DSAH0048538.pdf by Abracon

Partial File Text GHz SURFACE-MOUNT MULTI-LAYER CHIP BEADS ACML 0603G, 0603GF | | | | | | | | | | | | | | | FEATURES: · Multi-layer construction · EMI/RFI suppression · Up to GHz application STANDARD SPECIFICATION
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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