The Xilinx Automotive (XA) Spartan -3 family of Field-Programmable Gate Arrays is specifically designed to meet the
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ds314-1aec-q100ds099-1ds099-2+10ds099-3ds099-4xcf00sautomotive ecuautomotive ecu circuitlvdsext-25ts16949vqg100lvdsext25blvds-25
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XC3020A
Abstract: XC3020L XC3030A XC3030L XC3042A XC3042L XC3064A XC3064L XC3090A XC3090L
Contextual Info: 48 64 68 84 100 120 132 144 156 160 164 38 175 176 184 191 196 208 223 225 228 240 299 304 352 411 432 499 596 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA
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xc8100xc3020axc3020lxc3030a+7xc3030lxc3042axc3042lxc3064axc3064lxc3090axc3090l
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304 MQFP
Abstract: MQ240 XC3030A
Contextual Info: 44 48 64 68 84 100 120 132 144 156 160 164 24 175 176 184 191 196 208 223 225 228 240 299 304 352 411 432 475 560 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA
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Contextual Info: Spartan-XL 3.3V FPGA Automotive IQ Family: Introduction and Ordering R DS107-1 v1.2 April 29, 2003 Advance Product Specification Introduction The Spartan -XL 3.3V FPGA Automotive IQ product family is a high-volume production FPGA solution that delivers all
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ds107-1xcs05xlvq100100-pin+6xcs10xltq144xcs20xlpq208208-pinxcs30xl
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HW-137-DIP8
Abstract: XC1800 HW-130-J plcc20 socket PLCC44 socket Programmer HW-130 XC18V00 HW-130 XC1700 HW-130 Programmer
Contextual Info: ds019_1_6.fm Page 1 Tuesday, April 8, 2003 4:07 PM R HW-130 Programmer DS019 v1.6 April 8, 2003 Product Specification Device and Package Support Programmer Functional Specifications • • • • • • • • • • • • XC1700 Serial PROMs XC18V00 ISP PROMs
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hw-130ds019xc1700xc18v00+9xc9500/xlxc7200/7300xc1800hw-137-dip8hw-130-jplcc20 socketplcc44 socketprogrammer hw-130hw-130 programmer
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Contextual Info: Spartan-XL 3.3V FPGA Automotive IQ Family: Introduction and Ordering R DS107-1 v1.3 June 14, 2004 Product Specification Introduction The Spartan -XL 3.3V FPGA Automotive IQ product family is a high-volume production FPGA solution that delivers all the key requirements for ASIC replacement up to 40,000
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ds107-1vq100100-pinxcs10xl+6tq144xcs20xlpq208208-pinxcs30xl144-pin
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