XQFN Search Results

Contextual Info: SOT1049-3 XQFN10 U ; Reel pack; SMD, 7" Q1/T1 Standard product orientation Orderable part number ending ,115 or X Ordering code (12NC) ending 115 Rev. 1 — 23 April 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape QA Seal

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of XQFN12 package SOT1174-1 2.25 2 0.45 0.22 CU 11x 0.32 CU (1×) 0.45 (1×) 2.55 1 CU 2.05 2.3 CU 0.4 (7×) 1 CU placement area solder land plus solder paste solder land solder resist, 0.0625 around copper

Contextual Info: Package outline XQFN12: plastic, extremely thin quad flat package; no leads; 12 terminals; body 1.70 x 2.00 x 0.50 mm SOT1174-1 X B D A terminal 1 index area E A A1 A3 detail X ∅v ∅w b 5 C C A B C y1 C y 7 e1 e 1 11 terminal 1 index area L1 L 1 2 mm scale

Contextual Info: Package outline XQFN8: plastic, extremely thin quad flat package; no leads; 8 terminals; body 1.4 x 1.2 x 0.5 mm B D SOT1309-1 A A E A1 A3 terminal 1 index area detail X e1 C A B C v w b terminal 1 index area C y y1 C e 2 4 L 1 5 b 8 L1 6 X 3 mm scale Dimensions

Contextual Info: XQ FN 8 SOT902-2 XQFN8 U ; Reel pack, reverse; SMD, 7" Q3/T4 Standard product orientation Orderable part number ending ,125 or H Ordering code (12NC) ending 125 Rev. 1 — 2 May 2013 Packing information 1. Packing method Printed plano box Barcode label Reel

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of XQFN10 package SOT1049-3 Hx Gx pa + oa 2.000 P 0.500 D 9x 0.0125 0.0125 Hy Gy pa + oa By Ay Bx D1 Ax solder land solder paste deposit solder land plus solder paste occupied area solder resist

Contextual Info: Package outline XQFN8: plastic, extremely thin quad flat package; no leads; 8 terminals; body 1.6 x 1.6 x 0.5 mm SOT902-3 X D A B terminal 1 index area A E A1 detail X e e v w L 4 3 5 2 6 1 7 C C A B C y1 C y b e1 e1 terminal 1 index area 8 metal area not for soldering

Contextual Info: Package outline XQFN8U: plastic extremely thin quad flat package; no leads; 8 terminals; UTLP based; body 1.6 x 1.6 x 0.5 mm B D SOT902-1 A terminal 1 index area E A A1 detail X L1 e e C L y1 C ∅v M C A B ∅w M C 4 y 5 3 metal area not for soldering e1

Contextual Info: Package outline XQFN8: plastic, extremely thin quad flat package; no leads; 8 terminals; body 1.6 x 1.6 x 0.5 mm SOT1193-1 X A B D terminal 1 index area E A A1 detail X e ∅v ∅w b 4 3 C C A B C y y1 C 5 e1 2 6 1 7 terminal 1 index area 8 L metal area not for soldering

Contextual Info: Package outline XQFN10: plastic extremely thin small outline package; no leads; 10 terminals; body 1.3 x 1.6 x 0.5 mm B D SOT1337-1 A A terminal 1 index area A1 A3 E detail X e1 C v w b 3 5 C A B C y1 C y L 2 6 1 7 e k terminal 1 index area 10 8 X L1 L2 1

Contextual Info: XQ FN 8U SOT902-1 XQFN8 U ; Reel pack, reverse; SMD, 7" Q3/T4 Standard product orientation Orderable part number ending ,125 or H Ordering code (12NC) ending 125 Rev. 5 — 2 May 2013 Packing information 1. Packing method Printed plano box Barcode label Reel

Contextual Info: Package outline XQFN8: plastic, extremely thin quad flat package; no leads; 8 terminals; body 1.6 x 1.6 x 0.5 mm SOT1193-2 X A B D terminal 1 index area E A A1 detail X e ∅v ∅w b 4 3 C C A B C y y1 C 5 e1 2 6 1 7 terminal 1 index area 8 L L1 1 Dimensions

