A symmetrical layout with a solid ground plane and minimal signal trace length is recommended to minimize electromagnetic interference (EMI) and ensure optimal performance.
Ensure that the component is operated within its specified temperature range (-40°C to 125°C) and follow proper derating guidelines for high-temperature applications. Additionally, consider using a thermal interface material to improve heat dissipation.
The maximum allowable voltage stress for the 0816-1X1T-23-F is 150% of the rated voltage for a maximum of 10 seconds. Exceeding this limit may cause permanent damage to the component.
Yes, the 0816-1X1T-23-F is designed to withstand vibrations up to 10G. However, it's essential to ensure that the component is properly secured to the PCB and that the PCB is designed to withstand the vibration levels.
A soldering profile with a peak temperature of 260°C and a dwell time of 10-15 seconds is recommended. Ensure that the component is not exposed to temperatures above 260°C for an extended period.
0816-1X1T-23-F datasheet
by Bel Fuse
