DSASW0048256.pdf

Partial File Text Development of BGA Solution for the IBM PowerPC 970 Module in Apple's Power Mac G5 Presented at ECTC 2004 David Edwards*, Hope Chambers**, Mukta Farooq*, Lewis Goldmann*, Amir Salehi** *IBM Microel
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BGA heatsink compressive force BGA Solder Ball compressive force bga thermal cycling reliability MULTIPLE EFFECT EVAPORATOR original Coffin-Manson Equation PowerPC 970 reflow temperature bga underfill underfill SMT