Contextual Info: SST12LF09 2.4 GHz High-Gain, High-Efficiency Front-end Module FEATURES APPLICATIONS • Input/output ports internally matched to 50Ω and DC decoupled • Package available - 16-contact XQFN – 2.5mm x 2.5mmx 0.4mm • All non-Pb lead-free devices are RoHS compliant

Contextual Info: Package outline XQFN16: plastic, extremely thin quad flat package; no leads; 16 terminals; body 1.80 x 2.60 x 0.50 mm SOT1161-1 X A B D terminal 1 index area E A A1 A3 detail X e1 e 5 8 C C A B C v w b y1 C y L 4 9 e e2 1 12 terminal 1 index area 16 L1 13

hx 002

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of XQFN10 package SOT1337-1 Hx Gx Fx P P 0.05 K 0.02 J D 10x 0.05 0.02 C (6×) Hy Gy Fy P J C1 By Ey Bx1 Bx C2 (3×) Ax Ex occupied area solder resist solder lands solder paste DIMENSIONS in mm

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of XQFN8 package SOT902-3 Hx D 8x 0.025 0.025 C (7×) Hy Ay 1.000 SLy 0.110 0.320 SLx 1.200 solder land solder paste deposit solder land plus solder paste occupied area DIMENSIONS in mm

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of XQFN10 package SOT1160-1 1.95 1.7 CU 1.25 0.45 0.4 6x 0.22 CU (10×) 2.35 1 CU 0.85 2.1 CU 0.5 CU 0.6 CU placement area solder land plus solder paste solder land solder resist, 0.0625 around copper

Contextual Info: PC board footprint NXP Semiconductors Footprint for reflow soldering of XQFN8 package SOT902-1 1.900 0.450 8x 0.400 (8×) 0.220 (7×) 0.270 (8×) 1.000 1.900 1.200 0.500 0.110 0.320 0.500 1.200 solder lands clearance solder paste placement plus occupied area

Contextual Info: Package outline XQFN10U: plastic extremely thin quad flat package; no leads; 10 terminals; UTLP based; body 2 x 1.55 x 0.5 mm A B D SOT1049-1 terminal 1 index area E A A1 detail X e2 L C L1 e v w 5 4 M M y y1 C C A B C 6 e1 b 3 7 e3 1/2 e1 2 8 1 9 terminal 1

XQFN16

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of XQFN16 package SOT1161-1 2.35 2.1 CU 1.65 0.4 12x 0.45 0.22 CU (16×) 3.15 1.8 CU 1.65 2.9 CU 0.9 CU 1 CU placement area solder land plus solder paste solder land solder resist, 0.0625 around copper

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of XQFN8 package SOT902-2 Hx D 8x 0.025 0.025 C (7×) Hy Ay 1.000 SLy 0.110 0.320 SLx 1.200 solder land solder paste deposit solder land plus solder paste occupied area DIMENSIONS in mm

XQFN-10

Contextual Info: Package outline XQFN10: plastic, extremely thin quad flat package; no leads; 10 terminals; body 1.55 x 2.00 x 0.50 mm SOT1191-1 X A B D terminal 1 index area E A A1 c detail X ∅v ∅w b 5 C C A B C y1 C y 6 4 e1 e 9 b1 1 10 terminal 1 index area L1 L 1 Dimensions

nz104

Contextual Info: 74LVC2G66 Bilateral switch Rev. 7 — 22 June 2012 Product data sheet 1. General description The 74LVC2G66 is a low-power, low-voltage, high-speed Si-gate CMOS device. The 74LVC2G66 provides two single pole, single-throw analog switch functions. Each switch has two input/output terminals nY and nZ and an active HIGH enable input (nE).

tea1719

Abstract: PH1930 nds 3 video guard smart card OPTOCOUPLER SMPS for HDD ph1930al PH2530AL ip4223 SMD 8A TRANSISTOR 702 transistor smd code PH6030AL
Contextual Info: Application Guide Notebook Computing Introduction Your partner for notebook computing Designing notebooks isn’t getting any easier. The footprint continues to shrink, and consumers continue to demand more features, faster speeds, on our decades-long leadership in high-performance mixed-signal solutions,